Company News

Master Bond, Inc.

154 Hobart St., Hackensack, NJ, 07601, USA

  • 866-213-7652

Latest New Product News from
Master Bond, Inc.

Adhesives & Sealants

EP30TC Epoxy offers 7-10 x 10-6 K.m2/W thermal resistance.

February 4, 2017

Suitable for use in bonding, coating, sealing and encapsulating for aerospace and OEM industries, EP30TC Epoxy provides 2.60-2.88 W/(m.K) thermal conductivity. Having 5,000-6,000 psi tensile strength with 24,000-26,000 psi compressive strength, epoxy is used in -100°F to +300°F temperature range. Available in ½ pint, pint, quart, gallon and 5 gallon container kits, EP30TC offers over 1014... Read More

Adhesives & Sealants

EP3HTND-2Med Black Curing Epoxy meets USP Class VI standards.

January 12, 2017

Available in ½ pints, pints, quarts, gallons and 5 gallon containers, EP3HTND-2Med Black Curing Epoxy features 5,000-6,000 psi tensile strength. Having 1,600-1,800 psi tensile lap shear strength at room temperature, product bonds to glass, metals and ceramics. Used in -60°F to +400°F temperature, material provides resistance to sterilization methods such as chemical sterilants, EtO,... Read More

Adhesives & Sealants

Conductive Adhesive/Sealant passes NASA low outgassing tests.

August 24, 2016

Effective for grounding, shielding, and static dissipation, EP21TDCN-LO electrically conductive, 2-component adhesive/sealant features nickel filler and passes ASTM E595 tests for NASA low outgassing. Chemical-resistant product bonds to similar and dissimilar substrates. Along with 5-10 ohm-cm resistivity and 11 BTU•in/ft²•hr•Â°F thermal conductivity, properties include... Read More

Adhesives & Sealants

One-Component Epoxy Adhesive meets NASA outgassing specifications.

January 14, 2016

Applied in bond lines as thin as 10–15 microns, Master Bond Supreme 18TC contains thermally conductive fillers. This smooth paste system offers thermal resistance of 5–7 x 10-6 K•m²/W and thermal conductivity of 22–25 BTU•in/ft²•hr•Â°F. Able to maintain bond strength even when exposed to hostile environmental conditions, product bonds to diverse substrates... Read More

Adhesives & Sealants

Non-Drip Epoxy Paste cures optically clear.

September 1, 2015

Formulated to cure optically clear in thin sections, even though Part A is translucent and Part B is light amber, 2-component EP21NDCL is suited for bonding, sealing, and coating applications. Product has 1:1 mix ratio by weight or volume, which can be adjusted to deliver different properties. Curing at room temperature, paste provides high tensile lap shear, tensile, and compressive strength of... Read More

Adhesives & Sealants

One-Component No Mix Epoxy features rapid cure properties.

August 18, 2015

Used for bonding, sealing, potting, and encapsulation, EP3RR-80 cures in 45–50 min at 175°F or 25–30 min at 250°F. Thermally conductive, electrically insulative, and dimensionally stable compound forms bonds to metals, composites, ceramics, glass, and plastics. Working life is unlimited at ambient temperatures, and minimized exotherm enables curing in thicker sections up to and beyond... Read More

Adhesives & Sealants

Structural Bonding Epoxy has high-strength, one-part formula.

July 1, 2015

Suited for aerospace and specialty OEM industries, Master Bond® EP13SPND-2 offers respective tensile lap shear strength, compressive strength, and tensile modulus of over 3,000 psi, 18,000 psi, and 500,000–550,000 psi. Single-component nature aids handling and does not require mixing prior to use. Serviceable from -60 to +500°F, chemical-resistant and dimensionally stable epoxy has... Read More

Adhesives & Sealants

Epoxy Polysulfide System exhibits high thermal conductivity.

May 20, 2015

Along with 9-10 BTU•in/ft²•hr•Â°F thermal conductivity, EP21TPFL-1AO electrically insulative, 2-part system exhibits chemical resistance and offers 150%–200% elongation, 70-90 Shore A hardness, and 2:3 mix ratio by weight or volume. Black and white color coding facilitates mixing, and working life is 90–120 min at 75°F. Curing fully at ambient temperatures,... Read More

Adhesives & Sealants, Paints & Coatings

Two-Part Epoxy Paste has ultra low thermal resistance.

April 7, 2015

Master Bond EP48TC has thermal resistance of 5–7 x 10–6 K•m2/W, which enables thermal conductivity of 20–25 BTU•in/ft2•hr•Â°F. Applied in bond lines as thin as 10–15 microns, epoxy paste has tensile lap shear strength from 900–1,100 psi and bonds to metals, composites, glass, ceramic, and plastics. Working life for 100 gram batch at 75°F is 90–120 min. Curing at room... Read More

Adhesives & Sealants

Thermally Conductive Epoxy suits die attach applications.

November 3, 2014

Adhering to metals, ceramics, and silicon dies, Supreme 3HTND-2DA cures in 5–10 min at 150°C, offers die shear strength of 19–21 kg-f, and is serviceable from -100 to +400°F. One-part, electrically insulative epoxy passes NASA low outgassing test specifications and has low ionics, particularly chlorine at <15 ppm. As toughened system, product can withstand rigorous thermal cycling and... Read More

Adhesives & Sealants

Single-Component, Snap Cure Epoxy exhibits high strength.

