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Indium Corporation of America Release date: May 27, 2009
Best paper for 2008 goes to co-authors Chris Anglin and Ed Briggs, Technical Support Engineers; Tim Jensen, Solder Paste Product Manager; and Senior Technologist, Dr. Ronald C. Lasky, Ph.D. for the paper "Fine Powder Solder Pastes: Stencil Printing and Reflow in Lead-Free Assembly". This paper was presented at SMTA Toronto, April 2008.
The award for best-written paper goes to Mario Scalzo, Senior Technical Support Engineer, for his paper entitled "High First-Pass Yields in a Lead-Free Environment". This paper was published in the October 2008 issue of OnBoard Technology.
There are also two special mentions: Amanda Hartnett, Applications Engineer, for her paper entitled "Halogen-Free Solder Pastes and Fluxes: Implementation Challenges", which was presented at SMTAI 2008 and Brandon Judd, Technical Support Engineer, author of "Optimizing Your Stencil Printing Process", published in EPP Magazine's November 2008 issue.
Indium's Silver Quill award was developed to encourage individuals to author technical reports, presentations, articles, and books and to honor the most effective works. Points are awarded for the quality and quantity of the work and for the region and market the work addresses.
Chris Anglin has over 15 years of experience in advanced process development, new product introduction, and electronics assembly manufacturing. He has a master's degree in Industrial Engineering from the State University of New York at Binghamton. He is trained in Six Sigma Black Belt programs and is an SMTA-certified process engineer.
Ed Briggs has been with Indium Corporation for over 16 years. He has an associate's degree in Chemical Technology from Mohawk Valley Community College where he earned the Douglas J. Bauer Award for Excellence in Chemistry. He is an SMTA-certified engineer and has earned a Six-Sigma Green Belt Certification from Dartmouth College for demonstrated proficiency in developing and executing design experiments to support continuous process improvement. Ed resides in Herkimer, NY.
Tim Jensen has a bachelor's degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees. He also authors a blog focused on Halogen-Free Materials for Electronics Assembly, which can be found at www.indium.com/blogs/Halogen-Free-Blog/> . Tim resides in New Hartford, NY.
Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and a visiting professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog, which can be found at www.indium.com/drlasky> . Dr. Lasky resides in New Hampshire.
Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor's degree in Chemistry from Saint Anselm College. He also holds a certificate from the American Chemical Society for Professional Education. In addition, he is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College's Thayer School of Engineering. He is also the author of blog on Tech Support in Electronics Assembly: www.indium.com/blogs/Mario-Scalzo-Blog/>. Mario resides in Rome, NY.
Amanda Hartnett has a bachelor's degree in Chemistry from Utica College and previously worked as a research lab technician at Cornell University focusing on the physical properties of silicon. She has authored technical papers on thermal management and microelectronics packaging materials. Amanda is active in several industry organizations including SPIE, IMAPS, and the IPC. She is also a member of the American Chemical Society. Amanda is one of the authors of Indium's Thermal blog: www.indium.com/blogs/TIM-Blog/>. She resides in Utica, NY.
Brandon Judd has a bachelor's degree in Mechanical Technology from the State University of New York Institute of Technology. He is certified on several pieces of equipment, including stencil printers, 3D solder paste inspection equipment, X-ray machines and reflow ovens. Brandon resides in Little Falls, NY.
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001.
For more information about Indium Corporation, visit www.indium.com/> or email abrown@indium.com.
Contact:
Anita Brown
Indium Corporation of America
abrown@indium.com
800-4-INDIUM
1676 Lincoln Ave., P.O. Box 269
Utica, NY 13502
www.indium.com
Company Information:
Name: Indium Corporation of America
Address: 1676 Lincoln Ave., P.O. Box 269
City: Utica
State: NY
ZIP: 13502
Country: USA
Phone: 800-4-INDIUM
FAX: 315-853-1000
http://www.indium.com
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