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Toshiba America Electronic Components, Inc.

9775 Toledo Way, Irvine, CA, 92618, US

  • 800-879-4963

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Rebecca Bueno
Phone: 949-462-7885
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Latest New Product News from
Toshiba America Electronic Components (TAEC)

Electronic Components & Devices, Electrical Equipment & Systems

GaN-on-Si LEDs promote luminous efficacy and reduce power draw.

October 8, 2015

Exhibiting luminous efficacy of 165 lm/W min under Ta=25°C, TL1L4 series (4A5B type) utilizes Gallium Nitride-on-silicon (GaN-on-Si) wafer technology and comes in 3.5 x 3.5 mm lens package. Available CCTs are 6500K, 5700K, 5000K, and 4000K, and CRI is Ra70. Supporting max forward current of 1.5 A at Ta<55°C and Tj<150°C, LEDs can serve such applications as street lights, floodlights, high/low bay lights, base lights, and downlights. Read More

Mechanical Power Transmission, Electronic Components & Devices, Controls & Controllers

Brushless Motor Pre-Driver IC targets automotive EPS systems.

September 22, 2015

Developed to be compliant with ASIL D, Model TB9081FG is intended for use in electric power steering systems. Device integrates 3-phase pre-driver circuits, fail-safe relay pre-driver circuits, and motor current detection circuits, with range of failure detection circuits, including VB over/under voltage, VCC over/under, over temperature, and short detection. Housed in 12 x 12 x 1.6 mm LQFP64 package, IC provides 11 pre-driver channels and operates from -40 to 125°C at 4.5–18 V. Read More

Sensors, Monitors & Transducers

BSI CMOS Image Sensors sharply focus on still and moving images.

August 21, 2015

Offering respective resolutions of 8, 13, 16, and 20 MP, backside-illuminated (BSI) CMOS image sensors T4KA3-121, T4KB3-121, T4KC3-121, and T4KA7-121 accelerate capture and playback of sharp video and images in such mobile devices as smartphones and tablets. Phase detection auto-focus (PDAF) technology reduces blur, and other standard features include high dynamic range (HDR), bright mode, and high-speed capture. Output speed reaches 30 fps at full resolution (22 fps for T4KA7-121). Read More

Electronic Components & Devices

Power Receiver IC supports wireless quick charging.

August 20, 2015

Compliant with Qi™ V.1.1.2 wireless low power charging standard, Model TC7764WBG provides max output power of 5 W and max power conversion efficiency of 95%. Wireless charging allows adoption of fully insulated case free of exposed charging ports for waterproof/dustproof smartphones and other mobile devices. Housed in 2.4 x 3.67 x 0.5 mm WCSP28 package, IC integrates protocol authentication circuit for power transfers, foreign object detection, UVLO/OVLO functions, and thermal shutdown.
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Controls & Controllers, Electronic Components & Devices

Output LDO Regulator ICs meet power-critical requirements.

August 13, 2015

Available in fixed output voltages from 0.55–3.6 V and able to drive up to 500 mA, single-output TCR5AM series targets battery power-critical applications requiring LDO. External bias voltage terminal (VBAT), separated from power source input, increases power source efficacy. Along with over-current and over-temperature protections, LDOs feature inrush current protection and under-voltage-lockout function. Power dissipation is 0.6 W for 1.2 x 1.2 x 0.38 mm DFN5B package. Read More

Sensors, Monitors & Transducers

CMOS 16 MP Image Sensors enhance mobile device functionality.

August 11, 2015

Designed for smartphones and tablets, T4KC3 and T4KC3-121 are backside-illuminated (BSI) chips that feature phase detection auto-focus (PDAF). Bright Mode technology, also included, enables HD video capture at 240 fps equivalent, and HDR support enables capture of natural images of scenes with high contrast ratio. Output speeds reach up to 30 fps at full 16 MP (4624 x 3472 pixels) resolution with power consumption of 240 mW or lower. Lower resolutions are supported at higher frame rates. Read More

Electronic Components & Devices, Controls & Controllers

DC Brushed Motor Driver IC is designed for vehicle engines.

