May 9, 2008 -
Titled "High Density Data Centers - Case Studies and Best Practices", ASHRAE book provides range of ventilation schemes that demonstrate how loads can be cooled using various approaches. Some case studies covered in book include National Center for Environmental Prediction, San Diego Supercomputer Center, NYC Financial Services Data Center, Georgia Institute of Technology Data Center, Cedars-Sinai Medical Center Data Center, and Hewlett-Packard Richardson Datacool(TM) Data Center.
American Society of Heating, Refrigerating and Air Conditioning Engineers
Release date: May 7, 2008
Data Center Case Studies Focus of ASHRAE Book
ATLANTA - Data centers are becoming increasingly more difficult to adequately cool, due to increased datacom performance that results in increased heat dissipation.
Even though performance has increased at a more rapid rate than power, the power required and the resulting heat dissipated by the datacom equipment is putting a strain on data centers.
Case studies and guidance on cooling data centers is available in a new book from ASHRAE, High Density Data Centers - Case Studies and Best Practices.
"In the struggle to improve the thermal management characteristics of data centers, it is important to assess today's data center designs," Roger Schmidt said. "This book provides case studies of high density data centers and a range of ventilation schemes that demonstrate how loads can be cooled using a number of different approaches." Schmidt is a member of ASHRAE's technical committee on mission control facilities, technology spaces and electronic equipment, which wrote the book.
Case studies featured in the book include the National Center for Environmental Prediction, the IBM Test Facility in Poughkeepsie, N.Y., the San Diego Supercomputer Center, the Lawrence Livermore National Lab Data Center, the NYC Financial Services Data Center, the Georgia Institute of Technology Data Center, the Cedars-Sinai Medical Center Data Center and the Hewlett-Packard Richardson Datacool(TM) Data Center.
The book is part of the ASHRAE Datacom Series, developed to provide a more comprehensive treatment of datacom cooling and related subjects. Other books in the series are ASHRAE's Design Considerations for Datacom Equipment Centers, Best Practices for Datacom Facility Energy Efficiency, Thermal Guidelines for Data Processing Environments, Liquid Cooling Guidelines for Datacom Equipment Centers, Datacom Equipment Power Trends and Cooling Applications, and Structural and Vibration Guidelines for Datacom Equipment Centers.
The cost of High Density Data Centers - Case Studies and Best Practices is $54 (ASHRAE members, $43). To order, contact ASHRAE Customer Service at 1-800-527-4723 (United States and Canada) or 404-636-8400 (worldwide), fax 404-321-5478, or visit at www.ashrae.org/bookstore.
ASHRAE, founded in 1894, is an international organization of some 50,000 persons. ASHRAE fulfills its mission of advancing heating, ventilation, air conditioning and refrigeration to serve humanity and promote a sustainable world through research, standards writing, publishing and continuing education.
Contact: Jodi Dunlop Public Relations 678-539-1140 jdunlop@ashrae.org 1791 Tullie Circle NE Atlanta, GA 30329
Contacts:
General Information:
Jodi Dunlop
USA
Phone: 678-539-1140 E-mail this person
Company Information: Name: American Society of Heating, Refrigerating and Air Conditioning Engineers Address: 1791 Tullie Circle, N.E. City: Atlanta State: GA ZIP: 30329 Country: USA Phone: 404-636-8400 http://www.ashrae.org
News provided by ThomasNet Industrial Newsroom® (TIN). TIN is a comprehensive source
of new and timely product information in the industrial marketplace. TIN supplies new product
information to the web sites, e-marketplaces and print publications that serve the
industrial marketplace. For press release submissions please go to
http://news.thomasnet.com/submitpr.html.
BY ACCESSING, BROWSING AND/OR USING THIS WEB SITE AND/OR ANY WEB SITES PROVIDED BY
ProductNews.com, YOU AGREE TO BE BOUND BY THE TERMS OF USE
AGREEMENT.
