Conference explores potential of flexible circuit technology.
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Press Release Summary:
Scheduled for June 12-14, IPC Flexible Circuits Conference will provide practical information on range of technical topics, along with business outlook for sector. Event will include basic-level and advanced-level workshops; keynote titled "The Future of Flexible Circuits Technology;" and discussions addressing challenges of technical marketing, flex vs. PCBs, as well as design, fabrication, and electrical analysis of high-speed flex. Special conference will spotlight technology's potential.
Original Press Release:
IPC Conference Explores Potential of Flexible Circuit Technology
BANNOCKBURN, Ill., USA, - Flexible circuit technology is utilized in all market sectors, including military, telecommunications, medical and consumer products. To explore the potential of this technology, IPC - Association Connecting Electronics Industries® will hold the IPC Flexible Circuits Conference, June 12-14, 2012, in Irvine, Calif. The two-and-a-half day event will provide participants with practical information on a range of technical topics, along with the business outlook for this sector.
On June 12, a basic level workshop on rigid/flex circuits "in the making" will be led by Dale Smith, DAS Flex Circuit Consultant LLC. The afternoon's advanced-level workshop led by Mike Carano, OMG Electronic Chemicals LLC, will focus on process considerations for flexible circuits, from metallization through final finishes.
The day-and-a-half conference portion of the event begins June 13 with the keynote, "The Future of Flexible Circuits Technology," presented by Happy Holden, Gentex Corporation. Al Wasserzug, Vulcan Flex Circuit Corporation, will discuss the challenges of technical marketing, flex versus PCBs. Glenn Oliver and Sidney Cox, Ph.D., DuPont will provide information on the design, fabrication and electrical analysis of high speed flex.
Other conference presentations include an "ask the flexperts" session on common flex technical challenges, a new approach to manufacturing rigid flex circuits, reduction of voiding in flexible circuits containing microvias and why aspect ratio does not matter anymore.
With printed electronics coming of age, a special conference focus on June 14 will spotlight this technology's potential. Dan Gamota, Printovate Technologies Inc., will provide an overview on the basics, limitations and what is achievable in this fast-growing area.
In addition, Marc Chason, Marc Chason & Associates Inc., will discuss advances in flexible printed lighting technology for high-growth markets. Mark Finstad, Flexible Circuit Technologies Inc., will highlight changes to the newly updated design standard, IPC-2223 and Sharon Starr, IPC, will share economic and market trends for the flexible circuits sector.
For more information on the table top exhibits, program or to register for the IPC Flexible Circuits Conference, visit http://www.ipc.org/flex-conference.
About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,100 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.
