450 mm Wireless Wafer Processing Metrology Sensors Support Next-Generation of Semiconductor Production Processes |
Cyberoptics Semiconductor, Inc.
P.O. Box 276
Beaverton, OR, 97075 0276
USA
Press release date: October 10, 2011
CyberOptics Semiconductor offers a line of wireless 450 mm wafer processing metrology sensors to help chipmakers and tool manufacturers qualify next-generation semiconductor production processes.
CyberOptics' 450 mm carbon fiber WaferSense® sensors are designed to obtain precise metrology data to optimize new processing equipment for shrinking 32 nm and 22 nm process tolerances, according to Craig C. Ramsey, Ph.D., CyberOptics Semiconductor's general manager.
CyberOptics' 450 mm sensors allow engineers to level processing equipment, reduce equipment vibration and set three axis wafer-transfer coordinates. Each wafer-like device follows the processing life of a wafer and reports real-time metrology data via a GUI.
The company's line of 450 mm metrology devices is available by special order: the Auto Teaching System (ATS450), Auto Vibration System (AVS450) and Auto Leveling System 2 Vertical (ALS2V450).
Engineers can implement CyberOptics' WaferSense sensors to optimize equipment and tools used to perform processes across the fab: photolithography; etch; diffusion; thin film; implant; metallization; chemical mechanical planarization (CMP) and fab automation.
Detailed information on CyberOptics' WaferSense productsis available online at http://www.cyberopticssemi.com/products or by contacting sales at (503) 495-2200 for more information.
|
|
|
|
|
|
| 
