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Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)


Henkel Loctite Corporation

Release date: August 8, 2006

New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages

Irvine, California, August 8, 2006 New Material Set from Henkel Delivers Exceptional Performance for Stacked CSP (SCSP) Packages

The next in a series of recently introduced optimized material sets, Henkel has announced a materials combination designed specifically for the unique manufacturing requirements of stacked CSP (SCSP) devices. Uniting the robust performance characteristics of die attach material Hysol® QMI536NB with that of mold compound Hysol® GR9820, this latest material set delivers proven, reliable JEDEC Level 1/260° reflow performance.

Both materials perform well in lead-free environments, with a high resistance to elevated temperatures and demanding manufacturing conditions. Hysol® GR9820 is an extremely versatile and technologically advanced epoxy molding compound with adhesion properties that can be optimized for varying leadframe metallizations, delivering tremendous production flexibility. The very low-stress, "green" mold compound exhibits ultra low warpage in a matrix package format, with the ability to alter the mold compound resin components to counter-correct "smiling face" or 'crying face" warpage in a wide range of package types. This unique formulation capability ensures the flatness and, thus ease of processing of the device as it moves through the subsequent singulation and board level assembly processes.

"Our materials set approach is distinctive not only because of our demonstrated ability to develop tested, compatible materials for particular applications," states Michael Todd, Technical Director of Research, Design and Engineering for the electronics group of Henkel, "but also for Henkel's expertise in being able to alter and optimize these materials to address very specific manufacturing challenges such as warpage control. This latest material set design is just further proof of this unrivalled capability."

Combining the superior properties of Hysol GR9820 with those of die attach material Hysol QMI536NB provides an advanced material set formula with exceptional user benefits. Unique for this class of materials is Hysol QMI536NB's one-material solution for thin stacked die applications. Traditionally, different die attach materials are used for each of the various layers of a stacked package so as to avoid damage to the die passivation of the first die. Hysol QMI536NB, however, embodies a protective and low-bleed formulation, allowing it to be successfully used for both mother and daughter die. This enables packaging specialists to qualify a single material, thus streamlining the supply chain and reducing manufacturing costs.

"The versatility of each of these materials in and of themselves is unmatched," concludes Todd. "When joined in this customized material set, though, the performance they deliver for SCSP applications and the flexibility they provide to manufacturers make this material set completely untouchable."

For more information on Henkel's Hysol GR9820 and Hysol QMI536NB material set or any of the company's next generation materials combinations, log onto www.electronics.henkel.com or call 949-789-2500.

About the electronics group of Henkel

Henkel is one of the world's leading and most progressive providers of qualified, compatible material sets for semiconductor packaging, board level assembly and advanced soldering solutions. Through its Hysol, Loctite and Multicore brands, and its global customer support infrastructure, the electronics group of Henkel delivers world-class materials products, process expertise and total solutions across the board to enable tomorrow's electronics industry.

Henkel, a Fortune Global 500 company, operates in three strategic business areas: Home Care; Personal care; and Adhesives, Sealants and Surface Treatments, which serves the transportation, electronics, aerospace, metal, durable goods, consumer goods, maintenance and repair and packaging industries, and offers a broad range of products for the craftsman and consumer. With brands and technologies, Henkel makes people's lives easier, better, and more beautiful. 50,000 employees work for Henkel worldwide. People in 125 countries around the world trust in brands and technologies from Henkel - "A Brand like a Friend".

Contact: Henkel Corporation Doug Dixon doug.dixon@us.henkel.com Phone: 949-789-2500 Fax: 949-785-2595 www.electronics.henkel.com

Company Information:
Name: Henkel Loctite Corporation
Address: 1001 Trout Brook Crossing, P.O. Box 4016
City: Rocky Hill
State: CT
ZIP: 06067
Country: USA
Phone: 860-571-5100
FAX: 860-571-5465
http://www.loctite.com

More New Product News from this company:
Jun 20, 2008 - Hot Melt Adhesives come in finger-sized packages.
May 15, 2008 - Lubricant freezes metal parts to penetrate rust layers.
Apr 24, 2008 - Fast-Cure Silicone is stable in harsh environments.
Apr 22, 2008 - Semisolid Primer optimizes anaerobic adhesive performance.
Apr 18, 2008 - Flexible Light Cure Adhesive suits medical device assembly.
Apr 15, 2008 - Spray Insulation bonds insulation to metal ducts/cabinets.
Apr 3, 2008 - Base Coating offers corrosion resistance for light metals.
Apr 3, 2008 - Adhesives are suited for magnet bonding.
Apr 2, 2008 - Low-Odor, Low-Bloom Adhesive bonds to various substrates.
Apr 2, 2008 - Light/Moisture Cure Adhesive bonds to silicones, plastics.

Other News from this company:
May 20, 2008 - Safe, Reliable Construction Adhesive Systems Transform Building Assembly
May 02, 2008 - Web Site Compares Threadlocking Adhesives and Mechanical Fasteners
Mar 28, 2008 - Henkel Honored With Inaugural Prime Source Award From Industrial Distributor, EIS
Mar 28, 2008 - Hisco Honors Henkel As Supplier Of The Year
Oct 15, 2007 - Henkel Promotes Dr. Renzhe Zhao to Technical Manager Position
Sep 17, 2007 - Henkel to Share Materials Expertise at Upcoming IPC Midwest and SMTA International Events
Sep 01, 2007 - Grote Industries Partners with Henkel for Advanced LED Lighting Solution
May 17, 2007 - Henkel's Loctite 3508 Cornerbond Underfill Secures Two Industry Honors
Apr 24, 2007 - Henkel Receives Intel's Preferred Quality Supplier Award
Mar 27, 2007 - New Literature on Adhesives, Sealants and Surface Treatments
Feb 22, 2007 - Dial to Sponsor PDMA Technology Conference
Feb 20, 2007 - Henkel Expands Solder Paste Manufacturing Capacity in India
Feb 20, 2007 - High Performance UV Cure Chamber Accepts Diversity of Part Sizes
Feb 20, 2007 - New Loctite CSP Underfill System from Henkel Enhances Reliability of Hand-Held Devices; Lands Vision Award
Feb 13, 2007 - Literature Overviews Line of Loctite Volumetric Adhesive Dispensing Equipment
Feb 05, 2007 - Henkel to Show Proven Materials Solutions; Launch New Products at APEX 2007
Jan 22, 2007 - Henkel Launches Global Competition for New Ideas
Jan 22, 2007 - New Frekote Water-Based Cleaner Removes Residue from Composite Molds
Jan 11, 2007 - Literature Overviews Loctite Cost Saving Solutions for Manufacturers
Oct 02, 2006 - Henkel Steals the Show at ATExpo 2006

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