June 29, 2015

Used in such vehicle engine applications as electronic throttles and valve controls, TB9051FTG comes in flat 6 x 6 mm P-QFN28 package, features single H-bridge channel, and employs double-diffused MOSFET (DMOS FET) transistors as driver circuits. Devices do not require base current biasing and have virtually no input current, allowing processing of high current density per device area with low on-resistance (0.34 Ω). Resulting low output voltage drop, in turn, enables efficient IC operation. Read More

Optics & Photonics, Electronic Components & Devices

Transistor Photocouplers offer wide operating temperature.

June 25, 2015

Housed in SO16 package with operating temperature of -55 to +125°C, 4-channel TLP292-4 and TLP293-4 offer isolation voltage of 3,750 Vrms for high-density surface mount applications. Both are comprised of phototransistors optically coupled to InGaAs infrared emitting diodes. TLP292-4 is connected in inverse parallel configuration, and can operate directly by AC input current. With collector-emitter voltage of 80 V, devices support low input current while maintaining high current transfer ratio. Read More

Electronic Components & Devices

N-Channel Power MOSFETs target automotive applications.

June 16, 2015

Featuring chip that uses U-MOSVIII-H process in TO-220SM(W) package, Models TK160F10N1 and TK200F04N1L are 100 V/160 A and 40 V/200A MOSFETs, respectively. Devices achieve low on-resistance characteristics of RDS(ON) = 0.78 m (typical) at V(GS) = 10 V for TK200F04N1L and RDS(ON) = 2.0m (typical) at V(GS) = 10 V for TK160F10N1. With low thermal resistance of R(th(ch-c))=0.4°C/W max, both MOSFETs are suited for electric power steering, DC-DC converters, motor drivers, and load switches. Read More

Electronic Components & Devices, Computer Hardware & Peripherals

Application Processors target Internet of Things.

April 21, 2015

Based on ARM® Cortex®-A9 dual-core CPU, ApP Lite™ TZ5010XBG and TZ5011XBG incorporate built-in baseband for high-speed Wi-Fi® 802.11ac, graphics, and video engine. ApP Lite™ TZ5021XB and TZ5023XBG support LP-DDR2/3 memory, specialized low-power mode for mobile devices, and small package size for IoT applications. Additionally, TZ5023XBG includes Cadence® Tensilica® HiFi Mini DSP, which executes voice, audio, and sensor processing. All models feature Imagination PowerVR SGX540 GPU. Read More

Electronic Components & Devices, Computer Hardware & Peripherals

Microcontroller provides secure communications use.

April 14, 2015

Based on ARM® Cortex®-M4F processor with core operable up to 120 MHz, TMPM46BF10FG comes in 14 x 14 x 0.5 mm LQFP100 package and supports 1–4 Gb SLC NAND Flash memory. Features include 514 KB SRAM, 4 security circuits for network communications, SLC NAND Flash memory controller, as well as 4- and 8-bit error correction circuits. Watchdog timer operates along with built-in clock separate from system clock, and IC also implements true random number generator. Read More

Electronic Components & Devices, Electrical Equipment & Systems

Power MOSFET Gate Driver suits automotive applications.

April 8, 2015

Housed in 2.8 x 2.9 mm PS-8 package, single-channel Model TPD7104F enables use of N-channel power MOSFETs for high-side switching applications. IC features self-contained charge pump that optimizes MOSFET switch and eliminates need for external components. Providing overcurrent protection and diagnostic functions, device is suited for automotive applications using 12 V batteries to operate N-channel MOSFETs, including semiconductor relays and load switches. Read More

Electrical Equipment & Systems, Electronic Components & Devices

Single-Lane SPDT Switches support 3rd generation PCI Express.

April 3, 2015

Single-lane, 2 differential channel SPDT bus switch ICs – TC7PCI3212MT and TC7PCI3215MT – support PCIe Gen3 (8 Gbps) and achieve bandwidth characteristics of 11.5 GHz at -3 dB. These characteristics enable high-speed transmission with minimized signal degradation. Also, bandwidth minimizes attenuation of signal amplitude by inserting switch and can pass through GHz high-speed differential signals. Configurations promote optimal arrangements of PCIe slots, connectors, and switches.
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Electronic Components & Devices, Computer Hardware & Peripherals

NAND Flash Memory Modules support command queuing.

