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Indium Corporation of America Release date: October 13, 2009
Indium Corporation's Global Product Manager, Andy C. Mackie, Ph. D., MSc, is presenting at the International Wafer-Level Packaging Conference (IWLPC) October 27- 30, 2009 in Santa Clara, CA.
Dr. Mackie is presenting Electromigration - Our Mutual Friend, as part of a session called WLP (wafer level packaging) Reliability and Test. In addition, Dr. Mackie is chairing the session on MEMS and Sensors Technology.
Dr. Mackie has over 20 years of experience in new product and process development and materials marketing in all areas of electronics manufacturing, including wafer fabrication, electronics assembly, and semiconductor packaging. He is an electronics industry expert in physical chemistry, surface chemistry, rheology, solder materials properties and processes (including solder paste printing), and reflow processes.
Dr. Mackie received the prestigious IPC President's Award in 2001 for his leadership in both the Solder Paste Task Group and the Assembly and Joining Materials subcommittee. He is formally trained in Six Sigma "Design of Experiments" and has written papers and lectured internationally on subjects ranging from sub-ppb metals analysis in supercritical carbon dioxide to pin-probe testing of flux residues. Additionally, Dr. Mackie holds patents in novel polymers, gas analysis, and solder paste formulation. Dr. Mackie has a PhD in Physical Chemistry from the University of Nottingham, UK, and a Masters of Science (MSc) in Surface and Colloid Chemistry from the University of Bristol, UK. Dr. Mackie is based at Indium's global headquarters in Clinton, NY, USA.
Sponsored jointly by the SMTA and Chip Scale Review Magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication & packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner, and registered to ISO-9001.
For more information about IWLPC or to register for this conference, visit www.iwlpc.com.
For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.
Contact: Anita Brown, Corporate Communications Indium Corporation abrown@indium.com tel: +1.315.381.7524 34 Robinson Road Clinton, NY 13323 USA www.indium.com
Company Information:
Name: Indium Corporation of America
Address: 1676 Lincoln Ave., P.O. Box 269
City: Utica
State: NY
ZIP: 13502
Country: USA
Phone: 800-4-INDIUM
FAX: 315-853-1000
http://www.indium.com
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