United Microelectronics Corp

Electrical Equipment & Systems

Design Models, IP, Kits help produce stable high-quality auto ICs.

Available to- IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 µm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and help...

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Electrical Equipment & Systems

Design Models, IP, Kits help produce stable high-quality auto ICs.

Available toÂ- IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 µm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and...

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Electrical Equipment & Systems

UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP

Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power...

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Electrical Equipment & Systems

UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP

Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power...

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Fasteners & Hardware

BEoL Process offers aluminum process alternative to copper.

Offering alternative to and migration path for 0.18 -µm or existing 0.13/0.11 µm Cu-BEoL products, A+ technology platform consists of specialized 0.11 µm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP, HV-LDMOS,...

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Fasteners & Hardware

BEoL Process offers aluminum process alternative to copper.

Offering alternative to and migration path for 0.18 Â-µm or existing 0.13/0.11 µm Cu-BEoL products, A+ technology platform consists of specialized 0.11 µm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP,...

Read More »
Electrical Equipment & Systems

Design Models, IP, Kits help produce stable high-quality auto ICs.

Available to- IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 µm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and help...

Read More »
Electrical Equipment & Systems

Design Models, IP, Kits help produce stable high-quality auto ICs.

Available toÂ- IC companies designing chips for automotive applications, UMC AutoSM consists of automotive AEC-Q100 qualified technology solutions, ranging from 0.5 µm to 28 nm nodes, backed by manufacturing processes that comply with ISO TS-16949 automotive quality standards. Certified design models, IP, and Foundry Design Kits fulfill evolving needs of auto industry supply chain and...

Read More »
Electrical Equipment & Systems

UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP

Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power...

Read More »
Electrical Equipment & Systems

UMC Broadens Its 55nm eFlash Platform with Faraday's Silicon-proven IP

Faraday's IPs with HVT Core Devices Reduce Power by Up to 65% to Target Power-sensitive Market Applications HSINCHU, Taiwan - Faraday Technology Corporation (TAIEX: 3035), a leading fabless ASIC/SoC and IP provider, and United Microelectronics Corporation (UMC) (NYSE: UMC, TWSE: 2303), a leading global semiconductor foundry, today announced the availability of a complete set of low power...

Read More »
Fasteners & Hardware

BEoL Process offers aluminum process alternative to copper.

Offering alternative to and migration path for 0.18 -µm or existing 0.13/0.11 µm Cu-BEoL products, A+ technology platform consists of specialized 0.11 µm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP, HV-LDMOS,...

Read More »
Fasteners & Hardware

BEoL Process offers aluminum process alternative to copper.

Offering alternative to and migration path for 0.18 Â-µm or existing 0.13/0.11 µm Cu-BEoL products, A+ technology platform consists of specialized 0.11 µm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP,...

Read More »

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