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Toshiba America Electronic Components, Inc.

9775 Toledo Way, Irvine, CA, 92618, US

  • 800-879-4963

General Information:
Rebecca Bueno
Phone: 949-462-7885
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Latest New Product News from
Toshiba America Electronic Components (TAEC)

Optics & Photonics, Electronic Components & Devices

IC Photocouplers target intelligent power module drives.

February 5, 2016

Housed in compact SO6L package, buffer logic type TLP2745 and inverter logic type TLP2748 feature 120 ns max propagation delay time, 40 ns max pulse width distortion, and 70 ns max propagation delay skew. Devices provide creepage distance of 8 mm and isolation voltage of 5,000 Vrms, and are designed to support wide supply voltage range of V(CC) = 4.5–30 V. By having low threshold input current of 1.6 mA max, photocouplers make bufferless direct drive from microcomputers possible. Read More

Optics & Photonics

High-Speed Photocoupler withstands extreme temperatures.

January 22, 2016

Sustaining data rates up to 20 Mbps, Model TLP2768A is suitable for high-speed communication interfaces in factory automation systems, measurement and control equipment, and plasma display panels. Open-collector output allows for both sink and source drive implementations. Supplied in ultra-thin S06L package that maintains creepage/clearance distance up to 8 mm, TLP2768A operates from -40 to 125°C, supports 3.3 and 5.5 V power supplies, and achieves minimum isolation voltage of 5,000 Vrms. Read More

Electronic Components & Devices, Electrical Equipment & Systems

Load Switch ICs are designed for USB Type-C devices.

December 9, 2015

With 3 A max output current and 28 V max input voltage, TCK30x series suits devices conforming to USB Type-C™ specifications (for USB PD). Products comes in 0.5 mm pitch, 1.5 x 1.5 mm WCSP, support auto-power source select mode without need for external control, and offer daisy chain connection. Other features include on-resistance of 73 mΩ @V(IN)=4.5 V as well as built-in over voltage lock out (OVLO), reverse current blocking, thermal shutdown, under voltage lockout (ULVO) protections.
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Electronic Components & Devices

Wireless Power Receiver IC complies with Qi v1.2.

November 27, 2015

With 15 W maximum output power, Model TC7766WBG provides all functions needed, including rectifier circuits and controllers, to construct standalone wireless power transfer RX system. Device features max output current of 1.7 A, output voltage range of 5–14 V, and Qi Foreign Object Detection functions. Housed in 2.4 x 3.67 x 0.5 mm WCSP28 package, chip is compatible with I2C interface and allows for rapid wireless charging of smartphones, tablets, and handheld devices. Read More

Electronic Components & Devices, Test & Measuring Instruments, Electrical Equipment & Systems, Optics & Photonics

Isolation Amplifiers utilize delta-sigma AD converter.

November 13, 2015

Able to detect small electric current and voltage fluctuations, Models TLP7820 and TLP7920 are suitable for use in inverters, servo amplifiers, robots, and power supplies. Delta-sigma ADC at input side enables linearity of 0.02% (typ.) @ NL (200) for analog output products and 3LSB (typ.) @ INL for digital output products. With Common-Mode Transient Immunity of 20 kV/µs, optical coupled amplifiers offer stable operation in electrically noisy environments. Isolation voltage is 5,000 Vrms (min). Read More

Electronic Components & Devices

NAND Flash Memory Chips target embedded applications.

October 26, 2015

Available in 6 x 8 mm WSON and 10.3 x 7.5 mm SOP packages, Serial Interface NAND Series consists of 12 products with voltage ratings of 3.3 V or 1.8 V and densities of 1, 2, and 4 Gb. Devices include high-speed sequential read function, embedded ECC with bit flip count report function, and data protection features that can protect specific blocks. Typical embedded applications include flat screen TVs, printers, wearable devices, and robots. Read More

Sensors, Monitors & Transducers, Test & Measuring Instruments

CMOS Image Sensor features iris recognition technology.

