DEK's Revolutionary New Closed Loop Innovation, ProDEK, Takes Center Stage at SMT Hybrid Packaging
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Press release date: June 11, 2012
DEK, the world's leading provider of screen printing equipment and processes for diverse industries, gave center stage to its revolutionary new closed loop innovation, ProDEK, at SMT Hybrid Packaging 2012 in Nuremberg, Germany last month.
Showcased for the first time in Europe, ProDEK utilizes intuitive software and barcode readers alongside solder paste inspection (SPI) technology to align and compare printed and inspected boards, thus ensuring continuous offset adjustments in real-time. The system also automatically regulates cleaning frequency, thereby optimizing process stability and lowering costs through reduced use of consumables. As proven in the field, ProDEK improves throughput and yield and dramatically reduces defects.
"SMT Hybrid Packaging delegates were intrigued by ProDEK's ability to enhance printer intuition and intelligence," said Stefan Techau, General Manager Electronics Assembly for Europe at DEK. "This system incorporates process reference capability which integrates with the SPI platform to deliver process-specific cleaning frequency rates and print alignment precision."
At the show, DEK also showcased its total optimized solution with the combination of Nano-ProTek, a breakthrough stencil coating technology that delivers high performance stencils in a cost-effective wipe, SMT Under-Stencil Cleaning Fabric Roll and water-based chemistry, Pro XF. With the total optimized solution, the cleaning process is minimized, yet fast and effective when needed, reducing the total cost of ownership.
DEK's productivity tools, which are designed to further extend the capabilities of even the most advanced technologies, were also on the stand, including ProActiv, HawkEye Bridging, ProFlow ATx and Over Top Snuggers.
DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at www.dek.com.
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