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Indium Corporation of America Release date: July 30, 2008
Date: July 30, 2008
Five of Indium Corporation's technology experts will be presenting technical findings at SMTA International, (SMTAI) August 17-21, 2008 in Orlando Fl.:
o Dr. Ning-Cheng Lee, Vice President of Technology o Dr. Ronald C. Lasky, Ph.D. PE, and Senior Technologist o Tim Jensen, Solder Paste Product Manager o Amanda (Whittemore) Hartnett, Applications Engineer o Dave Preische, Director of Sales for Metals, Chemicals, & Energy
Dr. Lee will chair a technical session entitled, Assessment of Lead-Free Reliability on Tuesday, August 19, 10:00am - 11:30am. He will also present at the technical session for Impact and Fatigue Reliability of Lead-Free Solders on the Superior Drop Test Performance of SACT Solders and Its Mechanism on Wednesday, August 20, 3:00pm - 5:30pm. In addition, he will be a panelist for the session on Lead-Free Alternatives on Thursday, August 21, 8:00am - 9:30am.
Dr. Lasky and Tim Jensen will present the tutorial, Implementing a Halogen-Free Circuit Board Assembly Process on Monday, August 18, 8:00am - 11:30am.
Dr. Lasky will also be a panelist for the session on Evolving Technologies and Current Issues for Lead-Free Materials on Monday, August 18, 3:30pm - 5:00pm. He will also chair a technical session focused on Alternate Lead-Free Alloys on Tuesday, August 19, 3:30pm - 5:00pm.
Tim Jensen and Amanda Hartnett will present at the technical session for Advanced Environmental Product Compliance Issues on Halogen-Free Solder Pastes and Fluxes: Implementation Challenges on Wednesday, August 20, 1:30pm - 3:00pm.
David Preische will present as part of SMTAI's first Alternative Energy Symposium. His paper, titled Alternative Energy: Fuel Cells and Solar Cells Enter High Volume Manufacturing will be presented on Monday, August 18, 8:00am - 9:30am.
Indium Corporation will be exhibiting at the electronics exhibition, booth #517
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects, and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership.
Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog which can be found at www.indium.com/drlasky www.indium.com/drlasky> .
Tim Jensen has a Bachelor's Degree in Chemical Engineering from Clarkson University. He has authored technical publications and numerous process and technical guidelines. Tim is a member of the SMTA and participates actively in several IPC standards development committees.
Amanda Hartnett has a Bachelor's Degree in Chemistry from Utica College and previously worked as a research lab technician at Cornell University focusing on the physical properties of silicon. She has authored technical papers on thermal management and microelectronics packaging materials. Amanda is active in several industry organizations including SPIE, IMAPS, and the IPC. She is also a member of the American Chemical Society.
David Preische has over 20 years of experience in electronics assembly, semiconductor assembly, thermal management, solar, and metals and chemicals. David is an active member and speaker on several national and international societies, including Sales & Marketing Executives International and the National Association of Sales Professionals.
SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA - the world's leading user group for surface mount and companion technologies. This comprehensive event features over 100 technical papers, 24 tutorials, an Alternative Energy Symposium, and three focused symposia across six tracks: Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Process Control, and Contract Manufacturing/Business Issues.
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication & packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a five-time Frost & Sullivan Award winner, and registered to ISO-9001.
For more information about SMTAI or to register for these conferences, visit http://www.smta.org/smtai
For more information about Indium Corporation visit http://www.indium.com or email abrown@indium.com.
Contact: Anita Brown, Corporate Communications Indium Corporation of America
abrown@indium.com
800-4-INDIUM
1676 Lincoln Ave., P.O. Box 269
Clinton, NY 13323 USA
www.indium.com
Company Information:
Name: Indium Corporation of America
Address: 1676 Lincoln Ave., P.O. Box 269
City: Utica
State: NY
ZIP: 13502
Country: USA
Phone: 800-4-INDIUM
FAX: 315-853-1000
http://www.indium.com
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