Engineered Materials Systems Inc.

Conductive Adhesive has low-temperature cure capability.
Adhesives & Sealants

Conductive Adhesive has low-temperature cure capability.

DELAWARE, OHIO – Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications. EMS 618-116 is designed to cure in 30 minutes at 100°C or rapidly at elevated...

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Conductive Adhesive has low-temperature cure capability.
Adhesives & Sealants

Conductive Adhesive has low-temperature cure capability.

DELAWARE, OHIO – Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications. EMS 618-116 is designed to cure in 30 minutes at 100-°C or rapidly at elevated...

Read More »
Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015
Paints & Coatings

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

DELAWARE, OH - Engineered Materials Systems, Inc. (EMS), a leading global supplier of negative photoresists for MEMS applications, will showcase its DF-3000 Series Negative Film Photoresists during SEMI MEMS 2015, scheduled to take place September 17-18, 2015 at the AtaHotel in Milan, Italy. The DF-3000 series is available in various thickness formats from 5 to 50 µm, ±5 percent. The cured...

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Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015
Paints & Coatings

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

DELAWARE, OH - Engineered Materials Systems, Inc. (EMS), a leading global supplier of negative photoresists for MEMS applications, will showcase its DF-3000 Series Negative Film Photoresists during SEMI MEMS 2015, scheduled to take place September 17-18, 2015 at the AtaHotel in Milan, Italy. The DF-3000 series is available in various thickness formats from 5 to 50 -µm, ±5 percent. The cured...

Read More »
Conductive Adhesive electrically connects solar cells.
Adhesives & Sealants

Conductive Adhesive electrically connects solar cells.

Stress absorbing to withstand rigors of thermal cycling, DB-1541-S9 is suited for stringing or shingling applications in crystalline silicon and thin-film solar modules. Adhesive electrically connects solar cells using ribbons or direct cell to cell contact. Providing optimized conductive stability to cell and ribbon metallization during damp heat exposure, adhesive is designed to gel rapidly and...

Read More »
Conductive Adhesive electrically connects solar cells.
Adhesives & Sealants

Conductive Adhesive electrically connects solar cells.

Stress absorbing to withstand rigors of thermal cycling, DB-1541-S9 is suited for stringing or shingling applications in crystalline silicon and thin-film solar modules. Adhesive electrically connects solar cells using ribbons or direct cell to cell contact. Providing optimized conductive stability to cell and ribbon metallization during damp heat exposure, adhesive is designed to gel rapidly and...

Read More »
Conductive Adhesive targets HIT silicon solar modules.
Adhesives & Sealants

Conductive Adhesive targets HIT silicon solar modules.

DELAWARE, OH -- Engineered Material Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, will introduce  its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam. The low-cost adhesive is ideal for Heterojunction (HIT) silicon...

Read More »
Conductive Adhesive targets HIT silicon solar modules.
Adhesives & Sealants

Conductive Adhesive targets HIT silicon solar modules.

DELAWARE, OH -- Engineered Material Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, will introduce-  its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam. The low-cost adhesive is ideal for Heterojunction (HIT) silicon...

Read More »
Conductive Adhesive has low-temperature cure capability.
Adhesives & Sealants

Conductive Adhesive has low-temperature cure capability.

DELAWARE, OHIO – Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications. EMS 618-116 is designed to cure in 30 minutes at 100°C or rapidly at elevated...

Read More »
Conductive Adhesive has low-temperature cure capability.
Adhesives & Sealants

Conductive Adhesive has low-temperature cure capability.

DELAWARE, OHIO – Engineered Materials Systems, a leading global supplier of conductive interconnect materials for circuit assembly applications, announces the introduction of its new EMS 618-116 Adhesive. The low-temperature cure one-part conductive adhesive has been designed for circuit assembly applications. EMS 618-116 is designed to cure in 30 minutes at 100-°C or rapidly at elevated...

Read More »
Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015
Paints & Coatings

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

DELAWARE, OH - Engineered Materials Systems, Inc. (EMS), a leading global supplier of negative photoresists for MEMS applications, will showcase its DF-3000 Series Negative Film Photoresists during SEMI MEMS 2015, scheduled to take place September 17-18, 2015 at the AtaHotel in Milan, Italy. The DF-3000 series is available in various thickness formats from 5 to 50 µm, ±5 percent. The cured...

Read More »
Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015
Paints & Coatings

Engineered Materials Systems to Exhibit DF-3000 Series Negative Film Photoresists at SEMI MEMS 2015

DELAWARE, OH - Engineered Materials Systems, Inc. (EMS), a leading global supplier of negative photoresists for MEMS applications, will showcase its DF-3000 Series Negative Film Photoresists during SEMI MEMS 2015, scheduled to take place September 17-18, 2015 at the AtaHotel in Milan, Italy. The DF-3000 series is available in various thickness formats from 5 to 50 -µm, ±5 percent. The cured...

Read More »
Conductive Adhesive electrically connects solar cells.
Adhesives & Sealants

Conductive Adhesive electrically connects solar cells.

Stress absorbing to withstand rigors of thermal cycling, DB-1541-S9 is suited for stringing or shingling applications in crystalline silicon and thin-film solar modules. Adhesive electrically connects solar cells using ribbons or direct cell to cell contact. Providing optimized conductive stability to cell and ribbon metallization during damp heat exposure, adhesive is designed to gel rapidly and...

Read More »
Conductive Adhesive electrically connects solar cells.
Adhesives & Sealants

Conductive Adhesive electrically connects solar cells.

Stress absorbing to withstand rigors of thermal cycling, DB-1541-S9 is suited for stringing or shingling applications in crystalline silicon and thin-film solar modules. Adhesive electrically connects solar cells using ribbons or direct cell to cell contact. Providing optimized conductive stability to cell and ribbon metallization during damp heat exposure, adhesive is designed to gel rapidly and...

Read More »
Conductive Adhesive targets HIT silicon solar modules.
Adhesives & Sealants

Conductive Adhesive targets HIT silicon solar modules.

DELAWARE, OH -- Engineered Material Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, will introduce  its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam. The low-cost adhesive is ideal for Heterojunction (HIT) silicon...

Read More »
Conductive Adhesive targets HIT silicon solar modules.
Adhesives & Sealants

Conductive Adhesive targets HIT silicon solar modules.

DELAWARE, OH -- Engineered Material Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, will introduce-  its new 561-147 Snap Cure Conductive Adhesive in Hall 1, Booth E19 at EU PVSEC, scheduled to take place Sept. 23-25, 2014 at the RAI Convention & Exhibition Centre in Amsterdam. The low-cost adhesive is ideal for Heterojunction (HIT) silicon...

Read More »

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