IPC ESTC to include 8 professional development courses.
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Press Release Summary:
On May 20-21 and May 23, 2013, IPC ESTC will feature 8 educational courses examining packaging, materials, design, and assembly considerations in electronics, from bare board to end-product. Courses will take systems approach to sustainable and cradle-to-grave product lifecycles. Examples include: Advanced Packaging; Soldering Technology for Electronics Assembly: Achieving High Yields and Reliability; Simulation Based Reliability Assessment; and PCB Fabrication Basics.
Original Press Release:
Courses at IPC ESTC to Explore Advanced Technology, Reliability and Product Performance
Systems Approach to Product Realization Emphasized
BANNOCKBURN, Ill., USA, — IPC ESTC will feature eight professional development courses examining packaging, materials, design and assembly considerations in electronics, from bare board to end-product, May 20–21 and May 23, 2013, at The New Tropicana in Las Vegas.
“In keeping with the vision of IPC ESTC, the educational courses will take a systems approach to sustainable and cradle-to-grave product lifecycles,” says Dave Torp, vice president of standards and technology. “Every phase in the product development process is interdependent requiring a baseline of known quality assurance to be carried onto the next phase. The product realization for high-performance, high-reliability depends on all phases to integrate flawlessly.”
Courses will be taught by knowledgeable experts with practical experience. Ravindranath Mahajan, Ph.D., and Bob Sankman, both of Intel Corporation, will cover “Advanced Packaging”; Timothy Jensen of Indium Corporation will present “Soldering Technology for Electronics Assembly: Achieving High Yields & Reliability”; Michael Osterman, Ph.D., CALCE-University of Maryland, will cover “Simulation Based Reliability Assessment”; Jim Vanden Hogen and Don Schmieder, both of Plexus Corp., will present “PCB Fabrication Basics”; and Happy Holden, Gentex Corporation, will present “Extreme High Density: Designing for Maximum Performance and Minimum Costs.”
Thanks to the support of sponsors, free courses will be presented on: “Design for Reliability (DfR)” by Michael Silverman, sponsored by Ops A La Carte; “DDR3 Interface Design,” sponsored by Cadence Design Systems; and “Simulation Driven Product Design: Leveraging 3-D Multiphysics Analysis,” sponsored by Ansys.
Complete course descriptions are available at www.ipc.org/ESTC-courses.
In addition to the professional development courses, IPC ESTC will offer eight keynote presentations; a robust technical conference; an exhibition; networking receptions; luncheons; and standards development meetings.
IPC ESTC is a new event that targets the entire electronics industry — from product design and analyses through component packaging and printed board assembly to complete systems — to create a new framework for technology interchange and innovation.
More information about IPC ESTC is available at www.ipc.org/ESTC. For registration options, visit www.ipc.org/ESTC-register. Access to the exhibit hall is free to pre-registrants, a savings of $25. Individuals who register by April 26 can save $100 on the conference.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Suzhou, Chengdu and Beijing, China.
