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Toshiba America Electronic Components, Inc.

9775 Toledo Way, Irvine, CA, 92618, US

  • 949-455-2000
  • 800-879-4963

General Information:
Rebecca Bueno
Phone: 949-462-7885
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Latest New Product News from
Toshiba America Electronic Components (TAEC)

Electronic Components & Devices

Low-Voltage Trench MOSFET comes in 40 V rated version.

March 24, 2015

Based on U-MOS IX-H semiconductor process, 40 V-rated TPHR8504PL comes in 5 x 6 mm SOP-Advance package and offers current rating of 150 A that promotes reliability. Degree of Qoss promotes efficiency in SMPS, including servers and telecom base stations, DC-DC converters, synchronous rectification, and other power management circuitry. Other characteristics include typical Rds(on) of 0.7 mΩ (0.85 mΩ max) and typical output capacitance (Coss) of 1,930 pF. Read More

Sensors, Monitors & Transducers

CMOS Image Sensor targets smartphones and tablets.

March 19, 2015

Featuring 1/3.07 in. optical size and 1.12 micron back-side illuminated pixel pitch, 13 MP Model T4KB3 achieves 200 mW output or less at 30 fps. Bright Mode technology helps prevent underexposed images in high-speed video recording by boosting image brightness up to 4x while realizing full-HD (1080p) video capture at 120 fps equivalent. With 8 Kbit one-time-programmable memory, sensor can store lens shading correction data for 2 different conditions which have different light profiles. Read More

Controls & Controllers, Electronic Components & Devices

LDO Regulator for Mobile Devices uses fine analog IC process.

March 18, 2015

Using fine analog IC process for advanced CMOS, TCR2LN/LE/LF series offers 200 mA output. Fixed output voltages from 0.8–3.6 V are available, and standard features include on/off control input, over-current protection, and auto-discharge option. Characteristics and package size suit mobile devices that require extended battery lives and high-density board assembly, including wearables, smartphones, tablet PCs, and portable games. Read More

Test & Measuring Instruments

Development Kits support embedded and handheld applications.

March 9, 2015

With RBTZ2100-1MA and RBTZ2100-2MA Starter Kits, devices can be evaluated in final application environment. Both kits, built to support TZ2102 single-core ARM® Cortex®-A9-based processors up to 600 MHz, provide reference board and board support package, as well as AC adapter cable and user manual. RBTZ2100-1MA supports processors with 512 MB DDR3L SRAM and 16 MB SPI Flash ROM, while RBTZ2100-2MA supports 256 MB DDR3 SRAM processors with 256 MB parallel Flash ROM. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Application Processors target wearable IoT devices.

March 9, 2015

Suitable for activity monitors and smart watches, ApP Lite™ TZ1011MBG and TZ1031MBG integrate sensors, ARM® Cortex®-M4F processor, 8 Mbit Flash memory, Bluetooth® Low Energy controller, and 3-axis accelerometer. TZ1031MBG additionally incorporates 3-axis gyroscope, while Model TZ1011MBG includes 3-axis gyroscope and 3-axis magnetometer. For measuring weak biomedical signals, products have 24-bit delta-sigma ADC with high-speed switches connected to 3 input channels. Read More

Electronic Components & Devices, Controls & Controllers

Motor Control Pre-Driver IC enables quiet low-power fan operation.

February 18, 2015

Accommodating 3.5–30 V input, TC78B006 series comprises single-phase brushless DC (BLDC) motor control pre-driver ICs available in 5.5 x 6.4 mm SSOP16 or 3 x 3 mm QFN16 package. PWM voltage and pseudo sine-wave current driving functions promote efficient and quiet cooling fan operation in data servers and home appliances, while automatic standby function reduces power consumption when fan is not in use. Additionally, IC can drive 2 external high-side Pch and 2 low-side Nch MOSFETs. Read More

Electronic Components & Devices, Computer Hardware & Peripherals, Controls & Controllers

Microcontrollers suit home appliances and factory automation.

