DKN Research Group Develops New Embedded Components Technologies |
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DKN Research
62 Adam St
Haverhill, MA, 01830
USA
Press release date: April 1, 2009
DKN Research, a premier research and engineering firm specializing in printable electronics and NY Industries, a leading flexible circuit manufacturer from Ohtsu Japan have co-developed a new embedded passive technology built on thin multi-layer thick film flexible substrates. This new embedded passive technology could prove to be valuable in the construction of Printable Flexible Electronics.
The Printable Electronics market is booming, and researchers from private companies, institutes, and universities continue to envision new applications with unique designs and materials. One obstacle faced by design engineers is building electronic components on organic substrates.
DKN Research and NY Industries offer a total Advanced Screen Printing (ASP) process package to build flexible electronics. Thick film circuits will be the basic technology for printable flexible electronics. The advanced printing process provides fine patterns for not only conductor materials, but also dielectric and other functional materials in a few simple steps.
The thick film circuit process can build thin passive components, resistors, capacitors and inductors on substrates using a few combinations of a screen-printing process. However, traditional thick film circuits have several limitations when building thin passive components due to low material performances and moderate capabilities from the printing processes.
There is a new thick film circuit system now available for embedded passive technologies with thin multi-layer flexible circuits. The new ASP (Advanced Screen Printing) process available from DKN Research and NY Industries uses a specially formed printable ink on heat resistant substrates (polyimide and PEN). The circuit system is available for single side, double, and multilayer circuits with various types of via holes. The APS process provides a range between 10 and 100 Mega ohms for printed resistors with a plus / minus accuracy of 10%. Printed capacitors are available for up to 5 nano Farads in a 50 square mm space. Over 100 turns of printed inductors are available with four layer thick film flexible circuits.
Several trials conducted using the ASP process to build embedded passive components showed a broad range capability in generating unique sensor modules on multi-layer flexible substrates.
Mr. Dominique Numakura, the managing director of DKN Research will provide detailed information about the new embedded passive technologies April 22nd at the IPC International Conference on Flexible Circuits held in Minneapolis. Trial samples will be provided for the audience during the technical session.
DKN Research provides engineering and consulting services to assist in the design and application process with the new advanced thick film flexible circuits. They will also provide free consulting from its Massachusetts office to circuit designers and manufactures who want to construct printable electronics.
DKN Research Group will accept trial requests ranging from simple printing to finished circuits that include solder masks and routing. Free quotes are available before the trials. Contact DKN Research for samples of a multilayer flexible circuit with embedded passives made by a screen-printing process. Design guides and technical data for printable electronics are available by request.
For more information contact John Rufiange, vice president of marketing of DKN Research at johnrufiange@DKNresearch.com.
About DKN Research
DKN Research is a global leader in the micro electronics and packaging industry. They developed and commercialized many advanced packaging technologies and circuit technologies, specializing in thin flexible substrates. For detailed information, please visit our web site, www.dknresearch.com.
About NY Industries
NY Industries is a leading flexible circuit manufacturer in Ohtsu Japan, with more than thirty years experience in fine flexible circuit production. They are well known for developing a broad range of screen-printing processes for printable flexible electronics. For detailed information, please see its web site, www.ny1.co.jp.
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