Company News

Toshiba America Electronic Components, Inc.

9775 Toledo Way, Irvine, CA, 92618, US

  • 949-455-2000
  • 800-879-4963

General Information:
Rebecca Bueno
USA
Phone: 949-462-7885
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Latest New Product News from
Toshiba America Electronic Components (TAEC)

Computer Hardware & Peripherals

Application Processors enhance sound/image data mining, security.

December 17, 2014

Comprising ApP Lite™ application processors that feature 600 MHz ARM® Cortex®-A9 core with floating point unit (FPU), parallel camera, and external bus interfaces, TZ2100 series enhances audio and image processing as well as improved data security for intelligent communications applications. Products accommodate 16-bit-wide DDR3-800/DDR3L-800 memory modules and feature secure boot system with encryption capability, 1 MB integrated SRAM, and configurable pins. Read More

Electronic Components & Devices

Integrated Circuit supports Bluetooth and NFC tag functions.

December 10, 2014

Supporting both Bluetooth® Low Energy and NFC Type 3 Tag functions, Model TC35670FTG suits Bluetooth Smart devices such as sensors, touch-and-start smartphone accessories, and wearable healthcare devices. IC achieves peak power consumption of 5.9 mA for Bluetooth and 600 µA or lower for NFC Tags. IC's Bluetooth component has receiver sensitivity of -92.5 dBm and transmitter output power of 0 to -20 dBm, while NFC Tag component includes 1.5 KB E²PROM for storing data. Read More

Optics & Photonics

Transistor Output Photocoupler comes in low-profile package.

December 5, 2014

Supplied in 4-pin, SO6L package with 2.3 mm max height, TLP385 operates over -55 to +110°C range, provides creepage and clearance distance of 8 mm (min), and offers isolation voltage of 5 kVrms (min). Current Transfer Ratio (CTR) ranges from 50%–600% @ IF=5 mA, VCE=5V; turn-off (tOff) is 40 µs (typ) @ IF=16 mA, and safety standards met include UL, cUL, VDE, and CQC. Applications include motherboards, PLCs, AC adapters, I/O interface boards, inverter interfaces, and power supplies. Read More

Electronic Components & Devices, Materials & Material Processing

ESD Protection Diode protects high-speed interfaces.

December 4, 2014

Built to protect equipment attached to communication lines, Model DF5G7M2N shields high-speed interfaces such as USB3.1, HDMI®, DisplayPort™, and Thunderbolt™ from static electricity. Device can also protect small portable devices such as smartphones and tablets from ESD events. Housed in 1.3 x 0.8 mm DFN5 package, diode realizes low capacitance of 0.2 pF by optimizing process, suppressing signal quality deterioration, and providing ESD resistance. Read More

Electronic Components & Devices, Display & Presentation Equipment, Controls & Controllers, Computer Hardware & Peripherals

eDP-to-MIPI Dual-DSI Bridge Chipset brings 4K2K UHD to portables.

November 26, 2014

Supplied in 5.0 x 5.0 mm package with 0.5 mm ball pitch, TC358860XBG Embedded DisplayPort™ (eDP™)-to-MIPI® dual-Display Serial Interface (DSI) converter chipset enables 4K2K ultra high definition (UHD) experience for such handheld devices as tablets, phablets, and portable gaming systems. Chip incorporates video format conversion and compression technology and offers refresh rates beyond 60 fps as well as eDP incoming data support for VESA eDP v1.4 from 1.62–5.4 Gbps. Read More

Test & Measuring Instruments, Optics & Photonics, Computer Hardware & Peripherals, Electronic Components & Devices, Sensors, Monitors & Transducers

Automotive Image Recognition Processors aid ADAS implementation.

November 24, 2014

Supporting diverse Advanced Driver Assistance System (ADAS) capabilities, TMPV7608XBG integrates 2 CoHOG accelerators that provide image recognition even in low-light and nighttime conditions. Nighttime pedestrian detection is made possible via color-based gradient analysis of images supplied by multiple full HD (2 MP) connected cameras, and structure-from-motion accelerator enables 3D reconstruction using input stream of monocular camera for detection of stationary obstacles on road surface. Read More

Electronic Components & Devices, Computer Hardware & Peripherals

Application Processor enhances wearable device functionality.

November 18, 2014

Intended for low-power wearables requiring power efficiency with basic wireless connectivity requirements, TZ1021MBG ApP Lite™ application processor features embedded ARM® Cortex®-M4F CPU up to 48 MHz with DSP and floating point processing. Fusion of data from multiple sensors, internal and external, is possible. Other features include 8 Mb Flash memory, power management for companion devices, analog front end (AFE) with multiple ADCs, and I/O connectivity via USB, SPI, I²C, GPIO, and UART. Read More

Electronic Components & Devices

GaN-on-Si Based White LEDs come in compact 3535 lens type package.

September 24, 2014

Supplied in 3.5 x 3.5 mm package, LETERAS™ TL1L3 series delivers up to 145 lm typ depending on CCT, which ranges from 2700K to 6500K, and features minimum CRI (Ra) ratings up to 80. Gallium nitride-on-silicon (GaN-on-Si) process technology allows these 1.0 W LEDs to be produced on 200 mm silicon wafers, while integrated lenses make LEDs suitable for use in security lighting, road lights, LED bulbs, and down lights. Height, with lens, is 2.42 mm and operational range is -40 and +100°C. Read More

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