August 5, 2014

Curing in 1–2 min at 300°F, Master Bond EP3SP5FL has flowable, moderate viscosity and adheres to such substrates as metals, composites, glass, ceramics, rubbers, and plastics. Tensile lap shear strength exceeds 2,000 psi at room temperature when bonding aluminum to aluminum. Also acting as effective electrical insulator, epoxy has -60 to +200°F service range. At ambient... Read More

Adhesives & Sealants

Thermally Conductive Epoxy is also electrically insulative.

October 29, 2013

Used for such applications as bonding, sealing, glob top, and die attach, Supreme 3HTND-2GT is thermally stable, with service range of -100 to +400°F; dimensionally stable; and capable of withstanding thermal cycling and shocks. Single-component system does not require mixing and bonds to various substrates used in electronics, including metals, composites, ceramics, and plastics. Able to be... Read More

Adhesives & Sealants, Materials & Material Processing

Non-Drip Epoxy can be used in indirect food applications.

October 3, 2013

With thick paste consistency, Master Bond® EP21NDFG bonds to diverse substrates – metals, composites, glass, ceramics, rubbers, plastics – and will not run or sag even when applied to vertical surfaces. Bonds resist thermal cycling as well as chemicals, including water, oils, fuels, acids, bases, and salts. This 2-component, room temperature cure epoxy has non-critical one to one... Read More

Adhesives & Sealants, Paints & Coatings

Epoxy Adhesive/Sealant/Coating cures over 170-175°F range.

July 16, 2013

Able to cure in 20–30 min at 170 to 175°F or 10–15 min at 250°F, Supreme 3HT-80 does not require any mixing prior to use, has unlimited working life, and can be stored in conventional refrigerators. Single-component, 100% reactive system, offering optimal properties when cured at 250°F, bonds to various substrates — metals, composites, glass, ceramics, vulcanized rubbers, plastics... Read More

Adhesives & Sealants

Medical Grade Epoxy has high glass transition temperature.

July 12, 2013

Used for bonding, sealing, and coating, Master Bond UV10TKMed passes USP Class VI testing and meets requirements of ISO 10993-5 for cytotoxicity. One-part, optically clear system has service temperature range of -60 to +450°F and glass transition temperature that exceeds 140°C. Resistant to repeated sterilization, this 100% reactive product cures readily in 20–30 sec when exposed to UV... Read More

Materials & Material Processing, Paints & Coatings

Conductive Sodium Silicate is available for EMI/RFI shielding.

June 4, 2013

Formulated for applications where EMI/RFI shielding is required, aqueous-based MB600S can be brushed or sprayed with proper equipment, will cure at room temperature in 24–48 hr or in 1–2 hr at 80°C, and has 0 to +700°F service range. Silver gray colored conductive coating, tested to IEEE 299, 2006 methods, exhibits effectiveness of 95–105 dB from 100 MHz to 2 GHz. Above 2 GHz,... Read More

Adhesives & Sealants, Safety & Security Equipment

Two Part, Flame-Retardant Epoxy cures at room temperature.

May 2, 2013

Compliant with UL 94V-0 specification, EP21FRNS-2 epoxy has non-halogen filler and suits potting, encapsulation, and casting applications. Moderate viscosity epoxy features 1:1 mix ratio by weight and withstands exposure to chemicals, water, fuels, lubricants, and acids. Serviceable over -51 to +90°C temperature range, product bonds metals, glass, ceramics, and many plastics. It is available... Read More

Adhesives & Sealants

High-Strength Epoxy meets NASA low outgassing specifications.

July 26, 2012

Able to adhere to metals, glass, ceramics, and plastics and withstand temperatures from 4K to +400°F, Supreme 10HT exhibits tensile shear strength in excess of 3,600 psi and T-peel strength up to 30 pli. Flexibility and toughness foster resistance to thermal cycling, mechanical shock, vibration, and stress fatigue cracking. Able to withstand exposure to variety of chemicals, single-part system... Read More

Adhesives & Sealants

One-Part Epoxy adheres to metal and ceramics.

February 24, 2012

Primarily used for testing adhesion or cohesive strength of flame sprayed coatings as per ASTM C633 specification, Master Bond EP15 features tensile strength exceeding 12,000 psi at room temperature and viscosity of 40,000-65,000 cps. Chemical-resistant product is serviceable from -60 to 250°F and withstands thermal cycling. Applied with brush, paint roller, or spatula, 100% reactive system... Read More

Adhesives & Sealants

Epoxy Adhesive/Sealant meets USP Class VI requirements.

January 13, 2012

Suited for medical applications, silver-filled EP3HTSMED is 100% reactive with tensile shear strength exceeding 1,000 psi and volume resistivity less than 0.001 Wcm. Thixotropic paste requires no mixing and needs only contact pressure during heat cure of 20-40 min at 300°F or 40-90 min at 250°F. Serviceable over temperature range of -60 to 400°F, electrically... Read More

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Master Bond, Inc.