October 13, 2015

Supporting iris recognition, 2.1 MP T4KE1 optimizes security on mobile devices. Sensor features optical size of 1/7.3 in., pixel pitch of 1.12 µm BSI, and image output of 60 fps at 1080p. MIPI CSI-2 serial interface facilitates integration into end products, while picture flipping function allows images to be flipped horizontally and vertically. By omitting color filter in pixel structure, sensor can capture images for recognition with higher sensitivity than conventional CMOS image sensors. Read More

Electronic Components & Devices, Electrical Equipment & Systems

GaN-on-Si LEDs promote luminous efficacy and reduce power draw.

October 8, 2015

Exhibiting luminous efficacy of 165 lm/W min under Ta=25°C, TL1L4 series (4A5B type) utilizes Gallium Nitride-on-silicon (GaN-on-Si) wafer technology and comes in 3.5 x 3.5 mm lens package. Available CCTs are 6500K, 5700K, 5000K, and 4000K, and CRI is Ra70. Supporting max forward current of 1.5 A at Ta<55°C and Tj<150°C, LEDs can serve such applications as street lights, floodlights, high/low bay lights, base lights, and downlights. Read More

Mechanical Power Transmission, Electronic Components & Devices, Controls & Controllers

Brushless Motor Pre-Driver IC targets automotive EPS systems.

September 22, 2015

Developed to be compliant with ASIL D, Model TB9081FG is intended for use in electric power steering systems. Device integrates 3-phase pre-driver circuits, fail-safe relay pre-driver circuits, and motor current detection circuits, with range of failure detection circuits, including VB over/under voltage, VCC over/under, over temperature, and short detection. Housed in 12 x 12 x 1.6 mm LQFP64 package, IC provides 11 pre-driver channels and operates from -40 to 125°C at 4.5–18 V. Read More

Sensors, Monitors & Transducers

BSI CMOS Image Sensors sharply focus on still and moving images.

August 21, 2015

Offering respective resolutions of 8, 13, 16, and 20 MP, backside-illuminated (BSI) CMOS image sensors T4KA3-121, T4KB3-121, T4KC3-121, and T4KA7-121 accelerate capture and playback of sharp video and images in such mobile devices as smartphones and tablets. Phase detection auto-focus (PDAF) technology reduces blur, and other standard features include high dynamic range (HDR), bright mode, and high-speed capture. Output speed reaches 30 fps at full resolution (22 fps for T4KA7-121). Read More

Electronic Components & Devices

Power Receiver IC supports wireless quick charging.

August 20, 2015

Compliant with Qi™ V.1.1.2 wireless low power charging standard, Model TC7764WBG provides max output power of 5 W and max power conversion efficiency of 95%. Wireless charging allows adoption of fully insulated case free of exposed charging ports for waterproof/dustproof smartphones and other mobile devices. Housed in 2.4 x 3.67 x 0.5 mm WCSP28 package, IC integrates protocol authentication circuit for power transfers, foreign object detection, UVLO/OVLO functions, and thermal shutdown.
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Controls & Controllers, Electronic Components & Devices

Output LDO Regulator ICs meet power-critical requirements.

August 13, 2015

Available in fixed output voltages from 0.55–3.6 V and able to drive up to 500 mA, single-output TCR5AM series targets battery power-critical applications requiring LDO. External bias voltage terminal (VBAT), separated from power source input, increases power source efficacy. Along with over-current and over-temperature protections, LDOs feature inrush current protection and under-voltage-lockout function. Power dissipation is 0.6 W for 1.2 x 1.2 x 0.38 mm DFN5B package. Read More

Sensors, Monitors & Transducers

CMOS 16 MP Image Sensors enhance mobile device functionality.

August 11, 2015

Designed for smartphones and tablets, T4KC3 and T4KC3-121 are backside-illuminated (BSI) chips that feature phase detection auto-focus (PDAF). Bright Mode technology, also included, enables HD video capture at 240 fps equivalent, and HDR support enables capture of natural images of scenes with high contrast ratio. Output speeds reach up to 30 fps at full 16 MP (4624 x 3472 pixels) resolution with power consumption of 240 mW or lower. Lower resolutions are supported at higher frame rates. Read More

Electronic Components & Devices, Controls & Controllers

DC Brushed Motor Driver IC is designed for vehicle engines.

