Camtek Unveils Eagle - Next Generation Semiconductor Product Line; Receives Orders from Leading Device Manufacturers
P.O. Box 544
Press release date: July 7, 2014
The Eagle product line is designed to support the emerging Advanced Packaging market
MIGDAL HAEMEK, -- Camtek Ltd. (NASDAQ and TASE: CAMT) today announced the launch of its next generation Semiconductor Inspection and Metrology platform, at the Semicon West tradeshow which will start tomorrow, July 8, in San Francisco.
The Eagle product line is designed to support the fast growing Advanced Packaging market using cutting edge technologies, both software and hardware, that deliver unparalleled 2D and 3D inspection and metrology capabilities on the same platform.
Ramy Langer, Vice President and Head of Camtek's Semiconductor Division, commented, "This new product line will strengthen our leading position in the Semiconductor backend market, taking advantage of our expertise in bump inspection and metrology. The Advanced Packaging market in particular uses a wide spectrum of bump types and sizes. Our outstanding capabilities in the inspection and metrology of current and next-generation bumps, down to 2microm, will give our customers a competitive edge in this emerging market."
Continued Mr. Langer: "We have already received early orders for the new product from leading Semiconductor device manufacturers. We see this as a vote of confidence in our technology capabilities to deliver fast, accurate and unrivalled 2D and 3D inspection and metrology capabilities, supporting the industry roadmap."
ABOUT CAMTEK LTD.
Camtek Ltd. provides automated and technologically advanced solutions dedicated to enhancing production processes, increasing products yield and reliability, enabling and supporting customer's latest technologies in the Semiconductors, Printed Circuit Boards (PCB) and IC Substrates industries.
Camtek addresses the specific needs of these interconnected industries with dedicated solutions based on a wide and advanced platform of technologies including intelligent imaging, image processing and functional 3D inkjet printing.
Moshe Eisenberg, CFO