Company News

Broadcom Corp.

3190 S. Bascom Ave., San Jose, CA, 95124, US

  • 408-371-0581

Chris Zegarelli
Sr. Director, Investor Relations
Phone: 949-926-7567
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Perrin Cox
Phone: 408-922-7855
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Latest New Product News from
Broadcom Corp.

Electronic Components & Devices

Smartwatch Platform improves battery life for Android wearables.

March 3, 2015

By minimizing power usage and consequent battery drain in wearables, smartwatch platform lets OEMs add features or include larger battery inside their wearable to extend uptime. In addition to 4xA7 application processor and Wi-Fi®/Bluetooth® (4.2/Smart) combo chip, OEMs can choose to integrate GPS with sensor hub processing, near field communication (NFC), wireless charging support, and camera support based on end-product requirements. Read More

Electronic Components & Devices, Computer Hardware & Peripherals, Communication Systems & Equipment

Microwave Baseband/RF SoCs support growing wireless traffic.

February 27, 2015

Integrating cross-polarization interference cancellation (XPIC) and line-of-sight multiple-input and multiple-output (LoS-MIMO) functionalities, BCM85650 supports channel aggregation and delivers 4K-QAM (quadrature amplitude modulation). Employing digital RF correction mechanisms, BCM85820 integrates support for XPIC, MIMO, 4K-QAM modulation, 112 MHz channels, and channel aggregation. Both SoCs provide mobile access carriers with 5 Gbps capacity and 48 bps/Hz spectral efficiency. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

HEVC Set-top Box SoCs feature integrated 4x4 5G Wi-Fi.

January 8, 2015

With integrated MHL 2.0, Models BCM7250 and BCM72502 bring full-featured set-top box functionality to OTT streaming media player and HDMI stick formats, respectively. Units provide 2x2 and 4x4 5G WiFi connectivity options via high-speed PCIe interface. Chips' 4x4 5G WiFi option is powered by BCM4366 4x4 MU-MIMO device, which enables broadcast-quality video delivery over Wi-Fi. SoCs also integrate 6000 DMIPS B15 ARMv7-A CPU, 1.0 Gpix/s OpenGL ES 3.0 3D GPU, and HEVC decoder. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Multi-Standard Ultra HD SoCs feature VP9 decode support.

January 8, 2015

Supporting client and media gateway STB applications, BCM7251S and BCM7252S support up to 60 fps on codec. Support for Google VP9 open video compression standard lets users stream 4K YouTube content to STBs and display to TV. Combined with 5G WiFi device BCM4366, BCM7252S, which has dual-core Brahma15, 12k DMIPS CPU, wirelessly delivers Ultra HD viewing experience throughout residence. BCM7251S employs dual-core Brahma15, 10k DMIPS CPU. Various connectivity peripherals are standard. Read More

Transportation Industry Products, Electronic Components & Devices

Automotive-Grade NFC Chip streamlines in-car device pairing.

January 7, 2015

With tap-to-connect technology, BCM89095 simplifies setup for mobile device connectivity within vehicle and enables such comfort and convenience applications as keyless entry and vehicle settings. Near Field Communications (NFC) technology enables drivers to pair mobile device by tapping it against dashboard instead of navigating menus on separate screens. Along with data rates to 848 kbps, chip supports Reader/Writer (R/W), Active and Passive Peer (P2P), and Tag/Card Emulation modes. Read More

Communication Systems & Equipment, Electronic Components & Devices

ODU Satellite Chipset increases service availability and quality.

January 7, 2015

Offering 32 user-band output channels and 32 output channels (selectable from any LNB input), BCM4554 adds support for up to 32 resident STBs on one coaxial cable within multiple dwelling unit. This lets operators deliver more services to additional subscribers without new satellite dish installations. Along with 28 nm process, features include 4 RF inputs and 1 RF output covering 250–2,350 MHz range, frequency shift keying (FSK), and digital satellite equipment control (DiSEqC). Read More

Optics & Photonics

Physical Layer Devices offer 40/50 Gbps transmission rates.

