(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Epoxies Etc.
21 Starline Way
Cranston, RI, 02921-3407
USA
Press release date: November 4, 2011
Epoxies, Etc. Develops Low Density Epoxy...
20-3035 Epoxy Syntactic Foam System
The weight of 20-3035 is less than half of most commercially available potting and encapsulating compounds. This epoxy syntactic foam system utilizes technologically advanced micro balloons. This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product.
This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. The option of selecting from three different curing agents allows end users to customize the physical properties they require.
Key Features: Low Density Excellent electrical insulation Low shrinkage Low CTE (coefficient of thermal expansion) Excellent water resistance
Samples are available and may be requested from our website: www.epoxies.com
|
|
|
|
|
|
|
|
|
|
|
