Tra-Con, Inc.
Bedford, MA 01730
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Adhesive is formulated for strength and flexibility.
Epoxy-casting compound, TRA-CAST 316C01, is low-viscosity material that exhibits minimal residual stress and near-zero shrinkage. Able to bond to ceramics, glass, plastics, and metals, product offers self-sealing properties that make it useful for electronics and aerospace applications. Electrical insulator is resistant to water, weather, gases and vapors, petroleum products, mild acids and...
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Adhesive is suited for bonding semiporous materials.
Available in pre-mixed and frozen syringes, TRA-BOND 342-14T single-component, alumina-filled epoxy adhesive has low-viscosity formulation that exhibits thermal shock resistance. Material may be cured overnight at ambient conditions or at elevated temperatures for accelerated cure time. It adheres to various substrates and is suited for bonding materials such as ferrite, which require physical,...
Read More »Low Viscosity Adhesive offers Tg of 90-
TRA-BOND F110 is optically clear, low viscosity adhesive. Two-part epoxy can be room temperature or heat cured, and provides thin bond line on applications involving prisms, lenses, and other optical components. Adhesive exhibits wicking and wetting characteristics, offers high strength structural bond, and bonds to glass, ceramics, metals, and most rigid plastics.
Read More »Epoxy Adhesive features low viscosity.
TRA-BOND F113SC epoxy adhesive is formulated for fiber optics, LED displays, lenses and other optical components. It provides high bond strength and low stress connections with no pistoning. Featuring Tg of 95Ã-
Read More »Epoxy Compound offers electrical potting and encapsulation.
Providing optimized wetting characteristics, 2-part TRA-CAST 3103 adheres to glass, ceramics, and most metals and plastics. When fully cured, product offers electrical insulator with impact and thermal shock resistance. Material can be room temperature or heat cured and exhibits ultimate Tg of 80Ã-
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Transparent Compound is suited for optical applications.
TRA-BOND 546S01 is low-viscosity, UV-curable material that exhibits minimal shrinkage during cure to minimize stress. Rigid material also has secondary heat curing system to achieve its optimal Tg of 88Ã-
Read More »Flexible Epoxy Adhesive is electrically conductive.
Suited for electronic bonding, coating, and sealing applications that require flexibility, silver, 2-part Tra-Duct 926K01 offers working time that enables it to be used for high-speed component attachment. It creates electrically and thermally conducting bonds and coatings between materials such as metals, ceramics, glass, and plastic insulates. Suited for auto-dispense, product has medium...
Read More »Epoxy Adhesive meets casting application requirements.
With 90 Shore D hardness and 60 min working life, TRA-CAST 3145 is thermally conductive and electrically insulating. Black, medium-viscosity casting system can be cured in 24 hr at ambient temperatures or more quickly at elevated temperatures. NASA outgassing-approved, product has 100% reactive solids content and coefficient of expansion that allows it to bond to various materials. It is useful...
Read More »Epoxy Staking Compound provides electrical insulation.
Two-part, medium-viscosity TRA-BOND 2112 offers room temperature or heat cure, and once cured, provides resistance to weather, galvanic action, petroleum products, alcohol, salts, and other organic and inorganic compounds. Solvent-free thixotropic adhesive features glass transition temperature of 93Ã-
Read More »Epoxy Compound passes NASA outgassing specifications.
Two-part, thixotropic TRA-BOND 2151 is heat conductive, electrically insulating, and can be room temperature or heat cured. Coefficient of thermal expansion allows bonds to surfaces including metals, silica, alumina, ceramics, glass, and plastics. Product is suited for staking transistors, diodes, resistors, integrated circuits, and other heat-sensitive applications.
Read More »
Adhesive is formulated for strength and flexibility.
Epoxy-casting compound, TRA-CAST 316C01, is low-viscosity material that exhibits minimal residual stress and near-zero shrinkage. Able to bond to ceramics, glass, plastics, and metals, product offers self-sealing properties that make it useful for electronics and aerospace applications. Electrical insulator is resistant to water, weather, gases and vapors, petroleum products, mild acids and...
Read More »
Adhesive is suited for bonding semiporous materials.
Available in pre-mixed and frozen syringes, TRA-BOND 342-14T single-component, alumina-filled epoxy adhesive has low-viscosity formulation that exhibits thermal shock resistance. Material may be cured overnight at ambient conditions or at elevated temperatures for accelerated cure time. It adheres to various substrates and is suited for bonding materials such as ferrite, which require physical,...
Read More »Epoxy Adhesive features low viscosity.
TRA-BOND F113SC epoxy adhesive is formulated for fiber optics, LED displays, lenses and other optical components. It provides high bond strength and low stress connections with no pistoning. Featuring Tg of 95Ã-
Read More »Low Viscosity Adhesive offers Tg of 90-
TRA-BOND F110 is optically clear, low viscosity adhesive. Two-part epoxy can be room temperature or heat cured, and provides thin bond line on applications involving prisms, lenses, and other optical components. Adhesive exhibits wicking and wetting characteristics, offers high strength structural bond, and bonds to glass, ceramics, metals, and most rigid plastics.
Read More »Epoxy Compound offers electrical potting and encapsulation.
Providing optimized wetting characteristics, 2-part TRA-CAST 3103 adheres to glass, ceramics, and most metals and plastics. When fully cured, product offers electrical insulator with impact and thermal shock resistance. Material can be room temperature or heat cured and exhibits ultimate Tg of 80Ã-
Read More »
Transparent Compound is suited for optical applications.
TRA-BOND 546S01 is low-viscosity, UV-curable material that exhibits minimal shrinkage during cure to minimize stress. Rigid material also has secondary heat curing system to achieve its optimal Tg of 88Ã-
Read More »Flexible Epoxy Adhesive is electrically conductive.
Suited for electronic bonding, coating, and sealing applications that require flexibility, silver, 2-part Tra-Duct 926K01 offers working time that enables it to be used for high-speed component attachment. It creates electrically and thermally conducting bonds and coatings between materials such as metals, ceramics, glass, and plastic insulates. Suited for auto-dispense, product has medium...
Read More »Epoxy Adhesive meets casting application requirements.
With 90 Shore D hardness and 60 min working life, TRA-CAST 3145 is thermally conductive and electrically insulating. Black, medium-viscosity casting system can be cured in 24 hr at ambient temperatures or more quickly at elevated temperatures. NASA outgassing-approved, product has 100% reactive solids content and coefficient of expansion that allows it to bond to various materials. It is useful...
Read More »Epoxy Staking Compound provides electrical insulation.
Two-part, medium-viscosity TRA-BOND 2112 offers room temperature or heat cure, and once cured, provides resistance to weather, galvanic action, petroleum products, alcohol, salts, and other organic and inorganic compounds. Solvent-free thixotropic adhesive features glass transition temperature of 93Ã-
Read More »Epoxy Compound passes NASA outgassing specifications.
Two-part, thixotropic TRA-BOND 2151 is heat conductive, electrically insulating, and can be room temperature or heat cured. Coefficient of thermal expansion allows bonds to surfaces including metals, silica, alumina, ceramics, glass, and plastics. Product is suited for staking transistors, diodes, resistors, integrated circuits, and other heat-sensitive applications.
Read More »