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Indium Corporation Hires Product Manager for Semiconductor Packaging Materials

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Indium Corporation of America

Release date: November 21, 2006

Indium Corporation announced the addition of Andy Mackie as Product Manager for Semiconductor Packaging Materials. Andy is based at Indium's Global Headquarters in Clinton, NY, and reports to the Director of Solder Products.

Andy is responsible for the global marketing efforts for all of Indium's Semiconductor Packaging Materials, including solder spheres, ball attach fluxes, wafer bumping fluxes and pastes, and epoxy fluxes.

Andy has over 17 years of experience in new product development, sales, and marketing of electronics assembly and semiconductor packaging. He is an industry expert in solder paste printing, reflow, and atmosphere control in electronics assembly. He received the IPC President's Award in 2001 for his leadership in IPC's Solder Paste Task Force and the Assembly and Joining Materials Subcommittee.

Andy has a PhD in Physical Chemistry from the University of Nottingham, UK, and a Masters of Science in Surface and Colloid Chemistry from the University of Bristol, UK. He is trained in Six Sigma "Design of Experiments" and has written numerous papers which have been published globally.

Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics assembly materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world's premiere supplier of commercial grade and high-purity indium. Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.

For more information about Indium Corporation visit www.indium.com or email askus@indium.com.

Contact: Anita Brown, Corporate Communications Indium Corporation of America
abrown@indium.com
800-4-INDIUM
1676 Lincoln Ave., P.O. Box 269
Utica, NY 13502
www.indium.com
Company Information:
Name: Indium Corporation of America
Address: 1676 Lincoln Ave., P.O. Box 269
City: Utica
State: NY
ZIP: 13502
Country: USA
Phone: 800-4-INDIUM
FAX: 315-853-1000
http://www.indium.com

More New Product News from this company:
Thermal Interface Material is optimized for IGBT modules.
Cored Wire Solder is designed for use with Pb-free alloys.
Solder Flux targets Pb-free wave soldering.
Water-Soluble Solder Paste is lead-free.
Wave Solder Flux suits Pb-free applications.
Interconnect Flux is water-soluble.
Solder Wire is comprised of high-purity materials.

Other News from this company:
Indium Corporation's Director to Present at Sustainability Summit
Indium Corporation's Technical Support Engineer to Present at SMTA Space Coast Technical Conference
Indium Corporation's Dr. Mackie to Present at IWLPC
Indium Corporation Technology Experts Presenting at SMTA International
Indium Corporation Acquires Assets of Reactive NanoTechnologies
Indium Corporation Announces Silver Quill Award Winners for 2008
Indium Corporation's Sbiroli Receives IPC's Distinguished Committee Service Award
Indium Corporation's Dr. Lee Recognized by Two Industry Organizations
Indium Corporation's Dr. Lee to Present at ECTC
Indium Corporation Expands Sales Network in Europe
Indium Corporation Technical Papers Accepted for APEX Technical Conference
Indium Corporation Expands Sales Team in Upstate New York
Indium Corporation Appoints Foundation Technologies as Sales Representative for Ohio
Indium Corporation's Sales Engineer to Present at SMTA San Diego Chapter Meeting
Indium Corporation Technical Engineers' Papers Accepted by IPC Lead-Free Conference
Indium Corporation's Dr. Lee to Present at Pan Pacific Microelectronics Symposium
Indium Corporation Expands Sales Network in Indiana and Kentucky
Indium Corporation Engineers Achieve SMTA Certification
Indium Corporation's Giasone Promoted to Metals Manager
Indium Corporation's Dr. Liu Appointed to Advisory Board




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