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Henkel's APEX Presence Brings High Reliability and High Performance to the Fore

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Henkel Corporation

32100 Stephenson Hwy., Madison Heights, MI, 48071, USA

Original Press Release

Henkel's APEX Presence Brings High Reliability and High Performance to the Fore

Press release date: March 11, 2014

Broad Range of Solder and Protection Materials to be Demonstrated During Three-Day Event

At the annual APEX event, set to take place March 25-27 in Las Vegas, Nevada, show delegates will have the opportunity to learn more about the innovation that has resulted in several new high-reliability, high-performance materials from The Electronics Group of Henkel.  Spanning a wide range of material types and applications, Henkel will showcase the latest in halogen-free solder materials for automotive applications, extremely protective underfill and encapsulant materials and market-leading low-pressure molding formulations.

From booth #1619, Henkel materials specialists look forward to demonstrating how halogen-free and high-reliability solder materials are not mutually exclusive.  In fact, combining Henkel's halogen-free flux formulation, LOCTITE MULTICORE HF 212, with its groundbreaking 90iSC high-reliability lead-free alloy yields a high-performance, halogen-free solder system that is enabling even the most demanding automotive applications. Temperature extremes that can occur in automotive environments are often too great for common SAC alloys to manage.  Henkel's 90iSC was developed specifically to address these challenges.  The alloy has a melting point equivalent to standard SAC alloys and is capable of operating at temperatures up to 150°C, delivering a high temperature-compatible solution for automotive device manufacturers.    When combined with a robust flux medium like LOCTITE MULTICORE HF 212 – arguably what underpins any successful solder material – the results of 90iSC are even more impressive.

"High performance and reliability drive Henkel's materials development," says Doug Dixon, Global Marketing Director for The Electronics Group of Henkel. "Devices are only getting smaller and more complex and are increasingly – particularly in the case of automotive applications – subjected to greater environmental stresses.  Henkel materials give electronics specialists the confidence that the devices will work in-the-field and under extreme conditions."

Laura Sims
for Henkel Electronic Materials
(p) 770-829-4757
(m) 404-661-0348
(e) laura@simscomm.com
www.simscomm.com


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