Company News

Broadcom Corp.

3190 S. Bascom Ave., San Jose, CA, 95124, US

  • 408-371-0581

Chris Zegarelli
Sr. Director, Investor Relations
Phone: 949-926-7567
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Perrin Cox
Phone: 408-922-7855
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Latest New Product News from
Broadcom Corp.

Electronic Components & Devices

DSL Chipset delivers broadband over installed copper cabling.

October 29, 2014

Built on 28 nm process technology, BCM65200 DSP and BCM65900 AFE VDSL Chipset offers solution for high-density G.vector DSLAMs as well as fiber-to-the-distribution point architectures. Chipset incorporates up to 36 lines of VDSL2 or 6 lines of, plus high-speed vector interfaces that eliminate need for external PHY and framing devices. Backward-compatible to existing VDSL/ADSL technologies, BCM65200/900 lets operators deploy to customers in same system as VDSL2. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Quad-Port Low-Power Gearbox PHY supports 20 Gbps I/O designs.

October 14, 2014

Optimized for use with StrataXGS® Tomahawk™ switches, 28 nm BCM82764 comes in 19 x 19 mm SFF package designed to interconnect with QSFP modules. This high-density gearbox physical layer transceiver (PHY) converts 2 x 20 Gbps switch signaling to standard 40G Ethernet at 4 x 10 Gbps. While integrated module controls facilitate routing congestion on high-density PCBs, companion PHY lets end-users optionally provide legacy 40 GbE ports while utilizing full bandwidth of switch. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Gigabit Ethernet Switches target cloud-scale networks.

October 2, 2014

Featuring 3.2 Tbps switching capacity, StrataXGS® Tomahawk™ Series delivers 32 ports of 100 GE, 64 ports of 40 GE/50 GE, or 128 ports of 25 GE on single chip. FleXGS™ packet processing engines enable operators to adapt to changing workloads and control their networks. Optimized for Software Defined Network application ecosystems, switches provide flow and debug statistics, link health and utilization monitors, streaming network congestion detection, and packet tracing capabilities. Read More

Electronic Components & Devices, Computer Hardware & Peripherals

Mult-Rate 100GbE Gearbox PHY features monolithic construction.

September 19, 2014

Optimized for next-generation cloud-scale data center, enterprise, and core networks, BCM82792 offers dual 100 Gbps ports on single gearbox chip, operates at 2 W per port, and supports CR4 and SR4 links. This 28 nm CMOS PHY can multiplex and demultiplex data across eight 25 Gbps channels to or from twenty 10 Gbps channels. Additionally, configuration allows support of 8 bi-directional lanes at 10 Gbps for 10GbE or 40GbE pass-through applications. Read More

Computer Hardware & Peripherals, Transportation Industry Products, Electronic Components & Devices, Green & Clean

GNSS/Sensor Hub Chip delivers always-on location and sensing.

September 16, 2014

By integrating Global Navigation Satellite System (GNSS) chip and sensor hub into one chip, BCM4773 minimizes battery drain and adds intelligence to location technology on mobile devices. Architecture enables information from Wi-Fi®, Bluetooth Smart, GPS, and MEMS to be calculated on single SoC instead of application processor (AP), which promotes power conservation. Chip also enhances intelligence for context awareness by integrating GNSS and providing direct connection to Wi-Fi combo chip. Read More

Electronic Components & Devices, Computer Hardware & Peripherals

Broadcast SoCs bring HEVC technology to terrestrial markets.

September 15, 2014

Designed for set-top boxes, Hybrid Satellite and Terrestrial SoC Broadcast Devices combine HEVC with advanced modulation efficiencies of DVB-S2, DVB-T2, ISDB-T, and ATSC, and high-performance IP connectivity with MoCA 2.0. Devices feature single Full Band Capture tuner and 1-2 DVB-S2 demodulators, HDMI 2.0 and component output, and OpenGL ES 2.0 Graphics Engine. Engineered with pin-to-pin compatibility, series allows single set-top design to be leveraged across entire family. Read More

Electronic Components & Devices

MIMO Combo Chip doubles Wi-Fi performance.

September 8, 2014

Combining 5G WiFi and 2x2 MIMO, Model BCM4358 delivers Bluetooth co-existence performance, enabling OEMs to design high-end smartphones and tablets. Chip features 867 Mbps PHY rate and joins two 802.11ac streams at 80 MHz channel bandwidth via PCIe interface. In addition to integrated power amplifier, low noise amplifier, and internal TR switch, device includes transmit beamforming and Low Density Parity Check codes as well as Round Trip Time-based indoor location technology. Read More

Electronic Components & Devices, Communication Systems & Equipment

Development Kit grows Internet of Things applications.

September 3, 2014

With WICED™ Sense, developers can rapidly prototype ideas and concepts for IoT devices and applications. Wireless Internet Connectivity for Embedded Devices solution includes BCM20737 Bluetooth® Smart chip, 5 MEMS sensors, and software stack that is Bluetooth 4.1 compatible. Micro USB connector accelerates application updates, while Secure OTA download capability enables firmware updates from central devices such as smartphone, tablet, or PC. Read More

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Broadcom Corp.