February 4, 2015

Based on ARM® Cortex®-M4F processor, Models TMPM470FDFG and TMPM475FDFG can operate at up to 120 MHz. Both MCUs incorporate 2 modules, each containing programmable motor driver, 12-bit AD converter, and Vector Engine technology, which consists of hardware-based vector control processor for motor control applications. In addition, TMPM475FDFG incorporates CAN controller. Housed in 14 x 14 mm LQFP100 package with 0.5 mm pitch, both devices operate at 4.5–5.5 V. Read More

Electronic Components & Devices

Power Controller IC enables wireless mobile device charging.

January 9, 2015

Supplied in 2.4 x 3.67 x 0.5 mm WCSP-28 package, TC7765WBG is compatible with WPC Qi low-power specification v1.1 and manages 12 W power transfer necessary for wireless charging of tablet devices. Qi Foreign Object Detection compliance prevents heating of metal objects in path of wireless power transfer between receiver and transmitter. Built with mixed-signal process, IC combines modulation and control circuitry with rectifier power pickup, I²C interface, and circuit protection functions. Read More

Communication Systems & Equipment, Electronic Components & Devices

Reference Design suits indoor proximity applications.

January 8, 2015

Housed in 75 x 35 x 12 mm case, Model TC35670 comprises Bluetooth® Low Energy component, NFC Type 3 Tag, and complete system software. Reference model is intended for indoor proximity applications, or beacons, which use BLE to communicate signals detectable by smart devices. TC35670 enables devices to remain in nearly zero power standby, with wakeup mode being engaged by microprocessor's 6-axis sensor or by reader coming into proximity with NFC tag subsystem. Read More

HVAC, Computer Hardware & Peripherals, Controls & Controllers, Electronic Components & Devices

Reference Design aids cooling fan motor control.

January 8, 2015

Reference design, built around TMPM375 MCU with Vector Engine (VE) technology and peripherals, simplifies complex motor control designs in high-performance cooling fans and similar products for servers and data centers. VE technology employs vector control in hardware to aid handling of complex field-oriented vector control and space-vector modulation methods. Options range from single-phase Brushless DC Motor control to Vector Controlled Brushless DC Motor systems. Read More

Computer Hardware & Peripherals

Application Processors enhance sound/image data mining, security.

December 17, 2014

Comprising ApP Lite™ application processors that feature 600 MHz ARM® Cortex®-A9 core with floating point unit (FPU), parallel camera, and external bus interfaces, TZ2100 series enhances audio and image processing as well as improved data security for intelligent communications applications. Products accommodate 16-bit-wide DDR3-800/DDR3L-800 memory modules and feature secure boot system with encryption capability, 1 MB integrated SRAM, and configurable pins. Read More

Electronic Components & Devices

Integrated Circuit supports Bluetooth and NFC tag functions.

December 10, 2014

Supporting both Bluetooth® Low Energy and NFC Type 3 Tag functions, Model TC35670FTG suits Bluetooth Smart devices such as sensors, touch-and-start smartphone accessories, and wearable healthcare devices. IC achieves peak power consumption of 5.9 mA for Bluetooth and 600 µA or lower for NFC Tags. IC's Bluetooth component has receiver sensitivity of -92.5 dBm and transmitter output power of 0 to -20 dBm, while NFC Tag component includes 1.5 KB E²PROM for storing data. Read More

Optics & Photonics

Transistor Output Photocoupler comes in low-profile package.

December 5, 2014

Supplied in 4-pin, SO6L package with 2.3 mm max height, TLP385 operates over -55 to +110°C range, provides creepage and clearance distance of 8 mm (min), and offers isolation voltage of 5 kVrms (min). Current Transfer Ratio (CTR) ranges from 50%–600% @ IF=5 mA, VCE=5V; turn-off (tOff) is 40 µs (typ) @ IF=16 mA, and safety standards met include UL, cUL, VDE, and CQC. Applications include motherboards, PLCs, AC adapters, I/O interface boards, inverter interfaces, and power supplies. Read More

Electronic Components & Devices, Materials & Material Processing

ESD Protection Diode protects high-speed interfaces.

