Company News

Goepel Electronics, Ltd

9700 Great Hills Trail, Austin, TX, 78759, US

  • 512-782-2500
  • 888-446-3735

Marketing:
Stefan Meissner
GOEPEL electronic GmbH
Goeschwitzer Str. 58-60/66
Jena D-07745 Germany
Phone: +49-3641-6896-739
Fax: +49-3641-6896-944
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Latest New Product News from
Goepel Electronics, Ltd

Test & Measuring Instruments

Emulation Technology supports TI TMS570LSxx processor compatibility.

August 5, 2014

VarioTAP® technology, used for universal processor emulation, is available for Texas Instruments TMS570LSxx models of Hercules™ series. Processor is configured to provide design-integrated test and programming instruments via native debug port. As part of IP library, VarioTAP® model contains all relevant access information for respective target processor. Users can, due to this, select processor and then test and validate connected hardware units and program Flash memories. Read More

Test & Measuring Instruments

Universal Processor Emulation is available for TI AM355x series.

July 17, 2014

VarioTAP® technology is available for universal processor emulation for Texas Instruments AM355x products of Sitara™ series. Configuration provides design-integrated test and programming instruments via native debug port. Respective VarioTAP® model, as part of IP library, contains all relevant access information for respective target processor. Users can select processor corresponding to their design and then test and validate connected hardware unit as well as program Flash memories. Read More

Software, Test & Measuring Instruments

3D Inspection System is capable of sintering paste evaluation.

July 16, 2014

With hardware and software adaptions, SPI-LINE 3D electronic solder paste inspection system handles inspection of printed sintering paste in electronic assemblies manufacturing. High-speed 3D camera head can capture thin sintering paste layers with precision, while integrated algorithms enable evaluation of sintered paste printing in addition to accurate and rapid measurement of height, volume, and offset of applied sintering paste. UI also facilitates test program generation. Read More

Software

ISP Flash Program Generator conserves time and effort.

July 9, 2014

Supporting all ISP (In-System Programming) options, Automated Flash Program Generator (AFPG) automatically generates scripts for universal ISP of non-volatile memory, such as flash devices, and MCUs with integrated flash via boundary scan. Mounted devices are programmed in native environment instead of as individual components before assembly. Tool provides graphical definition of command sequence, possibilities for bad block handling, multi-site support, and corresponding block library. Read More

Test & Measuring Instruments

Boundary Scan Module facilitates DDR3-DIMM socket testing.

July 1, 2014

Once plugged into test socket, CION Module SO-DIMM204-3/ECC allows structural test coverage of DDR3 memory interfaces. All signal pins, as well as almost all Ground-Pins, can be tested via Boundary Scan. Equipped with CION™ Boundary Scan ASIC, module can be connected to any Test Access Point (TAP) and lets user detect link failures. Tests take fractions of seconds, and even parallel testing of multiple memory interfaces is possible. Read More

Software

Embedded Instruments automate differential clock signal test.

April 1, 2014

Used for universal frequency measurement based on FPGA soft macros, ChipVORX® models consist of modular IP capable of controlling chip embedded instruments. Products allow FPGA-assisted testing of differential clock signals as well as measurement of frequencies directly inside system application. This lets user verify dynamics of signals and increase test coverage, where workflow is fully automated by software. Counter function is also available. Read More

Test & Measuring Instruments

FPGA Embedded Instruments support multi-channel BERT.

March 14, 2014

Offering IP-based technology for implementation, access, and control of chip embedded instruments via IEEE Std. 1149.x/JTAG, ChipVORX® also supports FPGA embedded instruments in form of softcores. System takes over complete process flow, including Target FPGA programming, IP to pin configuration, instrument control, data processing, and final IP unloading. Users can evaluate transmission channel quality via parallel measurement of bit error rate on all channels simultaneously. Read More

Software

Validation/Test Platform supports Intel® Quark SoCs.

March 14, 2014

SYSTEM CASCON™ supports Intel® Quark SoCs based on utilization of native debug ports as control interface for platform debugging, electric validation, and production tests. This lets Intel Quark-centric boards with limited physical access and high speed signals be tested structurally and functionally. Integrated SDE offers tool suite, GUI, and graphical project development for synergistic utilization of all ESA technologies, enabling use without nail or probe access (non-invasive). Read More

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Goepel Electronics, Ltd