Company News

Toshiba America Electronic Components, Inc.

9775 Toledo Way, Irvine, CA, 92618, US

  • 949-455-2000
  • 800-879-4963

General Information:
Rebecca Bueno
USA
Phone: 949-462-7885
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Latest New Product News from
Toshiba America Electronic Components (TAEC)

Electronic Components & Devices

Power Controller IC enables wireless mobile device charging.

January 9, 2015

Supplied in 2.4 x 3.67 x 0.5 mm WCSP-28 package, TC7765WBG is compatible with WPC Qi low-power specification v1.1 and manages 12 W power transfer necessary for wireless charging of tablet devices. Qi Foreign Object Detection compliance prevents heating of metal objects in path of wireless power transfer between receiver and transmitter. Built with mixed-signal process, IC combines modulation and control circuitry with rectifier power pickup, I²C interface, and circuit protection functions. Read More

Communication Systems & Equipment, Electronic Components & Devices

Reference Design suits indoor proximity applications.

January 8, 2015

Housed in 75 x 35 x 12 mm case, Model TC35670 comprises Bluetooth® Low Energy component, NFC Type 3 Tag, and complete system software. Reference model is intended for indoor proximity applications, or beacons, which use BLE to communicate signals detectable by smart devices. TC35670 enables devices to remain in nearly zero power standby, with wakeup mode being engaged by microprocessor's 6-axis sensor or by reader coming into proximity with NFC tag subsystem. Read More

HVAC, Computer Hardware & Peripherals, Controls & Controllers, Electronic Components & Devices

Reference Design aids cooling fan motor control.

January 8, 2015

Reference design, built around TMPM375 MCU with Vector Engine (VE) technology and peripherals, simplifies complex motor control designs in high-performance cooling fans and similar products for servers and data centers. VE technology employs vector control in hardware to aid handling of complex field-oriented vector control and space-vector modulation methods. Options range from single-phase Brushless DC Motor control to Vector Controlled Brushless DC Motor systems. Read More

Computer Hardware & Peripherals

Application Processors enhance sound/image data mining, security.

December 17, 2014

Comprising ApP Lite™ application processors that feature 600 MHz ARM® Cortex®-A9 core with floating point unit (FPU), parallel camera, and external bus interfaces, TZ2100 series enhances audio and image processing as well as improved data security for intelligent communications applications. Products accommodate 16-bit-wide DDR3-800/DDR3L-800 memory modules and feature secure boot system with encryption capability, 1 MB integrated SRAM, and configurable pins. Read More

Electronic Components & Devices

Integrated Circuit supports Bluetooth and NFC tag functions.

December 10, 2014

Supporting both Bluetooth® Low Energy and NFC Type 3 Tag functions, Model TC35670FTG suits Bluetooth Smart devices such as sensors, touch-and-start smartphone accessories, and wearable healthcare devices. IC achieves peak power consumption of 5.9 mA for Bluetooth and 600 µA or lower for NFC Tags. IC's Bluetooth component has receiver sensitivity of -92.5 dBm and transmitter output power of 0 to -20 dBm, while NFC Tag component includes 1.5 KB E²PROM for storing data. Read More

Optics & Photonics

Transistor Output Photocoupler comes in low-profile package.

December 5, 2014

Supplied in 4-pin, SO6L package with 2.3 mm max height, TLP385 operates over -55 to +110°C range, provides creepage and clearance distance of 8 mm (min), and offers isolation voltage of 5 kVrms (min). Current Transfer Ratio (CTR) ranges from 50%–600% @ IF=5 mA, VCE=5V; turn-off (tOff) is 40 µs (typ) @ IF=16 mA, and safety standards met include UL, cUL, VDE, and CQC. Applications include motherboards, PLCs, AC adapters, I/O interface boards, inverter interfaces, and power supplies. Read More

Electronic Components & Devices, Materials & Material Processing

ESD Protection Diode protects high-speed interfaces.

December 4, 2014

Built to protect equipment attached to communication lines, Model DF5G7M2N shields high-speed interfaces such as USB3.1, HDMI®, DisplayPort™, and Thunderbolt™ from static electricity. Device can also protect small portable devices such as smartphones and tablets from ESD events. Housed in 1.3 x 0.8 mm DFN5 package, diode realizes low capacitance of 0.2 pF by optimizing process, suppressing signal quality deterioration, and providing ESD resistance. Read More

Computer Hardware & Peripherals, Controls & Controllers, Electronic Components & Devices, Display & Presentation Equipment

eDP-to-MIPI Dual-DSI Bridge Chipset brings 4K2K UHD to portables.

November 26, 2014

Supplied in 5.0 x 5.0 mm package with 0.5 mm ball pitch, TC358860XBG Embedded DisplayPort™ (eDP™)-to-MIPI® dual-Display Serial Interface (DSI) converter chipset enables 4K2K ultra high definition (UHD) experience for such handheld devices as tablets, phablets, and portable gaming systems. Chip incorporates video format conversion and compression technology and offers refresh rates beyond 60 fps as well as eDP incoming data support for VESA eDP v1.4 from 1.62–5.4 Gbps. Read More

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Toshiba America Electronic Components (TAEC)