Asyst & Partners
Fremont, CA 94538
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Single-Reticle Pod transports and stores 150 mm reticles.
RSP-150 SMIF-POD(TM) features metal-free, gasket-sealed construction minimizing opacity, particle contamination, and drying time, while maximizing cleanability without disassembly. Streamlined design increases storage density. Optional AdvanTag(TM) tracking system with integrated RFID ties into socket built into unit to enable snap-on use of RFID transponder pill. For use in 300 mm fabs, optional...
Read More »Wafer Transport Robot replaces processed wafer in 4 seconds.
Axys(TM) FastSwap atmospheric robot uses dual-yaw wrist architecture enabling wrist/end effectors to rotate 360Ã-
Read More »Front-End System is optimized for 300 mm wafer applications.
Plus(TM) Portal XT incorporates IsoPort(TM) 300 mm load port, which includes configurable front-opening unified pod latch-key mechanism, multiple info pad and mechanical pins, and multiple E-84 ports. It also includes FastSwap(TM) wafer-handling robot, which uses dual-yaw wrist architcture to conduct rapid wafer exchanges in and out of OEM's tool. Smart-Plus(TM) control system interface ensures...
Read More »Software optimizes front-end tool and FOUP utilization.
SMART-Fab(TM) suite incorporates AdvanTag(TM) wafer identification and tracking technology to create 300 mm automation software tools. Tools include SMART(TM) WIP for work-in-process lot monitoring and buffer handling; FOUP Management System, which tracks usage and maintenance of front-opening unified pods (FOUPs) and stores FOUP history data; and 300FL Monitoring System. System tracks front-load...
Read More »Load Port handles 300 mm semiconductor wafers.
Automated IsoPort(TM) has front-opening-unified-pod (FOUP) tool carrier interface, servo-controlled motion, latchkey, and carrier sensing. Tool throughput is 8 sec, from carrier arrival to first-wafer access. Contamination control conforms to ISO Class 1 particle level, and eliminates triboelectric charge buildup on carrier door. Optional gas purge ports provide an inert ambient environment for...
Read More »Load Port and Pod meet SEMI standards.
Model G3 front-opening unified pod (FOUP) and SMIF-300FL(TM) Front-Load Series 3-EP load port offer particle cleanliness, as well as interoperability and transition capabilities to 300mm equipment. G3 FOUP features integrated bottom conveyor groove, metal-free door with fail-safe 300mm load port docking and integrated ID tracking. SMIF-300FL Series 3-EP 300mm load port features options for...
Read More »Single-Reticle Pod transports and stores 150 mm reticles.
RSP-150 SMIF-POD(TM) features metal-free, gasket-sealed construction minimizing opacity, particle contamination, and drying time, while maximizing cleanability without disassembly. Streamlined design increases storage density. Optional AdvanTag(TM) tracking system with integrated RFID ties into socket built into unit to enable snap-on use of RFID transponder pill. For use in 300 mm fabs, optional...
Read More »Wafer Transport Robot replaces processed wafer in 4 seconds.
Axys(TM) FastSwap atmospheric robot uses dual-yaw wrist architecture enabling wrist/end effectors to rotate 360Ã-
Read More »Front-End System is optimized for 300 mm wafer applications.
Plus(TM) Portal XT incorporates IsoPort(TM) 300 mm load port, which includes configurable front-opening unified pod latch-key mechanism, multiple info pad and mechanical pins, and multiple E-84 ports. It also includes FastSwap(TM) wafer-handling robot, which uses dual-yaw wrist architcture to conduct rapid wafer exchanges in and out of OEM's tool. Smart-Plus(TM) control system interface ensures...
Read More »Software optimizes front-end tool and FOUP utilization.
SMART-Fab(TM) suite incorporates AdvanTag(TM) wafer identification and tracking technology to create 300 mm automation software tools. Tools include SMART(TM) WIP for work-in-process lot monitoring and buffer handling; FOUP Management System, which tracks usage and maintenance of front-opening unified pods (FOUPs) and stores FOUP history data; and 300FL Monitoring System. System tracks front-load...
Read More »Load Port handles 300 mm semiconductor wafers.
Automated IsoPort(TM) has front-opening-unified-pod (FOUP) tool carrier interface, servo-controlled motion, latchkey, and carrier sensing. Tool throughput is 8 sec, from carrier arrival to first-wafer access. Contamination control conforms to ISO Class 1 particle level, and eliminates triboelectric charge buildup on carrier door. Optional gas purge ports provide an inert ambient environment for...
Read More »Load Port and Pod meet SEMI standards.
Model G3 front-opening unified pod (FOUP) and SMIF-300FL(TM) Front-Load Series 3-EP load port offer particle cleanliness, as well as interoperability and transition capabilities to 300mm equipment. G3 FOUP features integrated bottom conveyor groove, metal-free door with fail-safe 300mm load port docking and integrated ID tracking. SMIF-300FL Series 3-EP 300mm load port features options for...
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