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Micron Laser Technology Release date: January 8, 2009
o 12um focal spot diameter improves via diameters under 3mils and increases positional and dimensional tolerances. o Shorter wavelength increases processing windows and material selection.
Hillsboro, Oregon, January 2009 - Micron Laser Technology, a subcontract laser processing service company serving the electronics, medical, aerospace, automotive, and military industries, announced the addition of a new 266um wavelength laser system. The 266um diode pumped solid-state Q-switched UV laser provides a versatile tool for higher precision cutting and drilling in a broad range of materials and applications.
Micron Laser Technology integrated the 266um laser because its customers continually demand tighter tolerances, smaller feature sizes, and greater material selection. This technology investment exemplifies Micron Laser Technology's commitment to advancing their customers' technology roadmaps and market position. This technology advances Micron Laser Technology's customers in drilling circuit boards and silicon, cutting sapphire substrates for optoelectronic devices, micro machining various metals for medical/electronic devices, and laser ablating solar cells.
Micron Laser Technology's customers expressed a need to create microvias with diameters less than 4mils. Until now, .004" diameter microvias and smaller were not as concentric in shape as larger diameter microvias due to laser beam's spot size. The smaller spot size has also improved the positional and dimensional tolerances as a percentage of the via diameter itself. Micron Laser Technology's director of operations, Bryan Roberts, reported, "The electronics industry has shown great interest in producing smaller microvias with the goal of device miniaturization."
The shorter wavelength of the 266um laser enabled Micron Laser Technology to process new materials and improve existing longer wavelength processes. The 266um wavelength afforded Micron Laser Technology the ability to remove Parylene from medical devices. Parylene does not absorb larger wavelengths efficiently due to its transparent characteristic. The Gaussian mode of the 266um laser provides Micron Laser Technology with its sharpest tool yet. The laser's peak power combined with its short wavelength processes much smaller feature sizes in various plastics, metals, and ceramics. For example, .75 mil line and space features for circuit fabrication are now possible.
About Micron Laser Technology: Micron Laser Technology is one of the largest subcontractors for laser material processing in the United States and Canada. Micron Laser Technology engineers laser material processes utilized in printed circuit board fabrication and rework for the medical, military, aerospace, automotive, and electronics industries. Other diversification has led to laser micro machining of various metals, thin films, and plastics. By working closely with its customers, Micron Laser Technology develops superior, non-contact, laser material processes that enable new products and markets. At the core of its business are experienced laser technologists coupled with numerous custom ultraviolet and infrared laser systems.
Company Information: Name: Micron Laser Technology Address: 22750 NW Wagon Way, Ste A City: Hillsboro State: OR ZIP: 97124 Country: USA Phone: 503-439-9000 FAX: 503-439-3365 http://www.micronlaser.com
Company Information:
Name: Micron Laser Technology
Address: 22750 NW Wagon Way, Suite A
City: Hillsboro
State: OR
ZIP: 97124
Country: USA
Phone: 503-439-9000
FAX: 503-439-3365
http://www.micronlaser.com
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