Qualcomm
San Diego, CA 92121
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Front End Solution enables global LTE design for mobile devices.
Addressing cellular RF band fragmentation to enable single global 4G LTE design for mobile devices,Ã- Qualcomm RF360 Front End Solution includes envelope power tracker for 3G/4G LTE mobile devices,Ã- dynamic antenna matching tuner, integrated power amplifier/antenna switch, and 3D-RF packaging solution incorporating key front end components. Product is designed to work seamlessly, reduce...
Read More »Qualcomm Expands Gobi Brand to Cover Complete Mobile Connectivity Portfolio
Expands Gobi Modem Brand for Notebooks and e-Readers to Consumer, Enterprise and M2M Applications -- SAN DIEGO, -- Qualcomm Incorporated (NASDAQ: QCOM) today announced it will expand the usage of its Gobi(TM) modem brand, currently the industry choice for 3G/4G-LTE modems for notebooks and tablets, to cover the company's complete modem product portfolio, including the successful MDM chipset...
Read More »Qualcomm Announces Snapdragon S4 Pro Processor
BARCELONA, Spain -- Qualcomm Incorporated (NASDAQ: QCOM) announced today that the Company will offer a Pro version of the Snapdragon(TM) S4 MSM8960 processor to enable even more capable mobile computing devices. The successful Snapdragon S4 class, which has more than 120 OEM designs in development, is already raising the bar on performance and industry benchmarking, as reported in recent product...
Read More »Qualcomm's DSP Access Program Debuts
- Program Enables Manufacturers (OEMs) and Independent Software Vendors (ISVs) to Optimize Multimedia Solutions Utilizing Qualcomm Audio and Video Acceleration Hardware - SAN DIEGO -- Qualcomm Incorporated (Nasdaq: QCOM) today announced that OEMs and ISVs will now be able to program their own audio and video codecs using optimized processors and hardware on select versions of Qualcomm's Mobile...
Read More »Femtocell Chipsets deliver 3G broadband to homes/offices.
Femtocell Station Modem(TM) (FSM(TM)) chipsets utilize 3GPP HSPA+ broadband speeds as well as CDMA2000Ã-®, including 1X and EV-DO Rev. A and Rev. B. They include baseband functions, network listen, and integrated RF capabilities for all major wireless bands. Suited for residential and enterprise applications, chipsets also feature techniques that address interference between femtocells and...
Read More »Qualcomm Expands HSPA+ Product Portfolio, Continuing its Leadership for Immersive Mobile Multimedia Experiences
-- New Family of Solutions Features Powerful Multimedia Performance, Dual-carrier HSPA+ and Integrated RF/FM/Bluetooth/GPS Chip -- SAN DIEGO, Feb. 12 /-- Qualcomm Incorporated (NASDAQ:QCOM), a leading developer and innovator of advanced wireless technologies, products and services, today unveiled a new family of chipset solutions that expand its HSPA+ product portfolio. The new HSPA+ products,...
Read More »Chipset targets mass-market smartphones.
Utilizing HSDPA/HSUPA for broadband data speeds over 3G networks, Mobile Station Modem(TM) MSM7227(TM) can support leading mobile operating systems, including Android, Symbian S60, Windows MobileÃ-®, and BREWÃ-® Mobile Platform. Chipset features 600 MHz applications processor with floating point unit, 320 MHz application DSP, and 400 MHz modem processor, as well as hardware-accelerated 3D...
Read More »HP and Qualcomm to Deliver Options for Worldwide Internet Access
BARCELONA, Spain, Feb. 11 - HP and Qualcomm today announced that they are working together to incorporate Qualcomm's Gobi(TM) global mobile Internet technology in select 2008 HP business notebooks to enable high-speed connectivity on 3G UMTS HSPA/EV-DO networks with a single wireless solution. Gobi technology enhances HP notebook customers' choice of mobile operators and will help increase...
Read More »Hisense Reveals Design of First Mobile Phone to Incorporate mirasol Displays
Ultra Low-power Handset to Begin Shipping in China in 2008 BARCELONA, Spain, Feb. 11 - Qualcomm MEMS Technologies, Inc., a wholly owned subsidiary of Qualcomm Incorporated (NASDAQ:QCOM), and Qingdao Hisense Communication Co., Ltd. (HCC), today announced the design specifications of the much anticipated Hisense C108 mobile phone that will become the industry's first handset with Qualcomm MEMS...
Read More »Qualcomm, Telefonica Espana and Huawei Technologies Complete UMTS/HSDPA 900 MHz Field Trial
o Trial Validates Multiple Network Gains by Increasing Cell Radius Up to 70 Percent Using 900 MHz Spectrum MADRID, Spain, Feb. 11 -- Qualcomm Incorporated (NASDAQ:QCOM), Telefonica Espana and Huawei Technologies today announced the completion of a 3G UMTS and HSDPA field trial using 900 MHz spectrum in Talarrubias, located in the Extremadura region of Spain. The trial results validated that UMTS...
