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Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)


Henkel Loctite Corporation

Release date: February 20, 2007

New Loctite CSP Underfill System from Henkel Enhances Reliability of Hand-Held Devices; Lands Vision Award

Following several ground-breaking materials introductions, Henkel announces yet another materials advancement with the development and commercial availability of LoctiteŽ 3536, an advanced underfill material designed to enhance the reliability of modern hand-held devices - especially those manufactured in lead-free environments.

Formulated specifically for use with today's fine-pitch advanced CSP and BGA packages, LoctiteŽ 3536 is a high flow, lead-free compatible designed to quickly fill the space beneath the CSP and BGA packages. It cures rapidly at low temperature, which minimizes thermal stress to other components on the printed circuit board (PCB) and allows for in-line curing to increase device throughput.

Today's hand-held devices are subjected to many stresses and require reinforced mechanical strength for long-term reliability. Loctite 3536 delivers superior protection for solder joints against mechanical strains such as shock, drop and vibration and testing confirms its protective superiority over that of competitive materials. When evaluated against JEDEC drop test standards on 0.4mm and 0.5mm Pb-free devices, Loctite 3536 was proven to offer significant reliability improvements over non-underfilled Pb-free devices. The material also delivers exceptional manufacturing flexibility, as Loctite 3536 is compatible with lead-free solder materials to allow for an increased process window and is reworkable, enabling the recovery of expensive substrates and PCBs.

Though just officially launched to the marketplace this year, Loctite 3536 has already begun earning industry accolades with a recent Vision Award win recognizing the innovative features and profound manufacturing benefits of the material. "That Loctite 3536 won such a prestigious industry honor award after having been introduced so recently is a testament to Henkel's developmental approach and ability to produce market-ready, next-generation materials at a very accelerated pace," says Robert Chu, Henkel Global Product Manager for CSP Underfills. "We are very proud to have been selected as a Vision Award winner and are gratified that the judging panel recognized the outstanding performance and unique qualities of Loctite 3536."

The Vision Awards are an annual awards program sponsored by SMT magazine and recognize products for the electronics assembly industry that are truly innovative and present a real and relevant value to the marketplace. Evaluated by an expert panel of judges, Henkel's Loctite 3536 was chosen against other entries as the best new material in the category of Adhesives/Coatings/Encapsulants/Underfills.

"We recognize that cost-savings and production efficiencies are necessities for today's electronics firms," concludes Chu. "Like all Henkel materials, Loctite 3536 was formulated with these goals in mind and, clearly, the industry has validated our approach."

For more information please log on to www.henkel.com/electronics or call the company's Irvine, California headquarters at 949-789-2500.

About the electronics group of Henkel

Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronics Industry.

Henkel, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal Care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. In fiscal 2005 Henkel generated sales of 11.974 billion euros. A leader in brands and technologies, Henkel makes people's lives easier, better, and more beautiful. More than 50,000 employees work for Henkel worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".

Contact Henkel Corporation Doug Dixon Phone: 949-789-2500 Fax: 949-785-2595 doug.dixon@us.henkel.com www.electronics.henkel.com
Contacts:

General Information:
Doug Dixon
USA
Phone: 949-789-2500
FAX: 949-785-2595
Send email  E-mail this person

Company Information:
Name: Henkel Loctite Corporation
Address: 1001 Trout Brook Crossing, P.O. Box 4016
City: Rocky Hill
State: CT
ZIP: 06067
Country: USA
Phone: 860-571-5100
FAX: 860-571-5465
http://www.loctite.com

More New Product News from this company:
Jul 17, 2008 - Low-Temperature Cleaner works on all metal substrates.
Jun 20, 2008 - Hot Melt Adhesives come in finger-sized packages.
May 15, 2008 - Lubricant freezes metal parts to penetrate rust layers.
Apr 24, 2008 - Fast-Cure Silicone is stable in harsh environments.
Apr 22, 2008 - Semisolid Primer optimizes anaerobic adhesive performance.
Apr 18, 2008 - Flexible Light Cure Adhesive suits medical device assembly.
Apr 15, 2008 - Spray Insulation bonds insulation to metal ducts/cabinets.
Apr 3, 2008 - Base Coating offers corrosion resistance for light metals.
Apr 3, 2008 - Adhesives are suited for magnet bonding.
Apr 2, 2008 - Low-Odor, Low-Bloom Adhesive bonds to various substrates.

