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Bookham Launches High Performance XFP-E Tunable Pluggable Transceiver at ECOC 2008

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(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Bookham, Inc.
2584 Junction Ave.
San Jose, CA, 95134
USA



Press release date: September 18, 2008

SAN JOSE, Calif., Sept. 18 -- Bookham, Inc. (NASDAQ:BKHM), has announced the launch of a high performance full band tunable pluggable transceiver in the XFP-E format. The product - TL8500 - is targeted at long haul links and metro/regional networks at rates up to 11.3Gb/s.

The XFP-E format is an industry recognised MSA, and by adding fullband tunability Bookham can now offer customers a 'universal' 10Gb/s transceiver with the following qualities:

o Density - maximum faceplate density for all links, including high performance long haul o Flexibility - for 'pay as you grow' capability and in-service accessibility o Reliability - Utilising field proven technology o Security - MSA format for ease of procurement o Economy - Highly competitive compared to alternative technologies and Formats

The module is underpinned by the fully Telcordia qualified Bookham indium phosphide Mach Zehnder (InP MZ) modulator and DSDBR laser - the key building blocks of the Bookham range of high performance tunable modules.

"We have already established a clear commercial lead in tunable pluggable devices with the success of our TL8000, and delivering high end 300pin capability in the XFP-E format extends that leadership - we are showing that there is a real market for tunable pluggables in a variety of formats," said Bookham Director Product Management, Adam Price. "We are established technology leaders in high end optics, and are now bringing our performance standards into the pluggable arena.

"With our proven, high performance optical components and decade of field history with indium phosphide Mach Zehnders, we are perfectly placed to expand the current tunable pluggable portfolio to include a variety of tunable formats, including X2, XENPAK and XFP."

Bookham invites customers to visit the company's booth (#99) at ECOC 2008 in Brussels to discuss the tunable XFP-E and roadmap for long-reach tunable pluggable modules with Product Line Managers and Applications Engineers.

1. ECOC 2008 is taking place at the Brussels Expo Center, Brussels, September 21 - 25 2. Bookham will be exhibiting at the ECOC exhibition, September 22 - 24, at booth #99 3. For further information on Bookham, please visit http://bookham.com/

About Bookham Bookham, Inc. is a leading provider of high performance optical products, spanning from components to advanced subsystems. The company designs and manufactures a broad range of solutions tailored for the telecommunications optical infrastructure and selected markets, including industrial, life sciences, semiconductor, and scientific. The Company utilizes proprietary core technologies and a vertically integrated manufacturing organization to provide its customers with cost-effective and innovative devices, as well as flexible, scalable product delivery. Bookham is a global company, headquartered in San Jose, Calif., with leading edge chip fabrication facilities in the UK and Switzerland, and manufacturing sites in the US and China.

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