Bangkok Events focus on solderability, assembly, reliability.October 3, 2013 -
Taking place November 19–20, IPC Southeast Asia Conference on Solder and Reliability will host experts from Asia, Europe, and North America presenting strategies for enhancing reliability in electronics assemblies. Full-day technical conference on November 20, opening with keynote presentation on qualification, will be preceded by full-day workshop on leveraging chip-on-board technology. Other presentations address strategic reliability related to solder alloys and packaging technologies.
Bangkok Events to Focus on Solderability, Assembly and Reliability
IPC-Association Connecting Electronics Industries
3000 Lakeside Drive
Bannockburn, IL, 60015
Press release date: October 1, 2013
Workshop and free technical conference scheduled for November
BANNOCKBURN, Ill., USA — A dozen experts from organizations in Asia, Europe and North America will present strategies for enhancing reliability in electronics assemblies on 19–20 November in Bangkok. The IPC Southeast Asia Conference on Solder and Reliability will feature a free full-day technical conference on 20 November preceded by a full-day workshop on leveraging chip-on-board technology.
“The market continues to demand smaller components and high reliability products, which is no easy task,” says David Bergman, IPC’s vice president of international relations. “The conference and workshop will help electronics professionals build their knowledge about solder technology, testing strategies and materials compliance, so they’re better equipped to balance the challenges of the production environment with customers’ requirements.”
The free technical conference on 20 November opens with a keynote presentation about qualification, featuring Michael Pecht, chair and professor at the University of Maryland and director of the CALCE Electronic Products and Systems Center.
Other technical presentations throughout the day will address strategic reliability considerations related to solder alloys and the latest packaging technologies. Experts scheduled to speak at the conference include Marcus Khoo, Altera Corporation; Lim Sze Pei, Indium Corporation; Jason Chan, Kyzen Corporation; Mok Tuck Weng, ALPHA; Sehar Samiappan, Indium; Kevin Tan, Henkel Electronics; Guan Tatt Yeoh, ZESTRON South Asia; Nico Coenen, Micronic Mydata AB; Martin Dosch, ERSA GmbH; Shine Kasedbariboon, IBM ECAT; and David Bergman, IPC.
Prior to the conference, Mukul Luthra of Waterfall Technologies will lead a full-day workshop on 19 November providing in-depth coverage of chip-on-board technology in the context of SMT assembly and packaging. Designed to give participants a deep understanding of all aspects involving chip-on-board technology, the workshop will address driving factors, chip-on-board positioning and comparisons of various approaches for achieving higher levels of integration. A detailed description of the workshop is available on the event’s website at www.ipc.org/se-asia.
While the technical conference is free, pre-registration is required due to limited seating. Attendees who register for the workshop by 13 October will receive an early-bird $50 discount and pay only $250 (IPC members) or $300 (nonmembers). To register for the workshop, conference or both, visit www.ipc.org/se-asia-register. For more information about session topics and speakers, go to www.ipc.org/se-asia.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.0 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Suzhou, Chengdu and Beijing, China.