Company News

Indium Corporation

34 Robinson Rd., Clinton, NY, 13323, US

  • 315-853-4900
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Latest New Product News from
Indium Corporation

Materials & Material Processing

Free-Flowing Gallium Trichloride comes in granulated form.

September 12, 2014

Via its granulated form, EZ-Pour™ Gallium Trichloride (GaCl3) enables efficient and consistent transfer between vessels and processing equipment. Clumping is eliminated while fostering accelerated, safe, and accurate transfer. Physical properties negate need for mallable container, and product can be shipped in boroslicate glass without losing its free-flowing nature. Also, transparency of glass container lets users retain visual control over fill level and gauge free-flowing status. Read More

Materials & Material Processing

Pb-Free Solder Paste suits high complexity PCBs.

July 15, 2014

Compatible with both SnPb and SAC alloys, RMA-155 delivers consistent transfer efficiencies, optimal response-to-pause, and strong oxidation barrier, even for long and hot profiles. Halogen-free product resists graping on small components and tiny deposits, prevents head-in-pillow defects, and minimizes voiding for BGAs and large thermal planes. Conforming to RMA classification for QQ-S-571F, RMA-155 is best suited for military and aerospace PCB assemblies. Read More

Materials & Material Processing

Pb-Free Solder Paste targets small, low-voltage QFN packages.

February 10, 2014

Designed as drop-in replacement for standard high Pb-containing solder pastes, BiAgX™ excels in high temperature environments in excess of 150°C. High-melting, lead- and antimony-free product reflows, solders, wets, and solidifies like any other solder paste, and is available in both dispense and printing forms. Fluxes are cleanable with standard cleaning chemistries and processes. Read More

Materials & Material Processing

Pb-Free Solder Paste delivers high first pass yields.

December 16, 2013

Indium8.9HF1-P combines max stencil printing performance with optimized no-clean residues to enhance probe testing. Able to print on apertures with area ratios <0.5 using minimal print pressures, product conserves testing time by eliminating false failures. Halogen-free oxidation barrier technology eliminates defects such as head-in-pillow and graping, while soft residue after reflow is penetrable by test probes and remains probe-testable after multiple reflows. Read More

Materials & Material Processing

Solder Alloy maximizes drop shock performance of electronics.

August 15, 2013

Featuring low silver content, platform consists of Indium 8.9 Series solder pastes using SACM™ solder alloy technology for board-side interconnect, and SACM™ solder balls for package level interconnect. SACM’s stable, micro-structural improvements to intermetallic compound layer of solder-to-pad interface maximize drop shock performance of portable electronic devices without compromising on thermal cycling. Read More

Materials & Material Processing

Soldering Alloy offers optimal drop shock performance.

July 9, 2013

Doped with manganese for strength, SACM™ meets electronics assembly market's demand for solder alloy that offers combination of optimal drop shock performance, thermal cycling, and lead-free composition. Product features tensile strength of 5,625 psi, yield strength of 3,590 psi, and 15.7% elongation. Alloy is especially suitable for manufacture of consumer electronics that experience frequent handling, such as mobile devices. Read More

Materials & Material Processing

Solder Alloy meets needs of electronics assembly market.

July 2, 2013

Offering optimal drop shock performance without compromises to thermal cycling, SACM™ has lead-free composition and consists of 97.5–98.5% Sn (tin), 0.5–1.0% Ag (silver), 0.5–1.0% Cu (copper), and dopant levels of Mn (manganese). Alloy is doped with manganese, which increases strength, while reduced silver content promotes stable cost structure. Properties include 5,625 psi tensile strength, 3,590 psi yield strength, 2110 King's Modulus (KSI), and 15.7% elongation. Read More

Materials & Material Processing

Solder Paste is suited for use on miniaturized assemblies.

June 19, 2013

Suited for assemblers and OEMs of mobile phones and other personal electronics devices contending with sub-8 mil challenges, Indium8.9HFA halogen- and Pb-free solder paste optimizes print performance and mitigates common defects such as QFN voiding, head-in-pillow, and graping. Transfer efficiency lends to consistent, full volume print deposits (8 mil), while print pressure and response-to-pause conserve time on stencils and line changes. Print speed and wipe frequency reduce cycle time. Read More

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Indium Corporation