Editors' Choice Best Product Award Presented to Kulicke & Soffa |
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Kulicke & Soffa Industries, Inc.
2101-T Blair Mill Rd.
Willow Grove, PA, 19090
USA
Press release date: July 7, 2006
WILLOW GROVE, PA, July 7, 2006 - In developing a product that is truly making a difference in semiconductor manufacturing, Kulicke & Soffa Industries received the prestigious Editors' Choice Best Product Award, presented annually by Semiconductor International magazine, for its Maxum Ultra Wire Bonder. In a ceremony to be conducted on July 12 in San Francisco, Semiconductor International will announce 20 winners whose products are making a difference in semiconductor manufacturing. Engineered for higher productivity, the Maxum Ultra is capable of processing today's most complex packaging applications including stacked die, multi-tier packages, low-k dielectric materials and ultra-fine pitch and long/low shapes. Incorporating numerous technology advancements, this high-performance wire bonder processes devices 10% faster than its predecessor - the industry-leading Maxumplus(TM) - as well as market competition. Engineered for customers who want greater throughput and finer pitch down to 35 microns, the wire bonder offers bond placement accuracy of + 2.5 µm accuracy at 3 sigma. Wire cycle time is 60 msec for a standard loop, based on 2.5 mm wire length, 0.25 mm loop height and 10 msec first and second bond times.
"The Maxum ultra provides a real performance advantage over other wire bonding technologies, " states Christian Rheault, K&S Vice President, IC Ball Bonders. "Its many technological advancements make it the only choice for today's complex packaging applications."
"Advances in semiconductor technology are only possible because of the kinds of products being honored in this year's Editors' Choice Best Product Awards program," said Pete Singer, Editor-in-Chief of Semiconductor International. "Chipmakers rely on these products to create electronics that are smarter, smaller, faster, less expensive and more reliable. We congratulate the people and the companies that have had the insight and fortitude to bring these products to the market."
Semiconductor International, published by Reed Business Information and a part of Reed Elsevier's global array of information products, is the leading technical publication reaching and covering the global semiconductor manufacturing industry. SI boasts the industry's most experienced full-time technical editorial team, and has the largest circulation to semiconductor manufacturers of any industry publication. Additional information about SI and its many products and activities are available at www.semiconductor.net. For more information on the Maxum Ultra Wire Bonder, visit the K&S web site at: http://www.kns.com/Templates/ShowPage.asp?TMID=108&FID=123&PID=4944
About K&S
Kulicke & Soffa (NASDAQ: KLIC) is the world's leading supplier of semiconductor wire bonding assembly equipment. We believe K&S is the only major supplier to the semiconductor assembly industry that provides customers with assembly equipment along with the complementing packaging materials that contact the surface of the customer's semiconductor devices. The ability to provide these critical assembly related products is unique to Kulicke & Soffa and allows us to develop system solutions to the new technology challenges inherent in assembling and packaging next-generation semiconductor devices. Kulicke & Soffa's web site address is http://www.kns.com.
Kulicke & Soffa Industries Inc. 1005 Virginia Drive Fort Washington, PA 19034 USA
215-784-6000 phone 215-659-7588 fax www.kns.com
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