Nordson Sonoscan
Elk Grove Village, IL 60007
Wafer Inspection Systems support warped wafer scanning.
C-SAMÃ-® systems are available with Quantitative Dynamic Z™ (Q-DZ) surface tracking feature, which allowsÃ- for scanning of warped silicon wafers. All devices are imaged at depth of interest, all internal features remain in focus and within gate, and all rejects are identified without any false rejects due to warpage. Additionally, Q-DZ outputs contour coefficients/parameters, such as...
Read More »
Acoustic Microscope delivers fast and flexible scanning.
Completely automated and convertible to perform full laboratory analysis, Model DF2400™ offers SECS-II/GEM E30 and SMEMA compatibility and is suited for inspecting ICs and flip chips in JEDEC-style trays or metal carriers as well as lead frame strips, IGBT power modules, and other components. Throughput is optimized due toÃ- two transducers and two simultaneous scanning stages. Dedicated...
Read More »
Viewing Nondestructively in 60-Micron Slices
Elk Grove Village, IL - Sonoscan, Inc., the maker of acoustic micro imaging systems, has demonstrated the single-scan imaging of a sample at 50 different depths, or gates. The technique, called PolyGate(TM) , yields 50 images that show internal features at each depth. In conventional imaging, much wider gates are used to confine imaging to a single depth of interest such as the die face or lead...
Read More »
Software offers FFT filtering capabilities.
Virtual Sample Mode allows user to view single-frequency images of internal defects or other features. Fast Fourier Transform filtering utilizes multiple-frequency echoes of acoustic micro imaging. Transducer pulses range of frequencies around 230 MHz into sample. Reflection from interface alters frequency distribution, but return echo encompasses similar range of frequencies....
Read More »Microscope System identifies defects.
Acoustic microscope system, VRM C-SAM, employs Frequency Domain algorithm to extract subtle defect information not seen in conventional pulse-echo imaging. Storing complete 3D of raw data lets high-resolution images be reconstructed later, without original sample. VRM C-SAM inspects individual components, trays of components and components assembled onto printed wiring boards or hybrid substrates...
Read More »Wafer Inspection Systems support warped wafer scanning.
C-SAMÃ-® systems are available with Quantitative Dynamic Z™ (Q-DZ) surface tracking feature, which allowsÃ- for scanning of warped silicon wafers. All devices are imaged at depth of interest, all internal features remain in focus and within gate, and all rejects are identified without any false rejects due to warpage. Additionally, Q-DZ outputs contour coefficients/parameters, such as...
Read More »
Acoustic Microscope delivers fast and flexible scanning.
Completely automated and convertible to perform full laboratory analysis, Model DF2400™ offers SECS-II/GEM E30 and SMEMA compatibility and is suited for inspecting ICs and flip chips in JEDEC-style trays or metal carriers as well as lead frame strips, IGBT power modules, and other components. Throughput is optimized due toÃ- two transducers and two simultaneous scanning stages. Dedicated...
Read More »
Viewing Nondestructively in 60-Micron Slices
Elk Grove Village, IL - Sonoscan, Inc., the maker of acoustic micro imaging systems, has demonstrated the single-scan imaging of a sample at 50 different depths, or gates. The technique, called PolyGate(TM) , yields 50 images that show internal features at each depth. In conventional imaging, much wider gates are used to confine imaging to a single depth of interest such as the die face or lead...
Read More »
Software offers FFT filtering capabilities.
Virtual Sample Mode allows user to view single-frequency images of internal defects or other features. Fast Fourier Transform filtering utilizes multiple-frequency echoes of acoustic micro imaging. Transducer pulses range of frequencies around 230 MHz into sample. Reflection from interface alters frequency distribution, but return echo encompasses similar range of frequencies....
Read More »Microscope System identifies defects.
Acoustic microscope system, VRM C-SAM, employs Frequency Domain algorithm to extract subtle defect information not seen in conventional pulse-echo imaging. Storing complete 3D of raw data lets high-resolution images be reconstructed later, without original sample. VRM C-SAM inspects individual components, trays of components and components assembled onto printed wiring boards or hybrid substrates...
Read More »