December 29, 2014

Based on 4-level pulse amplitude modulation (PAM) technology, 28 nm Models BCM82040 and BCM82004 enable transmission rates of 40/50 Gbps serially over multiple physical media, including direct attach cables and optical fiber. PAM-4 enables transmission of 40 Gbps at baud rate of 20 Gbaud. Housed in 7 x 7 mm package, both devices can transmit and receive data over 2 pairs of media versus 8 pairs of media using existing 4 x 10G quad small form-factor pluggable cables. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Digital-Terrestrial Video SoC aids digital transition in Mexico.

December 29, 2014

Intended for HD converter boxes and STB platforms used in Mexico, BCM7543 integrates ATSC-compliant 8VSB digital channel demodulator, MPEG2 and H.264 HD video decoder, and GPU. Complete hardware and software turnkey system also features 1,100 DMIPS CPU, Dolby Digital and MPEG audio decoder, RF 3-4 modulator, and analog A/V and HDMI output. Tuner scan and lock, signal strength meter, software device drivers, FastRTV® technology, audio leveling, and USB 2.0 port are also included. Read More

Transportation Industry Products, Communication Systems & Equipment

Satellite Device/GPS Receiver increase satellite operator options.

December 24, 2014

Combining BCM4551 satellite TV device with BCM4771 GPS receiver, GPS-enabled satellite outdoor unit (ODU) device lets operators track location of subscriber equipment and pinpoint service issues within residence. Satellite solution resides in low-noise block (LNB) of subscribers' satellite dishes, enabling operators to better position dish installations and reduce metering equipment expenses and truck rolls. Also, GPS technology within LNB lets operators geo-lock content to subscribers. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Copper Gigabit PHYs support 2.5G and 5G Ethernet.

December 22, 2014

Designed in 28 nm process technology, BCM8486X Series is available in single-port and quad-port packages, and addresses both switching and access point markets. Units are based on 10GBASE-T architecture and offer coding strength of 10G at 2.5G and 5G speeds, resulting in optimized alien noise rejection and cable reach of more than 100 m over existing Cat5e and Cat6 cables. PHYs also deliver full benefits of next-generation 802.11ac wireless technology, including Wave 1 and Wave 2 MIMO. Read More


Reference Platform supports carrier network applications.

December 17, 2014

Designed to run on StrataXGS® chipset, OpenFlow Data Plane Abstraction v2.0 enables service providers to provision, control, and instrument network switch elements through standardized instruction set, based on OpenFlow specification, APIs, and extensions. Platform defines and implements hardware abstraction layer that maps StrataXGS switch architecture to OpenFlow v1.3.1 switch and pipeline while providing concepts on how OpenFlow can be implemented in most efficient way. Read More


Internet of Things Development Platform fosters NFC integration.

December 15, 2014

Integrating Wi-Fi®, Bluetooth® Smart, and NFC, Wireless Internet Connectivity for Embedded Devices (WICED™) SDK simplifies setup process between mobile and smart (IoT) devices. NFC tap-to-activate capability lets user touch smartphone to portable speaker to launch music streaming application. This functionality can serve smart home, retail, and medical applications where there are devices with limited or no display/GUI. Read More

Electronic Components & Devices

Dual-Band Wi-Fi Audio Chip targets IoT applications.

December 15, 2014

Part of WICED™ portfolio, Model BCM43907 delivers HD audio streaming over Wi-Fi network to wireless audio devices while minimizing interference. Advanced RF and timing synchronization enables same content to be streamed over multiple speakers in different rooms with no echo or lag time. Offering pre-integrated Apple Airplay™ support with direct access to WICED Audio SDK, SoC includes 320 MHz ARM® Cortex®-R4 CPU with 32 KB each of instruction and data caches, along with 2 MB of TCM RAM. Read More

Transportation Industry Products, Computer Hardware & Peripherals

Smartphone GNSS Location Hub supports Galileo satellite system.

