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Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)


Brewer Science, Inc.

Release date: July 17, 2006

EV Group and Brewer Science Cooperate in the Development of Ultrathin Wafer Handling Solutions for the Microelectronics Industry

EV Group (EVG), based in Schärding, Austria, and Brewer Science, Inc., based in Rolla, Missouri, USA, announce that they are co-developing a solution for the handling of ultrathin wafers that will allow high-temperature advanced packaging processes using a temporary wafer bonding system.

As pioneers in the area of permanent and temporary wafer bonding, EVG brings many years of tool and process expertise to this growing problem. Likewise, Brewer Science brings 25 years of advanced materials expertise gained as a supplier of polymeric coatings to the microelectronics industry. The two companies are combining their experience and knowledge to create a complete ultrathin wafer handling solution for semiconductor companies that need to perform wafer thinning and high-temperature advanced packaging processes, followed by quick debonding. End users in the industry are currently evaluating solutions.

EVG's EVG®850 Temporary Bonding platform is already the industry standard for temporary bonding solutions. It is used extensively in low-temperature post-processing applications in the compound semiconductor and power device markets. This extension of the product line into tackling one of the mainline semiconductor industry's technical hurdles is a natural progression for the system.

"EVG sees the collaboration with Brewer Science as an important step towards meeting the customer expectation that we are a total solution provider. It is no longer possible to only supply the equipment or the material. It is up to organizations like Brewer Science and EVG to work together to tackle the industry challenges and to provide the full solution to our customers, so that we may all be successful," says Eric Thallner, CEO and Founder of EVG.

About Brewer Science: Brewer Science, a multidivisional technology company, has pioneered industry-enabling innovations from ARC® anti-reflective coatings to ProTEK(TM) etch protective coatings. Following on its long tradition of being first to introduce and implement cutting-edge technologies, Brewer Science is proud to introduce WaferBOND(TM) temporary wafer bond coatings. Brewer Science is a major producer of high-quality material, process, and machine solutions that meet the stringent requirements of today's IC, compound semiconductor, MEMS, and optoelectronic industries. Under the leadership of Dr. Terry Brewer, president and founder, Brewer Science continues to develop innovative technologies, reliable products, and responsive services, each attuned to the specific needs of individual customers. Further information on the technology and product information from Brewer Science can be obtained via the company's website at www.brewerscience.com.

About EV Group: Founded in 1980, EV Group is a global supplier of wafer bonders, aligners, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding equipment and is a leader in lithography for advanced packaging, MEMS and Nanoimprint Lithography (NIL). The company's unique Triple I approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EV Group to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit www.EVGroup.com.

Contact information: James Lamb - jlamb@brewerscience.com, +1 573.364.0300 Steven Dwyer - s.dwyer@evgroup.com, +1 480.727.9608

Company Information:
Name: Brewer Science, Inc.
Address: 2401 Brewer Dr.
City: Rolla
State: MO
ZIP: 65401
Country: USA
Phone: 573-364-0300
FAX: 573-368-3318
http://www.brewerscience.com

More New Product News from this company:
Jul 17, 2008 - Bonding Material accommodates ultrathin wafers.

Other News from this company:
Jul 14, 2008 - Improving Services For The Customer: Rite Track And Brewer Science Form Collaborative Partnership
Jul 09, 2008 - Brewer Science Expands Commercialization of Carbon Nanotube Solutions
May 03, 2007 - Brewer Science, Inc., Joins EMC-3D Consortium to Develop Cost-Effective 3D Thru-Silicon-Via Interconnects
Sep 08, 2006 - Brewer Science Announces an Exclusive Licensing Agreement with Dow for Dielectric Coatings
Jul 11, 2006 - Brewer Science Reaches 25-Year Milestone
Jul 11, 2006 - ARC®29A Anti-Reflective Coating for 65nm Node ArF Processing
Jul 11, 2006 - ProTEK(TM) Temporary Etch Protective Coatings
Jul 11, 2006 - Temporary Wafer Bonding Product Set Released by Brewer Science

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More related stories:
Jul 31, 2008 - Wafer Loader can handle wafers as thin as 100 µm.
Feb 27, 2008 - Imprint Lithography Tool meets semiconductor overlay needs.
Nov 29, 2007 - Automation Platform aids semiconductor metrology OEMs.
Aug 14, 2007 - Wafer Bonding System offers single station bonding.
Apr 3, 2007 - Wafer Loaders provide throughput of 750 wph.
Mar 17, 2006 - Wafer Flip Module enables backside contamination inspection.
Jul 18, 2005 - Reader tracks semiconductor wafers through manufacturing.
Nov 6, 2003 - Robot System provides precise, repeatable wafer handling.
Oct 2, 2003 - Wafer Handling Module suits semiconductor process tools.
Jan 16, 2003 - Wafer-Handling System is SMEMA compliant.
Jul 31, 2002 - Single-Reticle Pod transports and stores 150 mm reticles.
Jun 10, 2002 - Wafer Loader includes 14 in. monitor and keyboard.
Apr 25, 2002 - Load Port handles 300 mm semiconductor wafers.



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