Dr. Ning-Cheng Lee to Emphasize Reliability at Intel Lead-Free Symposium
Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will emphasize reliability in a presentation to be delivered at the Intel Lead-Free Symposium in Scottsdale, Arizona on March 15-16, 2006.
Dr. Lee's presentation will depict a supplier's perspective on the role of flux/paste on the impact and challenges for the next generation flux/paste in drop-critical applications. This topic focuses on:
o Flux/Paste formulation directions
o Expected challenges
o Assembly implications/challenges
o Integration implications/challenges with the shift to using lead-free fluxes
Dr. Lee, a world-renown soldering expert and SMTA Member of Distinction, has extensive experience in the development of high-temperature polymers, encapsulates for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost ownership.
Indium Corporation is a three-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
For more information about Indium Corporation visit www.indium.com or email askus@indium.com.
For more information about Zycus and its solutions
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Zycus Inc.
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sandip.maiti@zycus.com
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