December 10, 2014

While simultaneously supporting Galileo, GPS, GLONASS, SBAS, QZSS, and BeiDou satellite systems, BCM4774 conserves battery life via architecture that enables main AP on smartphone to reduce computation load and stay in sleep mode for extended periods of time by offloading data calculations. Solution recognizes various context states, adding value to data gathered from mobile devices, and ULP on-chip positioning enables background and foreground location using GNSS. Read More

Electronic Components & Devices

DSL Chipset delivers broadband over installed copper cabling.

October 29, 2014

Built on 28 nm process technology, BCM65200 DSP and BCM65900 AFE VDSL Chipset offers solution for high-density G.vector DSLAMs as well as fiber-to-the-distribution point architectures. Chipset incorporates up to 36 lines of VDSL2 or 6 lines of, plus high-speed vector interfaces that eliminate need for external PHY and framing devices. Backward-compatible to existing VDSL/ADSL technologies, BCM65200/900 lets operators deploy to customers in same system as VDSL2. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Quad-Port Low-Power Gearbox PHY supports 20 Gbps I/O designs.

October 14, 2014

Optimized for use with StrataXGS® Tomahawk™ switches, 28 nm BCM82764 comes in 19 x 19 mm SFF package designed to interconnect with QSFP modules. This high-density gearbox physical layer transceiver (PHY) converts 2 x 20 Gbps switch signaling to standard 40G Ethernet at 4 x 10 Gbps. While integrated module controls facilitate routing congestion on high-density PCBs, companion PHY lets end-users optionally provide legacy 40 GbE ports while utilizing full bandwidth of switch. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Gigabit Ethernet Switches target cloud-scale networks.

October 2, 2014

Featuring 3.2 Tbps switching capacity, StrataXGS® Tomahawk™ Series delivers 32 ports of 100 GE, 64 ports of 40 GE/50 GE, or 128 ports of 25 GE on single chip. FleXGS™ packet processing engines enable operators to adapt to changing workloads and control their networks. Optimized for Software Defined Network application ecosystems, switches provide flow and debug statistics, link health and utilization monitors, streaming network congestion detection, and packet tracing capabilities. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Mult-Rate 100GbE Gearbox PHY features monolithic construction.

September 19, 2014

Optimized for next-generation cloud-scale data center, enterprise, and core networks, BCM82792 offers dual 100 Gbps ports on single gearbox chip, operates at 2 W per port, and supports CR4 and SR4 links. This 28 nm CMOS PHY can multiplex and demultiplex data across eight 25 Gbps channels to or from twenty 10 Gbps channels. Additionally, configuration allows support of 8 bi-directional lanes at 10 Gbps for 10GbE or 40GbE pass-through applications. Read More

Transportation Industry Products, Computer Hardware & Peripherals, Electronic Components & Devices, Green & Clean

GNSS/Sensor Hub Chip delivers always-on location and sensing.

September 16, 2014

By integrating Global Navigation Satellite System (GNSS) chip and sensor hub into one chip, BCM4773 minimizes battery drain and adds intelligence to location technology on mobile devices. Architecture enables information from Wi-Fi®, Bluetooth Smart, GPS, and MEMS to be calculated on single SoC instead of application processor (AP), which promotes power conservation. Chip also enhances intelligence for context awareness by integrating GNSS and providing direct connection to Wi-Fi combo chip. Read More

Computer Hardware & Peripherals, Electronic Components & Devices

Broadcast SoCs bring HEVC technology to terrestrial markets.

September 15, 2014

Designed for set-top boxes, Hybrid Satellite and Terrestrial SoC Broadcast Devices combine HEVC with advanced modulation efficiencies of DVB-S2, DVB-T2, ISDB-T, and ATSC, and high-performance IP connectivity with MoCA 2.0. Devices feature single Full Band Capture tuner and 1-2 DVB-S2 demodulators, HDMI 2.0 and component output, and OpenGL ES 2.0 Graphics Engine. Engineered with pin-to-pin compatibility, series allows single set-top design to be leveraged across entire family. Read More

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Broadcom Corp.