Read More »Front End Solution enables global LTE design for mobile devices.
Addressing cellular RF band fragmentation to enable single global 4G LTE design for mobile devices,Ã- Qualcomm RF360 Front End Solution includes envelope power tracker for 3G/4G LTE mobile devices,Ã- dynamic antenna matching tuner, integrated power amplifier/antenna switch, and 3D-RF packaging solution incorporating key front end components. Product is designed to work seamlessly, reduce...
Read More »Qualcomm Expands Gobi Brand to Cover Complete Mobile Connectivity Portfolio
Expands Gobi Modem Brand for Notebooks and e-Readers to Consumer, Enterprise and M2M Applications -- SAN DIEGO, -- Qualcomm Incorporated (NASDAQ: QCOM) today announced it will expand the usage of its Gobi(TM) modem brand, currently the industry choice for 3G/4G-LTE modems for notebooks and tablets, to cover the company's complete modem product portfolio, including the successful MDM chipset...
Read More »Qualcomm Announces Snapdragon S4 Pro Processor
BARCELONA, Spain -- Qualcomm Incorporated (NASDAQ: QCOM) announced today that the Company will offer a Pro version of the Snapdragon(TM) S4 MSM8960 processor to enable even more capable mobile computing devices. The successful Snapdragon S4 class, which has more than 120 OEM designs in development, is already raising the bar on performance and industry benchmarking, as reported in recent product...
Read More »Qualcomm's DSP Access Program Debuts
- Program Enables Manufacturers (OEMs) and Independent Software Vendors (ISVs) to Optimize Multimedia Solutions Utilizing Qualcomm Audio and Video Acceleration Hardware - SAN DIEGO -- Qualcomm Incorporated (Nasdaq: QCOM) today announced that OEMs and ISVs will now be able to program their own audio and video codecs using optimized processors and hardware on select versions of Qualcomm's Mobile...
Read More »Enterproid Wins Second Annual Qualcomm Ventures QPrize Venture Investment Competition
Company Earns US$250,000 in Venture Funding SAN DIEGO, Feb. 28, 2011 - Qualcomm Incorporated (Nasdaq: QCOM) today announced the winner of the second annual Qualcomm Ventures QPrize(TM) international venture investment competition at the DEMO Spring 2011 conference. Enterproid, a U.S. company, took top honors against tough competition from five other regional winners representing Europe, China,...
Read More »Registration Opens for Uplinq 2011 Mobile Ecosystem Conference
Hosted by Qualcomm, Conference Focuses on Building Business Around Mobile Apps and Data Services SAN DIEGO, Feb. 16, 2011 - Qualcomm Incorporated (Nasdaq: QCOM) today announced that registration for the Uplinq(TM) 2011 wireless ecosystem conference is now open at www.uplinq.com. Uplinq is the only wireless ecosystem conference that brings together developers and publishers, device makers, mobile...
Read More »Qualcomm Announces Finalists in Second Annual QPrize Venture Investment Competition
Six Regional Companies Each Earn US$100,000 in Early-stage Funding and Advance to Final Round of Competition at DEMO Spring 2011 SAN DIEGO, Jan. 31, 2011 - Qualcomm Incorporated (Nasdaq: QCOM) today revealed the six regional finalists for its Qualcomm Ventures' QPrize(TM) venture investment competition. The six companies representing China, Europe, India, Israel, Korea and North America prevailed...
Read More »Qualcomm and Duracell to Explore Working Together to Bring Benefits of Wireless Power to Consumer Electronics Market
LAS VEGAS, Jan. 6, 2011 - Qualcomm Incorporated (Nasdaq: QCOM) and Duracell today announced the signing of a non-binding Letter of Intent (LOI) to explore the possibility of working together to develop an industry alliance that supports and promotes flexible coupling-based wireless power solutions to the consumer electronics industry. Qualcomm and Duracell hope to pave the way for broad OEM and...
Read More »Qualcomm Signs Letter of Intent with Powermat to Investigate New Wireless Power Solutions for Consumers
Emerging Wireless Technologies Paving the Way For Next Generation of Wireless Powering Solutions LAS VEGAS, Jan. 6, 2011 - Qualcomm Incorporated (Nasdaq: QCOM) and Powermat Ltd., the leader in wireless power, announced the signing of a non-binding Letter of Intent (LOI) to explore the possibilities of developing cutting-edge wireless power solutions. According to the terms of the LOI, Qualcomm...
Read More »Qualcomm to Acquire Atheros, Leader in Connectivity & Networking Solutions
Accelerates Expansion of Company's Semiconductor Business into Adjacent Markets SAN DIEGO and SAN JOSE, Calif., Jan. 5, 2011 - Qualcomm Incorporated (Nasdaq: QCOM) and Atheros Communications, Inc. (Nasdaq: ATHR), today announced that they have entered into a definitive agreement whereby Qualcomm intends to acquire Atheros, a leader in innovative technologies for wireless and wired local area...
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