Novellus Systems, Inc.
San Jose, CA 95134
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PECVD System supports sub-28 nm dielectric films.
Incorporating interface engineering to minimize RC delay constant without changing materials, VECTOR-® Excel(TM) addresses needs of advanced technology nodes that require pre- and/or post-processing of dielectric films, such as diffusion barriers. System's PECVD module employs multi-station sequential deposition architecture that results in optimal wafer-to-wafer, within-wafer, and...
Read More »PECVD System supports sub-28 nm dielectric films.
Incorporating interface engineering to minimize RC delay constant without changing materials, VECTORÃ-® Excel(TM) addresses needs of advanced technology nodes that require pre- and/or post-processing of dielectric films, such as diffusion barriers. System's PECVD module employs multi-station sequential deposition architecture that results in optimal wafer-to-wafer, within-wafer, and...
Read More »Double Side Lapping System aids silicon wafer manufacturing.
Equipped with 2,100 mm OD lapping wheel, AC-2100L microLine-® can process up to twenty 300 mm prime silicon wafers in one batch with sub-micron precision. It can also process up to eight 450 mm wafers. Along with independently driven inner and outer pin rings, features include automatic force calibration, in-situ wafer thickness metrology, and contactless gauges. Latter controls lapping wheel...
Read More »Double Side Lapping System aids silicon wafer manufacturing.
Equipped with 2,100 mm OD lapping wheel, AC-2100L microLineÃ-® can process up to twenty 300 mm prime silicon wafers in one batch with sub-micron precision. It can also process up to eight 450 mm wafers. Along with independently driven inner and outer pin rings, features include automatic force calibration, in-situ wafer thickness metrology, and contactless gauges. Latter controls lapping...
Read More »High-Throughput PECVD System serves semiconductor industry.
Intended for memory manufacturers, VECTOR-® Extreme(TM) TEOS xT(TM) plasma enhanced chemical vapor deposition (PECVD) system delivers production throughput in excess of 300 wafers per hour using DPC(TM) hardware for deposition rate optimization, RapidClean(TM) for accelerated chamber cleans, and xT(TM) wafer handler for precision wafer placement. With fewer than 10 particle adders per wafer for...
Read More »High-Throughput PECVD System serves semiconductor industry.
Intended for memory manufacturers, VECTORÃ-® Extreme(TM) TEOS xT(TM) plasma enhanced chemical vapor deposition (PECVD) system delivers production throughput in excess of 300 wafers per hour using DPC(TM) hardware for deposition rate optimization, RapidClean(TM) for accelerated chamber cleans, and xT(TM) wafer handler for precision wafer placement. With fewer than 10 particle adders per wafer...
Read More »Novellus Introduces Conformal Film Deposition Technology for Sub-32nm Front-End-of-Line and Double Patterning Applications
Dielectric films deposited on the VECTOR® platform demonstrate ALD-like step coverage with furnace-quality film properties SAN JOSE, Calif. -- Novellus Systems (NASDAQ:NVLS) announced today that it has developed conformal film deposition (CFD(TM)) technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1. The innovative CFD technology...
Read More »Novellus Introduces Conformal Film Deposition Technology for Sub-32nm Front-End-of-Line and Double Patterning Applications
Dielectric films deposited on the VECTOR-® platform demonstrate ALD-like step coverage with furnace-quality film properties SAN JOSE, Calif. -- Novellus Systems (NASDAQ:NVLS) announced today that it has developed conformal film deposition (CFD(TM)) technology for depositing 100 percent step coverage dielectric films on structures with aspect ratios of up to 4:1. The innovative CFD technology...
Read More »3D Electroplating System simplifies wafer level packaging.
SABRE 3D electroplating system has modular architecture that delivers processes such as copper through-silicon vias, copper redistribution layers, pillars, under-bump metallization, and lead-free micro-bumping. Enabling multi-layer processing, system includes TurboCell(TM) technology for through-resist plating applications that improves film uniformity and alloy consistency. It also features...
Read More »3D Electroplating System simplifies wafer level packaging.
SABRE 3D electroplating system has modular architecture that delivers processes such as copper through-silicon vias, copper redistribution layers, pillars, under-bump metallization, and lead-free micro-bumping. Enabling multi-layer processing, system includes TurboCell(TM) technology for through-resist plating applications that improves film uniformity and alloy consistency. It also features...
Read More »PECVD System supports sub-28 nm dielectric films.