June 29, 2015

Used in such vehicle engine applications as electronic throttles and valve controls, TB9051FTG comes in flat 6 x 6 mm P-QFN28 package, features single H-bridge channel, and employs double-diffused MOSFET (DMOS FET) transistors as driver circuits. Devices do not require base current biasing and have virtually no input current, allowing processing of high current density per device area with low on-resistance (0.34 Ω). Resulting low output voltage drop, in turn, enables efficient IC operation. Read More

Optics & Photonics, Electronic Components & Devices

Transistor Photocouplers offer wide operating temperature.

June 25, 2015

Housed in SO16 package with operating temperature of -55 to +125°C, 4-channel TLP292-4 and TLP293-4 offer isolation voltage of 3,750 Vrms for high-density surface mount applications. Both are comprised of phototransistors optically coupled to InGaAs infrared emitting diodes. TLP292-4 is connected in inverse parallel configuration, and can operate directly by AC input current. With collector-emitter voltage of 80 V, devices support low input current while maintaining high current transfer ratio. Read More

Electronic Components & Devices

N-Channel Power MOSFETs target automotive applications.

June 16, 2015

Featuring chip that uses U-MOSVIII-H process in TO-220SM(W) package, Models TK160F10N1 and TK200F04N1L are 100 V/160 A and 40 V/200A MOSFETs, respectively. Devices achieve low on-resistance characteristics of RDS(ON) = 0.78 m (typical) at V(GS) = 10 V for TK200F04N1L and RDS(ON) = 2.0m (typical) at V(GS) = 10 V for TK160F10N1. With low thermal resistance of R(th(ch-c))=0.4°C/W max, both MOSFETs are suited for electric power steering, DC-DC converters, motor drivers, and load switches. Read More

Electronic Components & Devices, Computer Hardware & Peripherals

Application Processors target Internet of Things.

April 21, 2015

Based on ARM® Cortex®-A9 dual-core CPU, ApP Lite™ TZ5010XBG and TZ5011XBG incorporate built-in baseband for high-speed Wi-Fi® 802.11ac, graphics, and video engine. ApP Lite™ TZ5021XB and TZ5023XBG support LP-DDR2/3 memory, specialized low-power mode for mobile devices, and small package size for IoT applications. Additionally, TZ5023XBG includes Cadence® Tensilica® HiFi Mini DSP, which executes voice, audio, and sensor processing. All models feature Imagination PowerVR SGX540 GPU. Read More

Electronic Components & Devices, Computer Hardware & Peripherals

Microcontroller provides secure communications use.

April 14, 2015

Based on ARM® Cortex®-M4F processor with core operable up to 120 MHz, TMPM46BF10FG comes in 14 x 14 x 0.5 mm LQFP100 package and supports 1–4 Gb SLC NAND Flash memory. Features include 514 KB SRAM, 4 security circuits for network communications, SLC NAND Flash memory controller, as well as 4- and 8-bit error correction circuits. Watchdog timer operates along with built-in clock separate from system clock, and IC also implements true random number generator. Read More

Electronic Components & Devices, Electrical Equipment & Systems

Power MOSFET Gate Driver suits automotive applications.

April 8, 2015

Housed in 2.8 x 2.9 mm PS-8 package, single-channel Model TPD7104F enables use of N-channel power MOSFETs for high-side switching applications. IC features self-contained charge pump that optimizes MOSFET switch and eliminates need for external components. Providing overcurrent protection and diagnostic functions, device is suited for automotive applications using 12 V batteries to operate N-channel MOSFETs, including semiconductor relays and load switches. Read More

Electrical Equipment & Systems, Electronic Components & Devices

Single-Lane SPDT Switches support 3rd generation PCI Express.

April 3, 2015

Single-lane, 2 differential channel SPDT bus switch ICs – TC7PCI3212MT and TC7PCI3215MT – support PCIe Gen3 (8 Gbps) and achieve bandwidth characteristics of 11.5 GHz at -3 dB. These characteristics enable high-speed transmission with minimized signal degradation. Also, bandwidth minimizes attenuation of signal amplitude by inserting switch and can pass through GHz high-speed differential signals. Configurations promote optimal arrangements of PCIe slots, connectors, and switches.
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Toshiba America Electronic Components (TAEC)