Other News from this company:
Jul 10, 2008 - Henkel Moves North American Headquarters to Connecticut
May 20, 2008 - Safe, Reliable Construction Adhesive Systems Transform Building Assembly
May 02, 2008 - Web Site Compares Threadlocking Adhesives and Mechanical Fasteners
Mar 28, 2008 - Henkel Honored With Inaugural Prime Source Award From Industrial Distributor, EIS
Mar 28, 2008 - Hisco Honors Henkel As Supplier Of The Year
Oct 15, 2007 - Henkel Promotes Dr. Renzhe Zhao to Technical Manager Position
Sep 17, 2007 - Henkel to Share Materials Expertise at Upcoming IPC Midwest and SMTA International Events
Sep 01, 2007 - Grote Industries Partners with Henkel for Advanced LED Lighting Solution
May 17, 2007 - Henkel's Loctite 3508 Cornerbond Underfill Secures Two Industry Honors
Apr 24, 2007 - Henkel Receives Intel's Preferred Quality Supplier Award
Mar 27, 2007 - New Literature on Adhesives, Sealants and Surface Treatments
Feb 22, 2007 - Dial to Sponsor PDMA Technology Conference
Feb 20, 2007 - Henkel Expands Solder Paste Manufacturing Capacity in India
Feb 20, 2007 - High Performance UV Cure Chamber Accepts Diversity of Part Sizes
Feb 13, 2007 - Literature Overviews Line of Loctite Volumetric Adhesive Dispensing Equipment
Feb 05, 2007 - Henkel to Show Proven Materials Solutions; Launch New Products at APEX 2007
Jan 22, 2007 - Henkel Launches Global Competition for New Ideas
Jan 22, 2007 - New Frekote Water-Based Cleaner Removes Residue from Composite Molds
Jan 11, 2007 - Literature Overviews Loctite Cost Saving Solutions for Manufacturers

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More related stories:
Jul 9, 2008 - Ceramic Adhesive withstands up to 2,500°F.
Jun 25, 2008 - Condensation Cured Silicone withstands temperatures to 400°F.
May 30, 2008 - Encapsulation and Delivery System suits skin care products.
Mar 19, 2008 - Polymer System cures by UV light and/or heat.
Feb 28, 2008 - Silicone Potting Compound assures complete fill-in.
Feb 7, 2008 - Potting Compound has flexible, low-viscosity formulation.
Oct 1, 2007 - Ceramic Compound is used to assemble heaters and igniters.
Sep 7, 2007 - Silicone Compound has Shore A hardness of 45.
Feb 9, 2007 - Epoxy Resin Compound features high thermal conductivity.
Jan 31, 2007 - Silicone Elastomer features electrical insulation properties.
Nov 27, 2006 - Potting/Encapsulating Compound has water-clear formula.
Oct 2, 2006 - Adhesive Epoxy has operating range of -65 to 400°F.
Oct 2, 2006 - Ceramic Compound has compressive strength of 11,500 psi.
Sep 8, 2006 - Metal Repair Compound withstands high temperatures.
Jun 12, 2006 - Sealant has -300 to 600°F service temperature range.
Mar 29, 2006 - Low Viscosity Adhesive offers Tg of 90°C.
Feb 21, 2006 - Epoxy Compound offers electrical potting and encapsulation.
Feb 2, 2006 - Compounds blend epoxy and graphite for strong bonds.
Feb 1, 2006 - Transparent Compound is suited for optical applications.
Nov 16, 2005 - Ceramic Compound offers high-temperature thermal insulation.



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