IPC APEX EXPO 2011 focuses on design innovations, best practices.
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Press Release Summary:
IPC APEX EXPO 2011, held in Las Vegas, NV from April 10-14, will host IPC Designers Forum as well as several design-focused educational programs and activities which will provide information on design innovations and best practices. Also offered, IPC PCB designer and advanced designer certification programs (CID and CID+) will be scheduled as 2-day workshops (April 8-9) with final exam on April 10. Variety of presenters will be in attendance.
Original Press Release:
Design Innovations and Best Practices Featured at IPC APEX EXPO 2011
BANNOCKBURN, Ill., USA - Providing the latest information on design innovations and best practices, the IPC Designers Forum and several design-focused educational programs and activities will be held at IPC APEX EXPO 2011, April 10-14, 2011, in Las Vegas.
"Today's technologies and electronics have pushed PCB design into a whole new realm," says Dieter Bergman, IPC director of technology transfer, "A designer in today's environment must first, know all his or her choices in materials, processes, requirements, quality and parts; and second, understand how, in combination, those choices impact the final design's performance and reliability."
Bergman will kick off the IPC Designers Forum on Monday, April 11, with a discussion on the future of design. Other design experts who will present at the half-day program include: Charles Pfeil, Mentor Graphics, on Effective BGA Fanouts; Mike Tucker, CIT, Colonial Circuits, with A Look At CAM Departments and Board Fabrication Basics; Alan Johnson, CID+, Premier EDA Solutions (UK), on International Design; Gary Ferrari, CID+, FTG Circuits, discussing Design Standards; Happy Holden, Foxconn; presenting Advances in HDI Technology to Promote Design Innovations and Lower Costs; and Rick Hartley, CID, L-3 Avionics Systems, Inc., on Balancing Quality and Cost.
In addition to the IPC Designers Forum, several professional development courses held April 10-11 and 14, focus on meeting the informational needs of today's designers. Courses include:
PD-01 Building Long-Term Reliability in PCBs: Materials, Plating Processes and Innerlayer Treatments for Lead-Free Assembly Requirements
PD-07 PCB Fabrication Basics: Process and Specification
PD-08 Design for Manufacturing
PD-10 Final Finishes - Compatibility with Lead-Free Assembly
PD-11 Designing with Flex in Mind: Next Generation
PD-14 Signal Integrity Problem Prevention: High-Speed Routing & Termination
PD-21 Basics of PCB Design
PD-36 Control of EMI Coupling Mechanisms
PD-39 Design and Assembly Challenges of Ball Grid Arrays (BGAs) and Bottom Terminations Components (BTCs) in a Lead-Free World
PD-41 Designing PCB Stackups to Balance Signal Integrity Against Manufacturability
PD-43 Designing Complex Boards
PD-50 Flexible and Rigid-Flex Circuit Design Principles and Fabrication
IPC PCB designer and advanced designer certification programs (CID and CID+) will also be held during IPC APEX EXPO. The two-day workshops will be held on April 8-9 with the final exam being given on April 10.
To view all design-related programs to be held at IPC APEX EXPO, visit http://www.IPCAPEXEXPO.org/design.
For more information or to register for the IPC Designers Forum or IPC professional development courses, visit www.IPCAPEXEXPO.org/register. To register for the designer certification programs, visit http://www.ipc.org/designer-certification.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
