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ASTM releases compilation on lead-free solders.

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March 9, 2011 - Featuring 11 peer-reviewed papers that address environmental and health concerns related to exposure to lead during soldering, STP 1530 offers valuable resource for students, researchers, and material scientists in the electronic industry. Some topics of publication include factors affecting wetting behavior of solders and evolution of interfacial microstructure; microstructural aspects of the ductile-to-brittle transition; and fatigue life of SnBi finished TSOP parts under thermal cycling.

ASTM International Releases Compilation on Lead-free Solders


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ASTM International
100 Barr Harbor Dr., Box C700
West Conshohocken, PA, 19428-2959
USA



Press release date: March 8, 2011

W. CONSHOHOCKEN, Pa., - A new publication available from ASTM International, STP 1530, Lead-free Solders, is a valuable resource for students, researchers and material scientists in the electronic industry. STP 1530 includes 11 peer-reviewed papers that address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover:
o Factors affecting the wetting behavior of solders and evolution of interfacial microstructure;
o Pb-free high temperature solders for power semiconductor devices;
o Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates;
o Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling
o Microstructural aspects of the ductile-to-brittle transition;
o Loading mixity on the interfacial failure mode in lead-free solder joint;
o Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths;
o Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint;
o Tensile properties of Sn-10Sb-5Cu high temperature lead free solder; and
o Empirical modeling and rheological characterization of solder pastes used in electronic assemblies. STP 1530, Lead-free Solders, is available for $62 USD in print (210 pages; 6" x 9" soft cover; ISBN: 978-0-8031-7516-7; Stock #: STP1530) or as an e-book (ISBN: 978-0-8031-8683-5; E-book Stock #: STP1530-EB). To purchase ASTM publications, search by stock number on the ASTM Web site (www.astm.org), or contact ASTM Customer Relations (phone: 610-832-9585; service@astm.org). ASTM International is one of the largest international standards development and delivery systems in the world. ASTM International meets the World Trade Organization (WTO) principles for the development of international standards: coherence, consensus, development dimension, effectiveness, impartiality, openness, relevance and transparency. ASTM standards are accepted and used in research and development, product testing, quality systems and commercial transactions. ASTM Staff Contact: Marsha Firman, Phone: 610-832-9612; mfirman@astm.org www.astm.org
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