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Low-Resistance SMDs conserve space, power in mobile electronics. Return to story
Latest New Product News from
TE Connectivity Ltd.
Combining Zener diode and resettable PolySwitch PPTC device in 4.0 x 5.0 x 1.2 mm package, PolyZen ZEN056V230A16YC and ZEN056V260A16YC simultaneously protect against damage from overload, overcurrent, reverse-bias, ESD, and overtemperature events. Hybrid units offer up to 2.6 A hold-current at room temperature, ±30 kV ESD protection, and 8/20 µs pulse = 150 A overvoltage protection to help meet IEC standards. Applications include tablets, set-top boxes, hard disk drives, and DC power ports. Read More
Exhibiting ±20 kV and ±22 kV air discharge ratings, SESD Series helps designers solve pervasive protection challenge caused by charged board events. Products come in uni-directional and bi-directional configurations with input capacitance of 0.30 and 0.15 pF, respectively. Clamping voltage of less than 15 V helps facilitate fast turn-on time and minimize energy let-through to sensitive down-stream chipsets. Surge capability is 2.2 A for 4-channel array and 2.5 A for 1- and 2-channel devices. Read More
Using 25G VCSEL and PIN devices, TIA amplifier, and driver IC, Coolbit optical engines convert data from electrical signals to optical signals and drive technology behind TE 100G, 300G, and 400G active optics. Platform engines help communication systems conserve power, and QSFP28 modules perform at <1.5 W per transceiver. Optical engines enhance performance while satisfying high density and high bandwidth requirements. Read More
Combining resettable polymeric positive temperature coefficient device and thermally enhanced metal-oxide varistor into one package, 2Pro AC Device protects sensitive downstream electronics against damage from overcurrent and overvoltage events. Unit provides stability by maintaining varistor surface temperature of less than 150°C. RoHS-compliant and halogen-free, 2Pro AC Device is suitable for LED lighting, smart meters, appliances, and power supplies. Read More
Designed to seal gaps around opening and inside of connector shell, 8.2 x 5 x 3.8 mm splashproof micro USB connector accepts A and B type plugs and supports normal USB and USB OTG (On The Go). Molded front helps seal connector against device shell of consumer electronics, while SMD solder bracket provides additional strength from underneath connector. Conforming to micro USB 2.0 specification, connector also supports high-speed data and power transmission. Read More
Measuring 5.8 x 3.75 x 1.15 mm, MHP-TA Series connects bimetal protector in parallel with Polymeric Positive Temperature Coefficient device. In battery cell designs, devices provide resettable overtemperature protection, while utilizing PPTC to act as heater and to keep bimetal latched until fault is removed. Featuring 9 Vdc rating, series comprises low-current MHP-TA6-9 products with approximately 6 A hold current at 25°C, and high-current MHP-TA15-9 products with hold current of 15 A. Read More
With 0.12 x 0.10 in., 0.12 x 0.06 in., or 0.12 x 0.18 in. form factor, low rho SMD series helps provide overcurrent and overtemperature protection for battery pack PCMs (protection circuit modules) used in mobile consumer devices. Products can be assembled with reflowable soldering technique and feature resistance from 10–25 mΩ after reflow process. Designed for operating current of 2 A and above, 9 models help reduce power consumption and improve battery efficiency. Read More
Along with 1.4 mm profile, push-push SIM connector features mechanism that facilitates ejection of SIM card. Dual slanted contact design provides stable connection while also helping avoid contact jams from hooking housing components underneath. While card detect switch enables hot swap, card slot is compatible with all SIM cards, and half-moon shape opening strengthens EMI protection. Extra open space at front of housing helps prevent finger cuts when inserting/extracting card. Read More
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TE Connectivity Ltd.