EoPlex Technologies, Inc.

Electronic Components & Devices

EoPlex Expands Semiconductor Packaging Business

New Malaysian Plant Will Open in Q2 2012 REDWOOD CITY, Calif. - EoPlex Limited, a subsidiary of ASTI Holdings Limited ( ASTI"), Singapore, announced that a new factory for its award-winning xLC(TM) semiconductor package, will open in Q2, 2012 in Malaysia. The EoPlex xLC product addresses a multi-billion dollar leadframe market, and leadframes are used in billions of semiconductor chip packages....

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Electronic Components & Devices

EoPlex Expands Semiconductor Packaging Business

New Malaysian Plant Will Open in Q2 2012 REDWOOD CITY, Calif. - EoPlex Limited, a subsidiary of ASTI Holdings Limited ( ASTI"), Singapore, announced that a new factory for its award-winning xLC(TM) semiconductor package, will open in Q2, 2012 in Malaysia. The EoPlex xLC product addresses a multi-billion dollar leadframe market, and leadframes are used in billions of semiconductor chip packages....

Read More »
Electronic Components & Devices

Lead Carrier Substrate enables multi-row QFN packages.

Comprised of sintered metal array of wire bond and die attach pads delivered on temporary thin metal strip, xLC(TM) substrate enables packaging companies to produce Quad Flat No Lead (QFN) semiconductor packages with hundreds of leads and multiple rows. This direct replacement for leadframe is completely compatible with all QFN processing and enables packages to be made with as many rows as...

Read More »
Electronic Components & Devices

Lead Carrier Substrate enables multi-row QFN packages.

Comprised of sintered metal array of wire bond and die attach pads delivered on temporary thin metal strip, xLC(TM) substrate enables packaging companies to produce Quad Flat No Lead (QFN) semiconductor packages with hundreds of leads and multiple rows. This direct replacement for leadframe is completely compatible with all QFN processing and enables packages to be made with as many rows as...

Read More »
Electronic Components & Devices

IC-Chip Package promotes green manufacturing.

Intended for semiconductor packaging, EoPlex xLC(TM) clean-tech lead carrier provides replacement for lead frames currently used in QFN type packages. Green process eliminates etching and plating requirements, and complete packages can have 2-500+ leads and still measure less than 300 microns thick. This sintered composite with engineered microstructure suits portable electronics applications,...

Read More »
Electronic Components & Devices

IC-Chip Package promotes green manufacturing.

Intended for semiconductor packaging, EoPlex xLC(TM) clean-tech lead carrier provides replacement for lead frames currently used in QFN type packages. Green process eliminates etching and plating requirements, and complete packages can have 2-500+ leads and still measure less than 300 microns thick. This sintered composite with engineered microstructure suits portable electronics applications,...

Read More »
Electronic Components & Devices

EoPlex Expands Semiconductor Packaging Business

New Malaysian Plant Will Open in Q2 2012 REDWOOD CITY, Calif. - EoPlex Limited, a subsidiary of ASTI Holdings Limited ( ASTI"), Singapore, announced that a new factory for its award-winning xLC(TM) semiconductor package, will open in Q2, 2012 in Malaysia. The EoPlex xLC product addresses a multi-billion dollar leadframe market, and leadframes are used in billions of semiconductor chip packages....

Read More »
Electronic Components & Devices

EoPlex Expands Semiconductor Packaging Business

New Malaysian Plant Will Open in Q2 2012 REDWOOD CITY, Calif. - EoPlex Limited, a subsidiary of ASTI Holdings Limited ( ASTI"), Singapore, announced that a new factory for its award-winning xLC(TM) semiconductor package, will open in Q2, 2012 in Malaysia. The EoPlex xLC product addresses a multi-billion dollar leadframe market, and leadframes are used in billions of semiconductor chip packages....

Read More »
Electronic Components & Devices

Lead Carrier Substrate enables multi-row QFN packages.

Comprised of sintered metal array of wire bond and die attach pads delivered on temporary thin metal strip, xLC(TM) substrate enables packaging companies to produce Quad Flat No Lead (QFN) semiconductor packages with hundreds of leads and multiple rows. This direct replacement for leadframe is completely compatible with all QFN processing and enables packages to be made with as many rows as...

Read More »
Electronic Components & Devices

Lead Carrier Substrate enables multi-row QFN packages.

Comprised of sintered metal array of wire bond and die attach pads delivered on temporary thin metal strip, xLC(TM) substrate enables packaging companies to produce Quad Flat No Lead (QFN) semiconductor packages with hundreds of leads and multiple rows. This direct replacement for leadframe is completely compatible with all QFN processing and enables packages to be made with as many rows as...

Read More »
Electronic Components & Devices

IC-Chip Package promotes green manufacturing.

Intended for semiconductor packaging, EoPlex xLC(TM) clean-tech lead carrier provides replacement for lead frames currently used in QFN type packages. Green process eliminates etching and plating requirements, and complete packages can have 2-500+ leads and still measure less than 300 microns thick. This sintered composite with engineered microstructure suits portable electronics applications,...

Read More »
Electronic Components & Devices

IC-Chip Package promotes green manufacturing.

Intended for semiconductor packaging, EoPlex xLC(TM) clean-tech lead carrier provides replacement for lead frames currently used in QFN type packages. Green process eliminates etching and plating requirements, and complete packages can have 2-500+ leads and still measure less than 300 microns thick. This sintered composite with engineered microstructure suits portable electronics applications,...

Read More »

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