United Microelectronics Corp
Sunnyvale, CA 94085
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Design Models, IP, Kits help produce stable high-quality auto ICs.
Available to- IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 µm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and help...
Read More »Design Models, IP, Kits help produce stable high-quality auto ICs.
Available toÃ- IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 õm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and...
Read More »UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP
Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power...
Read More »UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP
Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power...
Read More »SDDI Foundry Process (80 nm) increases phone display resolution.
Applying aggressive foundry design rules to shrink bitcell size down to 0.714 -µm², 80 nm SDDI (Small-panel Display Driver IC) SRAM bitcell enables HD720/WXGA smartphone resolutions. This foundry process is aimed at helping new and existing display driver customers realize higher resolution with lower power consumption for upcoming generations of smartphone displays.
Read More »SDDI Foundry Process (80 nm) increases phone display resolution.
Applying aggressive foundry design rules to shrink bitcell size down to 0.714 Ã-µmò, 80 nm SDDI (Small-panel Display Driver IC) SRAM bitcell enables HD720/WXGA smartphone resolutions. This foundry process is aimed at helping new and existing display driver customers realize higher resolution with lower power consumption for upcoming generations of smartphone displays.
Read More »True 12V eFlash Solution targets touchscreen applications.
Incorporating true 12 V solution, high voltage (HV) embedded flash (eFlash) process enables single-chip integration with improved SNR for mid to large panel touchscreen applications by combining HV component that drives sensor elements with eFlash memory that stores control algorithm. Solution is available in 0.11 and 0.18 -µm process generations.
Read More »True 12V eFlash Solution targets touchscreen applications.
Incorporating true 12 V solution, high voltage (HV) embedded flash (eFlash) process enables single-chip integration with improved SNR for mid to large panel touchscreen applications by combining HV component that drives sensor elements with eFlash memory that stores control algorithm. Solution is available in 0.11 and 0.18 Ã-µm process generations.
Read More »BEoL Process offers aluminum process alternative to copper.
Offering alternative to and migration path for 0.18 -µm or existing 0.13/0.11 µm Cu-BEoL products, A+ technology platform consists of specialized 0.11 µm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP, HV-LDMOS,...
Read More »BEoL Process offers aluminum process alternative to copper.
Offering alternative to and migration path for 0.18 Ã-µm or existing 0.13/0.11 õm Cu-BEoL products, A+ technology platform consists of specialized 0.11 õm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP,...
Read More »Design Models, IP, Kits help produce stable high-quality auto ICs.
Available to- IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 µm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and help...
Read More »Design Models, IP, Kits help produce stable high-quality auto ICs.
Available toÃ- IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 õm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and...
Read More »UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP
Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power...
Read More »UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP
Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power...
Read More »SDDI Foundry Process (80 nm) increases phone display resolution.
Applying aggressive foundry design rules to shrink bitcell size down to 0.714 -µm², 80 nm SDDI (Small-panel Display Driver IC) SRAM bitcell enables HD720/WXGA smartphone resolutions. This foundry process is aimed at helping new and existing display driver customers realize higher resolution with lower power consumption for upcoming generations of smartphone displays.
Read More »SDDI Foundry Process (80 nm) increases phone display resolution.
Applying aggressive foundry design rules to shrink bitcell size down to 0.714 Ã-µmò, 80 nm SDDI (Small-panel Display Driver IC) SRAM bitcell enables HD720/WXGA smartphone resolutions. This foundry process is aimed at helping new and existing display driver customers realize higher resolution with lower power consumption for upcoming generations of smartphone displays.
Read More »True 12V eFlash Solution targets touchscreen applications.
Incorporating true 12 V solution, high voltage (HV) embedded flash (eFlash) process enables single-chip integration with improved SNR for mid to large panel touchscreen applications by combining HV component that drives sensor elements with eFlash memory that stores control algorithm. Solution is available in 0.11 and 0.18 -µm process generations.
Read More »True 12V eFlash Solution targets touchscreen applications.
Incorporating true 12 V solution, high voltage (HV) embedded flash (eFlash) process enables single-chip integration with improved SNR for mid to large panel touchscreen applications by combining HV component that drives sensor elements with eFlash memory that stores control algorithm. Solution is available in 0.11 and 0.18 Ã-µm process generations.
Read More »BEoL Process offers aluminum process alternative to copper.
Offering alternative to and migration path for 0.18 -µm or existing 0.13/0.11 µm Cu-BEoL products, A+ technology platform consists of specialized 0.11 µm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP, HV-LDMOS,...
Read More »BEoL Process offers aluminum process alternative to copper.
Offering alternative to and migration path for 0.18 Ã-µm or existing 0.13/0.11 õm Cu-BEoL products, A+ technology platform consists of specialized 0.11 õm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP,...
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