Company News


1610 Republic Road, Huntingdon Valley, PA, 19006, US

  • 215-830-1200
  • 800-745-6266

Paulette Kevolic
Marketing Coordinator
E-mail this person

Share Like Tweet Add Email

Latest New Product News from

Robotics, Material Handling & Storage

Precision 3-Axis Dispensing Systems suit SMT assembly tasks.

July 7, 2014

Combining 3-axis robots with integrated digital dispense controllers, 2004D Series consists of <100 lb benchtop units that can store up to 10,000 different dispensing routines created via hand-held teach pendant. X-Y working ranges, depending on model, are 300 x 300 mm, 400 x 400 mm, and 500 x 500 mm, and all models offer 100 mm Z-axis stroke. With speeds to 800 mm/sec and repeatability of ±0.01 mm per axis, robots handle point-to-point, linear, or curved-arc application. Read More

Materials & Material Processing

Dip Soldering Systems suit short-run, batch applications.

May 14, 2014

Touchscreen controlled models of Auto-Dip series feature programmable preheat and dip height settings as well as adjustable, finger-type PCB holder that firmly grips edges of board throughout soldering cycle. Accommodating heavy component-laden assemblies and customized pallets of small, irregularly-shaped PCBs, systems offer programmable speed, dip angle, lift angle, and dwell time. Largest model handles PCBs up to 23.6 x 13.8 in. and has 100 Kg, titanium solder pot. Read More

Thermal & Heating Equipment

Benchtop Reflow Oven features Android OS and touchscreen UI.

March 10, 2014

Simulating environment of inline reflow system, Wi-Fi-enabled MC-301 measures 27 x 19 x 11 in., features multi-zone heating chamber, and can be used for prototyping, manufacturability testing, and short-run batch production. Android control app lets SMT assemblers and product developers meet solder paste manufacturer specifications for preheat, soak, reflow, and cooling phases of recommended profiles. Also, heating/cooling rates in each stage are automatically calculated.
Read More

Materials & Material Processing, Printing & Duplicating Equipment, Robotics, Thermal & Heating Equipment, Computer Hardware & Peripherals

Print-Place-Reflow Package performs prescision, high-mix assembly.

January 29, 2014

Occupying minimal floor space, 2500-MV accommodates companies that require short-run, in-house production capability for ultra-precise, high component-mix SMT assembly. Included MC-400 pick and place system features Cognex® on-the-fly and bottom vision alignment for high-accuracy, 2,500 cph placement of SMDs. Additional package components include heavy-duty MC-110 stencil printer, which offers ±0.02 mm (<1 mil) repeatability, and MC-301 profilable batch reflow oven with benchtop design. Read More

Cleaning Products & Equipment

PCB Cleaning System has closed-loop, zero-discharge design.

September 26, 2013

Fitted with stainless steel wash chamber and plumbing system, Trident XLD meets PCB cleaning and defluxing needs of electronic assemblers. Aqueous cleaning system removes both water-soluble or rosin-based flux residues as well as other contaminants and is compatible with various cleaning chemistries. Along with rinse cycle cleanliness monitor, features include twin counter-rotating spray bars with asymmetrical fan-jet nozzles and timed drying cycle with convection and radiant heat. Read More


Pick and Place Unit enhances prototyping, pilot production.

April 26, 2013

For those who need to build prototypes or perform short runs in-house, MC-400 aligns and places 0201 chips, BGAs, CSPs, and 15 mil fine-pitch QFPs with ±0.05 mm placement accuracy at speeds up to 3,000 cph by utilizing flying and bottom vision. Heavy-duty construction and closed-loop, servo-driven, X/Y/Z and theta axes, complemented by Hi-Res digital encoders, promote precision. Even at full capacity for 64 smart tape/stick feeders, unit maintains 16.3 x 12.5 in. max placement area. Read More

Machinery & Machining Tools, Robotics

Pick and Place Machine enables nonstop LED board production.

February 12, 2013

Featuring 3 pick-and-place heads mounted on ball-screw-driven gantry, Model MC-LEDV3 is built to assemble LED tube lights, flexible LED strips, and LED bulb boards. Simultaneous pickup, vision based component alignment, and feeder placement optimization combine to achieve placement rates up to 10,000 LEDs/hour, per IPC-9850. Machine places both standard and domed LEDs from 1 x 0.5 mm to 8 x 8 mm, with positive air pressure and Teflon®-coated nozzles ensuring release of sticky components. Read More

Test & Measuring Instruments

Benchtop AOI System decreases failure rates, increases yields.

January 30, 2013

Targeting low- to mid-volume electronics assemblers, Sherlock-300F delivers comprehensive defect coverage, even on densely populated boards with components as small as 01005s. Assemblies are fed via built-in conveyor, minimizing footprint and allowing display to be positioned directly in front of user. All program setup and operation is done on display using multi-touch gestures, and inspection programs are able to be generated from pick and place files in addition to CAD data import. Read More

Other Company News from

September 24, 2007

MC 384 Pick & Place System