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IPC releases PCB industry results for May 2008.

July 3, 2008 - According to North American PCB Statistical Program, rigid PCB shipments are up 5.7% and bookings are down 4.1% in May 2008 from May 2007. Flexible circuit shipments are down 3.5%, while bookings are down 5.0%. Book-to-bill ratio for North American rigid PCB industry in May 2008 declined to 0.95, while flexible circuit book-to-bill ratio climbed above parity to 1.01. For rigid and flexible circuits combined, shipments in May 2008 increased 5.1% from May 2007 and orders booked decreased 4.2%.
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Press Release

IPC-Association Connecting Electronics Industries

Release date: June 30, 2008

IPC Releases PCB Industry Results For May 2008

BANNOCKBURN, Ill., USA, June 30, 2008 - IPC - Association Connecting Electronics Industries® announced today the May findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

PCB Industry Growth Rates and Book-to-Bill Ratios Announced
Rigid PCB shipments are up 5.7 percent and bookings are down 4.1 percent in May 2008 from May 2007. Year to date, rigid PCB shipments are up 6.4 percent and bookings are up 9.4 percent. Compared to the previous month, rigid PCB shipments decreased 0.1 percent and rigid bookings decreased 5.7 percent. The book-to-bill ratio for the North American rigid PCB industry in May 2008 declined to 0.95.

Flexible circuit shipments in May 2008 are down 3.5 percent and bookings are down 5.0 percent compared to May 2007. Year to date, flexible circuit shipments are up 3.3 percent and bookings are down 12.5 percent. Compared to the previous month, flexible circuit shipments are down 9.3 percent and flex bookings rose 1.1 percent. The North American flexible circuit book-to-bill ratio climbed above parity to 1.01.

For rigid PCBs and flexible circuits combined, industry shipments in May 2008 increased 5.1 percent from May 2007 and orders booked decreased 4.2 percent from May 2007. Year to date, combined industry shipments are up 6.2 percent and bookings are up 7.5 percent. Compared to the previous month, combined industry shipments for May 2008 are down 0.7 percent and bookings are down 5.2 percent. The combined (rigid and flex) industry book-to-bill ratio in May 2008 fell to 0.96.

"Rigid PCB shipments have outpaced bookings in the last two months, which drove down the book-to-bill ratio for the industry," said IPC President Denny McGuirk. "Overall industry growth this year is still modest but steady."

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC's survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next two to three months.

Book-to-bill ratios and growth rates for rigid PCBs and flexible circuits combined are heavily affected by the rigid PCB segment. Rigid PCBs represent an estimated 90 percent of the current PCB industry in North America, according to IPC's World PCB Production and Laminate Market Report.

The Role of Domestic Production
IPC's monthly survey of the North American PCB industry tracks bookings and shipments from U.S. and Canadian facilities, which provide indicators of regional demand. These numbers do not measure U.S. and Canadian PCB production. To track regional production trends, however, IPC asks survey participants for the percent of their reported shipments that were produced domestically (i.e., in the USA or Canada). In May 2008, 86 percent of total PCB shipments reported were domestically produced. Domestic production accounted for 86 percent of rigid PCB and 88 percent of flexible circuit shipments in May by IPC survey participants. These numbers are significantly affected by the mix of companies in IPC's survey sample, which changed slightly in January, but will remain constant through the remainder of the year.

Bare Circuits Versus Assembly
Flexible circuit sales typically include value-added services such as assembly, in addition to the bare flex circuits. In May, the flexible circuit manufacturers in IPC's survey sample indicated that bare circuits accounted for approximately 62 percent of their shipment value reported for the month. Assembly and other services make up a large and growing segment of flexible circuit producers' business. This figure is also sensitive to changes in the survey sample, which may occur at the beginning of each calendar year.

Interpreting the Data
Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they may reflect cyclical effects. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month may not be significant unless a trend of three consecutive months or more is apparent. It is also important to consider changes in bookings and shipments to understand what is driving changes in the book-to-bill ratio.

The information in IPC's monthly PCB industry statistics is based on data provided by a representative sample of both rigid and flexible PCB manufacturers in the USA and Canada. IPC publishes the PCB Book-to-Bill Ratio and the Interconnect Manufacturing Services (IMS) Business Report each month. Statistics for the previous month are not available until the last week of the following month.

About IPC
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.5 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; and Shanghai, China.
Contacts:

Marketing:
Sharon Starr Director of Market Research
USA
Phone: 847-597-2817
Send email  E-mail this person

Company Information:
Name: IPC-Association Connecting Electronics Industries
Address: 3000 Lakeside Drive
City: Bannockburn
State: IL
ZIP: 60015
Country: USA
Phone: 847-615-7100
http://www.ipc.org

Other News from this company:
Sep 26, 2008 - IPC Releases PCB Industry Results For August 2008
Sep 23, 2008 - IPC Honors Volunteers for Their Contributions to IPC Standards and Program Development
Sep 19, 2008 - IPC White Paper Voices Technical Perspective on Proposed Revisions to RoHS Directive
Sep 18, 2008 - Newly Published IPC Guide to Environmental Megatrends Steers Companies through Environmental Regulations and Issues
Sep 17, 2008 - Janco Electronics Earns IPC Certification For Lead-Free Electronics Assembly Process Capability
Sep 16, 2008 - IPC Midwest Show to Feature Innovative Products
Sep 11, 2008 - Free Forums Offer IPC Midwest Attendees More
Sep 09, 2008 - IPC's International Test and Inspection Conference to Highlight Cycle Time, Cost Reductions and Improved Time to Market
Sep 05, 2008 - Newly Released IPC J-STD-075 Classifies Worst-Case Thermal Process Limitations for Electronic Components
Aug 27, 2008 - IPC Releases PCB Industry Results For July 2008
Aug 25, 2008 - Environmental Sessions At IPC Midwest Help Electronics Companies Prepare For Latest In Green Movement
Aug 21, 2008 - Manufacturability and Maximum Efficiency the Focus of IPC Designers Day
Aug 13, 2008 - Working Assembly Line Featured At IPC Midwest
Aug 12, 2008 - IPC Midwest's Technical Conference And Professional Development Courses Propel Industry Forward
Aug 08, 2008 - Growing HDI Market - IPC Conference to Help North American PCB Companies Raise Competitive Advantage
Aug 01, 2008 - IPC to Hold IPC-9592 Power Conversion Conference
Jul 29, 2008 - New Cleaning Symposium
Jul 28, 2008 - IPC Survey Reveals Electronics Industry Not Prepared for REACH
Jul 25, 2008 - IPC Releases PCB Industry Results gor June 2008
Jul 22, 2008 - IPC and SMTA Host Symposium on High Performance Electronics Assembly Cleaning

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