April 3, 2015

Available in densities from 16–128 GB, NAND Flash Memory Modules integrate NAND chips fabricated with Toshiba's 15 nm second generation process technology and are fully compliant with JEDEC e-MMC v5.1 standard. Command queuing feature enables users to store multiple tasks in queue, which are then performed in order of user's preference. With secure write protection feature, important data stored in assigned, secure areas cannot be overwritten or erased by unauthenticated users. Read More

Electronic Components & Devices

Low-Voltage Trench MOSFET comes in 40 V rated version.

March 24, 2015

Based on U-MOS IX-H semiconductor process, 40 V-rated TPHR8504PL comes in 5 x 6 mm SOP-Advance package and offers current rating of 150 A that promotes reliability. Degree of Qoss promotes efficiency in SMPS, including servers and telecom base stations, DC-DC converters, synchronous rectification, and other power management circuitry. Other characteristics include typical Rds(on) of 0.7 mΩ (0.85 mΩ max) and typical output capacitance (Coss) of 1,930 pF. Read More

Sensors, Monitors & Transducers

CMOS Image Sensor targets smartphones and tablets.

March 19, 2015

Featuring 1/3.07 in. optical size and 1.12 micron back-side illuminated pixel pitch, 13 MP Model T4KB3 achieves 200 mW output or less at 30 fps. Bright Mode technology helps prevent underexposed images in high-speed video recording by boosting image brightness up to 4x while realizing full-HD (1080p) video capture at 120 fps equivalent. With 8 Kbit one-time-programmable memory, sensor can store lens shading correction data for 2 different conditions which have different light profiles. Read More

Controls & Controllers, Electronic Components & Devices

LDO Regulator for Mobile Devices uses fine analog IC process.

March 18, 2015

Using fine analog IC process for advanced CMOS, TCR2LN/LE/LF series offers 200 mA output. Fixed output voltages from 0.8–3.6 V are available, and standard features include on/off control input, over-current protection, and auto-discharge option. Characteristics and package size suit mobile devices that require extended battery lives and high-density board assembly, including wearables, smartphones, tablet PCs, and portable games. Read More

Test & Measuring Instruments

Development Kits support embedded and handheld applications.

March 9, 2015

With RBTZ2100-1MA and RBTZ2100-2MA Starter Kits, devices can be evaluated in final application environment. Both kits, built to support TZ2102 single-core ARM® Cortex®-A9-based processors up to 600 MHz, provide reference board and board support package, as well as AC adapter cable and user manual. RBTZ2100-1MA supports processors with 512 MB DDR3L SRAM and 16 MB SPI Flash ROM, while RBTZ2100-2MA supports 256 MB DDR3 SRAM processors with 256 MB parallel Flash ROM. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Application Processors target wearable IoT devices.

March 9, 2015

Suitable for activity monitors and smart watches, ApP Lite™ TZ1011MBG and TZ1031MBG integrate sensors, ARM® Cortex®-M4F processor, 8 Mbit Flash memory, Bluetooth® Low Energy controller, and 3-axis accelerometer. TZ1031MBG additionally incorporates 3-axis gyroscope, while Model TZ1011MBG includes 3-axis gyroscope and 3-axis magnetometer. For measuring weak biomedical signals, products have 24-bit delta-sigma ADC with high-speed switches connected to 3 input channels. Read More

Electronic Components & Devices, Controls & Controllers

Motor Control Pre-Driver IC enables quiet low-power fan operation.

February 18, 2015

Accommodating 3.5–30 V input, TC78B006 series comprises single-phase brushless DC (BLDC) motor control pre-driver ICs available in 5.5 x 6.4 mm SSOP16 or 3 x 3 mm QFN16 package. PWM voltage and pseudo sine-wave current driving functions promote efficient and quiet cooling fan operation in data servers and home appliances, while automatic standby function reduces power consumption when fan is not in use. Additionally, IC can drive 2 external high-side Pch and 2 low-side Nch MOSFETs. Read More

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Toshiba America Electronic Components (TAEC)