Axcelis Announces First Shipment of New 'Purion M' Medium Current Implanter |
Axcelis Technologies Inc.
55 Cherry Hill Dr.
Beverly, MA, 01915 1053
USA
Press release date: July 31, 2012
System Delivers Industry Leading Purity, Precision and Productivity for the Sub 2Xnm Era
BEVERLY, Mass. - Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today the first shipment of the Company's innovative, new Purion M(TM) medium current implanter. The new system shipped to one of the world's leading chip manufacturers, where it will be used to manufacture next generation 2X nm FLASH devices.
Bill Bintz, executive vice president of product development, engineering and marketing commented, "As the industry moves towards the sub 20nm node, device makers are increasingly challenged by the high angle-sensitivity of medium current implants, such as high tilt HALO implants. These implants are critical in delivering the high performance, low power devices that are driving the market today. The Purion M was designed with the industry's most advanced beam optics and control, to ensure exceptionally pure and precise dopant placement, to maximize device performance and yield. In addition, it provides unmatched levels of productivity across the broadest range of medium current applications, enabling unparalleled manufacturing flexibility and capital efficiency." He continued, "We're very excited about the growth potential this new product offering provides the company, and look forward to working with our customers to meet the needs of emerging market trends."
The Purion M
The new Purion M medium current system utilizes Axcelis' precision spot beam line technology coupled with a 500 WPH single wafer platform. This combination provides chip manufacturers with exceptional reliability, and remarkable precision and productivity for the widest range (2keV - 1MeV) of low energy and mid dose applications, especially well channel and HALO processes. In addition, the system's industry-leading energy range and beam currents enable it to be utilized for implant processes traditionally run on high energy or high current implanters, providing chipmakers with maximum manufacturing versatility and capital efficiency. The Purion M's beam line design utilizes Axcelis' patented angular energy filter and a Constant Focal Length (CFL) scanning system, eliminating all forms of energy contamination while ensuring accurate dopant placement independent of processes angle requirements. The result is an exceptionally pure and precise implant, enabling the highest production yields.
Axcelis Technologies, Inc. (Nasdaq: ACLS) headquartered in Beverly, Massachusetts, provides innovative, high-productivity solutions for the semiconductor industry. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation and cleaning systems. For more information, visit the company's website at: www.axcelis.com.
CONTACTS:
Maureen Hart (editorial/media)
978.787.4266
maureen.hart@axcelis.com
Jay Zager (financial community)
978.787.9408
jay.zager@axcelis.com
SOURCE
Axcelis Technologies, Inc.
Web Site: http://www.axcelis.com
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