Incorporating interface engineering to minimize RC delay constant without changing materials, VECTOR-® Excel(TM) addresses needs of advanced technology nodes that require pre- and/or post-processing of dielectric films, such as diffusion barriers. System's PECVD module employs multi-station sequential deposition architecture that results in optimal wafer-to-wafer, within-wafer, and...
Read More »PECVD System supports sub-28 nm dielectric films.
Incorporating interface engineering to minimize RC delay constant without changing materials, VECTORÃ-® Excel(TM) addresses needs of advanced technology nodes that require pre- and/or post-processing of dielectric films, such as diffusion barriers. System's PECVD module employs multi-station sequential deposition architecture that results in optimal wafer-to-wafer, within-wafer, and...
Read More »Double Side Lapping System aids silicon wafer manufacturing.
Equipped with 2,100 mm OD lapping wheel, AC-2100L microLine-® can process up to twenty 300 mm prime silicon wafers in one batch with sub-micron precision. It can also process up to eight 450 mm wafers. Along with independently driven inner and outer pin rings, features include automatic force calibration, in-situ wafer thickness metrology, and contactless gauges. Latter controls lapping wheel...
Read More »Double Side Lapping System aids silicon wafer manufacturing.
Equipped with 2,100 mm OD lapping wheel, AC-2100L microLineÃ-® can process up to twenty 300 mm prime silicon wafers in one batch with sub-micron precision. It can also process up to eight 450 mm wafers. Along with independently driven inner and outer pin rings, features include automatic force calibration, in-situ wafer thickness metrology, and contactless gauges. Latter controls lapping...
Read More »High-Throughput PECVD System serves semiconductor industry.
Intended for memory manufacturers, VECTOR-® Extreme(TM) TEOS xT(TM) plasma enhanced chemical vapor deposition (PECVD) system delivers production throughput in excess of 300 wafers per hour using DPC(TM) hardware for deposition rate optimization, RapidClean(TM) for accelerated chamber cleans, and xT(TM) wafer handler for precision wafer placement. With fewer than 10 particle adders per wafer for...
Read More »High-Throughput PECVD System serves semiconductor industry.
Intended for memory manufacturers, VECTORÃ-® Extreme(TM) TEOS xT(TM) plasma enhanced chemical vapor deposition (PECVD) system delivers production throughput in excess of 300 wafers per hour using DPC(TM) hardware for deposition rate optimization, RapidClean(TM) for accelerated chamber cleans, and xT(TM) wafer handler for precision wafer placement. With fewer than 10 particle adders per wafer...
Read More »Novellus Announces Availability of the Webcast of Its Presentation at the 13th Annual Needham Growth Conference
SAN JOSE, Calif., Dec. 22, 2010 - Novellus Systems, Inc. (Nasdaq: NVLS) today announced that the company will present on Thursday, January 13, 2011, at the 13th Annual Needham Growth Conference. The presentation will begin at 10:40 a.m. EST and will be made available over the Internet via a live webcast. The live webcast presentation may be accessed via Novellus' Investor Relations home page at...
Read More »Novellus Announces Availability of the Webcast of Its Presentation at the 13th Annual Needham Growth Conference
SAN JOSE, Calif., Dec. 22, 2010 - Novellus Systems, Inc. (Nasdaq: NVLS) today announced that the company will present on Thursday, January 13, 2011, at the 13th Annual Needham Growth Conference. The presentation will begin at 10:40 a.m. EST and will be made available over the Internet via a live webcast. The live webcast presentation may be accessed via Novellus' Investor Relations home page at...
Read More »Novellus Systems, Inc. Announces Participation at Investor Conferences
SAN JOSE, Calif., Aug. 25 -- Novellus Systems, Inc. (NASDAQ:NVLS) today announced the schedule of upcoming presentations that will be available to the public via webcast: o September 8, 2010 - 2010 Citi Technology Conference, 3:00 p.m. EDT o September 13, 2010 - Bank of America Merrill Lynch 2010 Investment Conference, 11:00 a.m. PDA A live webcast of the presentations may be accessed via...
Read More »Novellus Systems, Inc. Announces Participation at Investor Conferences
SAN JOSE, Calif., Aug. 25 -- Novellus Systems, Inc. (NASDAQ:NVLS) today announced the schedule of upcoming presentations that will be available to the public via webcast: o September 8, 2010 - 2010 Citi Technology Conference, 3:00 p.m. EDT o September 13, 2010 - Bank of America Merrill Lynch 2010 Investment Conference, 11:00 a.m. PDA A live webcast of the presentations may be accessed via...
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