Fonon Technologies

Services

Glass Panel Marking Technology ensures quality, strength.

Laser Direct Writing creates black, semi-transparent or gold marks on glass panels for purpose of tracking them throughout their lives. Non-destructive laser marking technology ensures glass is marked without damage to surface while producing readable image. This eliminates possibility of cracking surface and resulting compromise of strength and quality. No tapes or sprays are required,...

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Electronic Components & Devices

Laser Scribing Machine targets flat panel display industry.

Intended for thin glass cutting, Fantom G8 utilizes non-contact Zero Width Laser Cutting Technology(TM), which scribes glass on molecular level and allows applications to be processed with no material loss and no chips or other debris associated with conventional scribe and break techniques. Machine incorporates modular design laser and direct-drive linear motion system, forming precision,...

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Laser Separation Tool scribes generation 8 and larger glass.
Electronic Components & Devices

Laser Separation Tool scribes generation 8 and larger glass.

Model F 250 GL laser separation tool for scribing generation 8 and higher sized glass is suited for flat panel display and photovoltaic industries. System utilizes Zero Width Laser Cutting Technology(TM), which splits materials at molecular level, and also incorporates mode selective resonator and specialty gas mix range for changing wavelength during cutting. It also optimizes control of beam...

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Failure Analysis System inspects IC chip packages.
Agricultural & Farming Products

Failure Analysis System inspects IC chip packages.

Using laser technology, FiberTower(TM) DFAS allows operator to remove individual layers of mold compound through to substrate. System can import images from variety of testing processes such as SAM, X-ray, and SEM to show operator exact area of concern within sample. Controllable by operator through GUI, DFAS IC chip decapitation process provides accurate dissection without damaging sample. Laser...

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Mergers & Acquisitions

Fonon Corporation Files SEC 8K Closing Acquisition of Applied Photonics

Fonon Corporation to capitalize on the laser-based Materials Processing Market forecasted to be a $17.26B USD industry by 2020.Â-  Fonon expects the merger to generate $5M in 2016 revenue in this market segment alone. LAKE MARY, FL - Fonon Corporation ( Fonon ) is pleased to announce it has filed an SEC 8K closing the acquisition of Applied Photonics.Â-  The company now owns the exclusive...

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Mergers & Acquisitions

Fonon Corporation Acquires Manufacturing Capability and Seasoned Personnel as Part of its 2015 Reorganization Plan

Fonon enhances the company's value chain business model with the industry's largest array of laser-based material processing equipment diversified across multiple markets including aerospace, defense, space, medical, automotive, energy and semiconductor sectors Lake Mary, Florida,Â- - Fonon Corporation ( Fonon ) (OTC:FNON) is pleased to announce the acquisition of FTL, LLC supporting the...

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Company News

Fonon Corporation (Formerly Mabwe Minerals Inc.) Receives Clearance from FINRA Including Authorization for 10:1 stock split and Issued New Ticker Symbol: FNON

Mabwe Minerals is now Fonon Corporation, completes Phase I of company's 2015 Reorganization Plan with FINRA approval of name change, domicile change, stock split and new ticker symbol Lake Mary, Florida,Â- - Fonon Corporation (formerly Mabwe Minerals) (OTC: FNON) is pleased to announce the company has successfully completed its first step towards implementing the company's Â- 2015...

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Services

Glass Panel Marking Technology ensures quality, strength.

Laser Direct Writing creates black, semi-transparent or gold marks on glass panels for purpose of tracking them throughout their lives. Non-destructive laser marking technology ensures glass is marked without damage to surface while producing readable image. This eliminates possibility of cracking surface and resulting compromise of strength and quality. No tapes or sprays are required,...

Read More »
Electronic Components & Devices

Laser Scribing Machine targets flat panel display industry.

Intended for thin glass cutting, Fantom G8 utilizes non-contact Zero Width Laser Cutting Technology(TM), which scribes glass on molecular level and allows applications to be processed with no material loss and no chips or other debris associated with conventional scribe and break techniques. Machine incorporates modular design laser and direct-drive linear motion system, forming precision,...

Read More »
Laser Separation Tool scribes generation 8 and larger glass.
Electronic Components & Devices

Laser Separation Tool scribes generation 8 and larger glass.

Model F 250 GL laser separation tool for scribing generation 8 and higher sized glass is suited for flat panel display and photovoltaic industries. System utilizes Zero Width Laser Cutting Technology(TM), which splits materials at molecular level, and also incorporates mode selective resonator and specialty gas mix range for changing wavelength during cutting. It also optimizes control of beam...

Read More »
Failure Analysis System inspects IC chip packages.
Agricultural & Farming Products

Failure Analysis System inspects IC chip packages.

Using laser technology, FiberTower(TM) DFAS allows operator to remove individual layers of mold compound through to substrate. System can import images from variety of testing processes such as SAM, X-ray, and SEM to show operator exact area of concern within sample. Controllable by operator through GUI, DFAS IC chip decapitation process provides accurate dissection without damaging sample. Laser...

Read More »

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