December 4, 2014

Built to protect equipment attached to communication lines, Model DF5G7M2N shields high-speed interfaces such as USB3.1, HDMI®, DisplayPort™, and Thunderbolt™ from static electricity. Device can also protect small portable devices such as smartphones and tablets from ESD events. Housed in 1.3 x 0.8 mm DFN5 package, diode realizes low capacitance of 0.2 pF by optimizing process, suppressing signal quality deterioration, and providing ESD resistance. Read More

Computer Hardware & Peripherals, Controls & Controllers, Electronic Components & Devices, Display & Presentation Equipment

eDP-to-MIPI Dual-DSI Bridge Chipset brings 4K2K UHD to portables.

November 26, 2014

Supplied in 5.0 x 5.0 mm package with 0.5 mm ball pitch, TC358860XBG Embedded DisplayPort™ (eDP™)-to-MIPI® dual-Display Serial Interface (DSI) converter chipset enables 4K2K ultra high definition (UHD) experience for such handheld devices as tablets, phablets, and portable gaming systems. Chip incorporates video format conversion and compression technology and offers refresh rates beyond 60 fps as well as eDP incoming data support for VESA eDP v1.4 from 1.62–5.4 Gbps. Read More

Test & Measuring Instruments, Computer Hardware & Peripherals, Sensors, Monitors & Transducers, Electronic Components & Devices, Optics & Photonics

Automotive Image Recognition Processors aid ADAS implementation.

November 24, 2014

Supporting diverse Advanced Driver Assistance System (ADAS) capabilities, TMPV7608XBG integrates 2 CoHOG accelerators that provide image recognition even in low-light and nighttime conditions. Nighttime pedestrian detection is made possible via color-based gradient analysis of images supplied by multiple full HD (2 MP) connected cameras, and structure-from-motion accelerator enables 3D reconstruction using input stream of monocular camera for detection of stationary obstacles on road surface. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Application Processor enhances wearable device functionality.

November 18, 2014

Intended for low-power wearables requiring power efficiency with basic wireless connectivity requirements, TZ1021MBG ApP Lite™ application processor features embedded ARM® Cortex®-M4F CPU up to 48 MHz with DSP and floating point processing. Fusion of data from multiple sensors, internal and external, is possible. Other features include 8 Mb Flash memory, power management for companion devices, analog front end (AFE) with multiple ADCs, and I/O connectivity via USB, SPI, I²C, GPIO, and UART. Read More

Electronic Components & Devices

GaN-on-Si Based White LEDs come in compact 3535 lens type package.

September 24, 2014

Supplied in 3.5 x 3.5 mm package, LETERAS™ TL1L3 series delivers up to 145 lm typ depending on CCT, which ranges from 2700K to 6500K, and features minimum CRI (Ra) ratings up to 80. Gallium nitride-on-silicon (GaN-on-Si) process technology allows these 1.0 W LEDs to be produced on 200 mm silicon wafers, while integrated lenses make LEDs suitable for use in security lighting, road lights, LED bulbs, and down lights. Height, with lens, is 2.42 mm and operational range is -40 and +100°C. Read More

Electronic Components & Devices, Optics & Photonics

Low-Profile Photocouplers drive IGBTs and power MOSFETs.

September 10, 2014

Comprised of GaAlAs infrared LED and integrated high-gain, high-speed photodetector, Model TLP5751 offers peak output current of +1.0 A and can drive power MOSFETs and low-power IGBTs up to 20 A, while +2.5 A Model TLP5752 and +4.0 A Model TLP5754 will drive power MOSFETs and IGBTs with current ratings to 80 A and 100 A, respectively. Rail-to-rail output devices operate from -40 to +110°C with power supply voltage from 15–30 V and max supply current of 3.0 mA. Read More

Electrical Equipment & Systems, Electronic Components & Devices

Photovoltaic Couplers come in compact SO6 packages.

September 4, 2014

Operating up to 125°C, TLP3905 and TLP3906 feature isolation voltage to 3,750 Vrms (min) and are designed for use in measuring instruments or as MOSFET gate drivers for replacement of mechanical relays without use of external secondary-side power supply. Users can create isolated relay by combining PV coupler with external MOSFET of their choice. TLP3906 integrates control circuit for releasing MOSFET gate charge, providing turn-off speed of 0.3 msec, which is ~1/3 of TLP3905. Read More

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Toshiba America Electronic Components (TAEC)