2E Mechatronic Uses Ticona VectraŽ E840i LDS to Develop 3-D Chip Carrier Produced Via Laser Direct Structuring |
Ticona Engineering Polymers
8040 Dixie Hwy.
Florence, KY, 41042
USA
Press release date: January 12, 2012
15-plus Years MID Technology Experience
Florence, Ky., Sulzbach, Germany, Shanghai, PR China - 2E mechatronic GmbH & Co. KG of Germany has designed a 3-D molded interconnect device (MID) flow sensor for air conditioning systems that uses VectraŽ E840i LDS, a liquid crystal polymer (LCP) specially developed by Ticona for electronic circuits on 3-D injection moldings produced with a Laser Direct Structuring (LDS) process.
Ticona will showcase its Vectra LCP specialty grades for electrical and electronic components at Ticona Booth #218 as part of its DesignCon 2012 exhibit of engineering polymers and halogen-free solutions for Green Electronics from Jan. 31 to Feb. 1 in California at the Santa Clara Convention Center.
As the Research Association Molded Interconnect Devices 3-D-MID-e.V. 2011 MID Innovation Prize winner, the 2E mechatronic MID component is injection molded entirely from Vectra E840i LDS, a laser-activatable grade that Ticona specially developed for use with the LPKF Laser & Electronics AG LDS process. The tracks on the 12-by-10-by-6-millimeter device are etched with LPKF laser equipment that selectively activates the laser sensitive additive in the Ticona LCP.
Vectra E840i LDS, the newest MID specialty grade from Ticona, is:
o 40 percent mineral filled with special LDS additive
o Reflow solderable
o More isotropic than typical glass-filled LCP
"Vectra E840i LDS enables efficient production of 3-D chip carriers when using the LDS process," said Achim Hofmann, EU consumer market development manager. "The 2E mechatronic MID component is injection molded entirely from Vectra E840i LDS, a grade specially developed by Ticona for LDS. Specific areas of the component are activated by LPKF laser to create a circuit pattern that is subsequently electrolysis plated to form conductive tracks."
The advantage of this process is its great flexibility, especially for sensors, microphone modules or ring contacts that can be produced directly and cost-efficiently in low volumes. If the layout of the conductor tracks has to be changed, it is only necessary to reprogram the laser.
2E mechatronic, a leading supplier of MID components, worked on the chip-based sensor project with relay and switch specialist Gruner AG, research institute HSG Hahn-Schickard-Gesellschaft and micro-sensor developer MicroMountains Applications AG, all of Germany.
The leading supplier of MID-components has developed a laser structured MID-LED light component for dental lamps in Vectra 840i LDS. 2E mechatronic sees potential for using MID-LEDs in automats, and house and street lighting. And Harting Mitronics has developed MIDs such as a camera module MID with a Vectra E840i LDS substrate for the Sick V300 Work Station camera.
Vectra LCP: Innovation Driver for Green Electronics
With more than 15 years of experience in MID technology, Ticona developed this latest Vectra LCP grade and designed other Vectra LCP solutions for processing with 3D MID and LDS technologies.
Vectra LCP offers ideal characteristics for the manufacture of complex MIDs:
o Heat Deflection Temperature (HDT) - no softness at reflow peak temperature
o High Melt Temperature - higher safety factor for lead-free soldering
o Excellent flow at thin walls - miniaturization, weight reduction and smaller parts
o Lower humidity absorption - less susceptible for blistering
o Higher flow - less internal part stress, lower warpage
o Low warpage - safety factor for assembly
o High dimensional stability - fewer risks of contact failure
o Low CTE variations - fewer risks of contact failure
o Inherent UL-94 V0 - no fire-retardant additives which could attack metal contacts
o Lower injection cycle time - lower price per part
o No flash
About Ticona and Celanese
Ticona, the engineering polymers business of Celanese Corporation, produces and markets a broad range of high performance products, and posted net sales of $1,109 million in fiscal 2010. Ticona employs more than 1,450 individuals at production, compounding and research facilities in the USA, Germany, Brazil and China. For more information, please visit www.ticona.com or www.ticona.cn (Chinese language).
Celanese Corporation is a global technology leader in the production of specialty materials and chemical products which are used in most major industries and consumer applications. Our products, essential to everyday living, are manufactured in North America, Europe and Asia. Known for operational excellence, sustainability and premier safety performance, Celanese delivers value to customers around the globe with best-in-class technologies. Based in Dallas, Texas, the company employs approximately 7,250 employees worldwide and had 2010 net sales of $5.9 billion, with approximately 72% generated outside of North America. For more information about Celanese Corporation and its global product offerings, visit www.celanese.com.
Contacts:
Americas:
David Perilstein, Press Relations
+1-518-479-7632
Dperilst@nycap.rr.com
Americas:
Robert Shaw, Manager, B2B Marketing Communications
+1-859-372-3117
Robert.Shaw@Ticona.com
Europe:
Henning Kull, Public Relations Manager
+49-69-45009-1797
Henning.Kuell@Ticona.de
Asia:
Amber Zhao, Marketing Communications
+86-21-3861-9222
tong.zhao@ticona.com
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