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Indium Corporation

34 Robinson Rd., Clinton, NY, 13323, US

  • 315-853-4900
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Latest New Product News from
Indium Corporation

Materials & Material Processing

Free-Flowing Gallium Trichloride comes in granulated form.

September 12, 2014

Via its granulated form, EZ-Pour™ Gallium Trichloride (GaCl3) enables efficient and consistent transfer between vessels and processing equipment. Clumping is eliminated while fostering accelerated, safe, and accurate transfer. Physical properties negate need for mallable container, and product can be shipped in boroslicate glass without losing its free-flowing nature. Also, transparency of glass container lets users retain visual control over fill level and gauge free-flowing status. Read More

Materials & Material Processing

Pb-Free Solder Paste suits high complexity PCBs.

July 15, 2014

Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, optimal response-to-pause, and strong oxidation barrier, even for long and hot profiles. Halogen-free product resists graping on small components and tiny deposits, prevents head-in-pillow defects, and minimizes voiding for BGAs and large thermal planes. Conforming to RMA classification for QQ-S-571F, RMA-155 is best suited for military and aerospace PCB assemblies. Read More

Materials & Material Processing

Pb-Free Solder Paste targets small, low-voltage QFN packages.

February 10, 2014

Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150°C. High-melting, lead- and antimony-free product reflows, solders, wets, and solidifies like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes. Read More

Materials & Material Processing

Pb-Free Solder Paste delivers high first pass yields.

December 16, 2013

Indium8.9HF1-P combines max stencil printing performance with optimized no-clean residues to enhance probe testing. Able to print on apertures with area ratios <0.5 using minimal print pressures, product conserves testing time by eliminating false failures. Halogen-free oxidation barrier technology eliminates defects such as head-in-pillow and graping, while soft residue after reflow is penetrable by test probes and remains probe-testable after multiple reflows. Read More

Materials & Material Processing

Solder Alloy maximizes drop shock performance of electronics.

August 15, 2013

Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect. SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface maximize drop shock performance of portable electronic devices without compromising on thermal cycling. Read More

Materials & Material Processing

Soldering Alloy offers optimal drop shock performance.

July 9, 2013

Doped with manganese for strength, SACM™ meets electronics assembly market's demand for solder alloy that offers combination of optimal drop shock performance, thermal cycling, and lead-free composition. Product features tensile strength of 5,625 psi, yield strength of 3,590 psi, and 15.7% elongation. Alloy is especially suitable for manufacture of consumer electronics that experience frequent handling, such as mobile devices. Read More

Materials & Material Processing

Solder Alloy meets needs of electronics assembly market.

July 2, 2013

Offering optimal drop shock performance without compromises to thermal cycling, SACM™ has lead-free composition and consists of 97.5–98.5% Sn (tin), 0.5–1.0% Ag (silver), 0.5–1.0% Cu (copper), and dopant levels of Mn (manganese). Alloy is doped with manganese, which increases strength, while reduced silver content promotes stable cost structure. Properties include 5,625 psi tensile strength, 3,590 psi yield strength, 2110 King's Modulus (KSI), and 15.7% elongation. Read More

Materials & Material Processing

Solder Paste is suited for use on miniaturized assemblies.

June 19, 2013

Suited for assemblers and OEMs of mobile phones and other personal electronics devices contending with sub-8 mil challenges, Indium8.9HFA halogen- and Pb-free solder paste optimizes print performance and mitigates common defects such as QFN voiding, head-in-pillow, and graping. Transfer efficiency lends to consistent, full volume print deposits (8 mil), while print pressure and response-to-pause conserve time on stencils and line changes. Print speed and wipe frequency reduce cycle time. Read More

Adhesives & Sealants, Material Handling & Storage, Materials & Material Processing

Water-Soluble Solder Paste minimizes voids.

May 3, 2013

Manufactured with standard type 3 powder in Sn63, Sn62, and Indalloy100, Indium6.4 minimizes voiding under QFN and BGA assemblies. Whereas typical water-soluble paste has approximately 15–30% voiding, Indium 6.4 consistently yields less than 5%. Additional features include optimized response-to-pause printing, cleanability, and reflow properties as well as extended stencil life and slump resistance. Read More

Materials & Material Processing

No-Clean Solder Paste suits PoP applications.

March 20, 2013

Designed for use in package-on-package applications 0.3 mm and larger, Indium9.91 can be used with SAC305 and Sn63/Pb37 alloys. Product's rheology optimizes both dipping and package retention. Featuring typical viscosity of 150 kcps, typical tack strength of 40 g, and working life of 8 hours at room temperature, solder paste eliminates defects due to package warping. Read More

Green & Clean, Materials & Material Processing

Thermal Interface Material is optimized for IGBT modules.

September 16, 2009

Heat-Spring® metallic thermal interface material is soft metal alloy developed as compressible metallic shim suitable for IGBT mounting applications. Material's Heat-Springs are compressible soft metal performs that adapt to irregularities in mounting surface and are conductive both thermally and electrically. No special mounting apparatus is required. Heat-Springs are made of 100% recyclable and reclaimable metal and are considered green interface material. Read More

Materials & Material Processing

Cored Wire Solder is designed for use with Pb-free alloys.

November 5, 2008

Colophony/rosin free, no-clean, cored wire solder, CW-501 comes in variety of alloys and wire diameters. Compatible with wave fluxes and Indium8.9, it provides wetting and solder spread with minimal smoking and low odor. Read More

Materials & Material Processing

Solder Flux targets Pb-free wave soldering.

July 13, 2005

Suited for soldering surface-mount, mixed-technology, and through-hole electronics assemblies, 1075-EXR is water-based and non-flammable, eliminating special storage requirements and minimizing VOC emissions. Product provides surface wetting, eliminates cleaning, and minimizes solder balling. It can also be used for Sn/Pb assemblies. Read More

Materials & Material Processing

Water-Soluble Solder Paste is lead-free.

October 25, 2004

Suited for fine-pitch applications, Indium3.1 exhibits beneficial wetting under air and nitrogen reflow atmosphere. Low-voiding, low-foaming product exhibits slump resistance and results in shiny and smooth solder joints. Stencil life virtually eliminates solder paste waste, and any residue is cleaned with water. Product comes in 500 g jars and 700 g cartridges. Read More

Materials & Material Processing

Wave Solder Flux suits Pb-free applications.

September 30, 2004

No-clean, halide-free 3592-35 provides heat stability for high temperatures required in Pb-free wave soldering of mixed-technology and through-hole electronic assemblies. Solvent-based formulation offers wide process window and minimizes solder balling. It can be used with tin/copper, tin/silver/copper, and tin/lead alloys. Read More

Materials & Material Processing

Interconnect Flux is water-soluble.

July 29, 2004

Designed for use in BGA bumping and board level attachment, WS-364 water-soluble paste-flux can be applied by pin-transfer or stencil printing. It can be cleaned using room-temperature water and offers high yield in BGA bumping process. Available in syringes or cartridges, halide-free product is suitable for Sn/Pb and Pb-free applications. Read More

Materials & Material Processing

Solder Wire is comprised of high-purity materials.

July 23, 2004

Die Attach Solder Wire is manufactured from minimum of 99.9% pure materials with controlled oxide levels to facilitate wetting. It can be made to specific process or piece of equipment using advanced processes to hold to crucial diameters and tolerances for proper volume deposits. Standard packaging is available in 30-40 m spools; however custom spooling is available. Read More

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