Conference highlights steps of electronic product manufacturing.January 26, 2011 -
Design, assembly, soldering, repair, rework, inspection, and material choices are all variables to be juggled as electronics manufacturers work with new component types, high speed signals, and lead-free technology. To assist manufacturers in making the best choices for producing reliable electronics, IPC is holding the IPC Conference on Quality, Reliability, and Acceptability for Electronics Manufacturing in Budapest, Hungary, on Feb 22-24, 2011.
IPC International Conference in Budapest Highlights Process Steps for Manufacturing Quality Electronic Products
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IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: January 20, 2011
Event Features Tabletop Exhibits, Workshops and Technical Conference
BANNOCKBURN, Ill., USA, - Design, assembly, soldering, repair, rework, inspection, and materials choice are all variables to be juggled as electronics manufacturers worldwide work with new component types, high speed signals and lead-free technology. To assist them in making the best choices for producing reliable electronics, IPC - Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22-24 February 2011.
Cosponsored by the National Electronics Society of Hungary, the event offers workshops, a two-day conference and tabletop exhibits. Conference papers will be presented by individuals with specific expertise in:
o Critical Process Steps in Screen Printing
o The Effect of Moisture Levels in Laminates During Lead-Free Processing
o Micro-alloying Effects in Soldering Applications
o Detection of Defects after Soldering by using Ultra Sound (SAM)
o Technological Advances in X-Ray Inspection
o The Use of Modern Automated Optical Systems in the Detection of Solder Defects
o 3-D Inspection Technology: 3-D Solder Paste Inspection, Print Process Optimization and 3-D AOI Technology
o Integrating Cleaning Equipment and Cleaning Agent for Maximum Performance
o Preventing Moisture in PCBs, Assemblies and Components
o The Rush to Clean No-Clean: Conductive Crystals, White Residues and Decreased Reliability
o THB and Bono Tests: Solder Paste Residue Corrosivity Assessments
o State of the Hungarian Electronics Industry
o The Importance of IPC Standards in Quality and Reliability
"The people responsible today at EMS and OEM companies need to produce perfect solder joints with a defect rate close to zero, at a cost of almost nothing," comments Lars Wallin, IPC European representative. "This is a complicated situation, where solutions need to be shared by experts, practitioners and suppliers. IPC is one of the most qualified organizations to bring together different parts of the supply chain to talk to each other."
Preceding the conference, half-day workshops will be held on 22 February by electronics manufacturing experts Bob Willis, AskBobWillis.com; Lars-Gunnar Klang, LGKC; and Lars Wallin. Workshop topics include the use of IPC standards in the manufacturing process, conformal coating applications, properties of lead-free alloys and land grid array/quad flat no-lead design and assembly.
For more information on IPC Conference on Quality, Reliability & Acceptability for Electronics Manufacturing in Budapest or to register, visit www.ipc.org/Budapest-Conference.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.85 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.