Company News

FEI Co.

5350 N.E. Dawson Creek Dr., Hillsboro, OR, 97124, US

  • 503-726-7500
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Latest New Product News from
FEI Co.

Test & Measuring Instruments

Characterization System aids materials science research.

September 9, 2014

Capable of seeing structure and composition and adding/removing material at nanometer scale, Helios NanoLab™ G3 DualBeam™ allows scientists to explore fundamental relationships between structure and function. CX configuration offers versatile sample handling and positioning for flexible analysis, sample preparation, and characterization, while UC configuration delivers increased sensitivity to surface detail and optimized performance on soft, non-conductive, or beam-sensitive materials. Read More

Optics & Photonics, Materials & Material Processing, Laboratory and Research Supplies & Equipment

Scanning Electron Microscope delivers 3D volume imaging.

September 9, 2014

Integrating SEM with VolumeScope™ in-chamber microtome and analytical software, Teneo VS™ provides fully automated, large-volume reconstructions with optimized Z-axis resolution. VolumeScope uses serial block face imaging to acquire 3D volume from block of tissue or cells. ThruSight multi-energy deconvolution resolves features at different depths within each slice, while MAPS software uses tiling and stitching to acquire high-resolution composite images that are larger than single field of view. Read More

Optics & Photonics, Laboratory and Research Supplies & Equipment

PFIM System and SEM accelerate metals research.

August 4, 2014

Utilizing plasma focused ion beam, Helios™ PFIB DualBeam™ delivers rapid 3D imaging and analysis for metals research as well as delamination of paints and coatings and analysis of grain boundaries, thin films, interfaces, and adhesion layers. Teneo™ Scanning Electron Microscope, featuring non-immersion objective lens, provides high-resolution, high-contrast images on magnetic materials. Energy dispersive spectrometry and EBSD are supported by high-beam current and full 90° stage tilt. Read More

Optics & Photonics, Chemical Processing & Waste Management

Sample Holder for In Situ TEM can heat samples to over 1000°C.

May 21, 2014

Suited for scientists studying structure-function relationship of materials, NanoEx™-i/v sample holder can be integrated with FEI transmission electron microscopes (TEMs) to observe effects of heating and electrical bias on nanostructured materials during in situ experiments. Holder is optimized to accept various sample geometries, from nanoparticles to thin FIB-prepared lamellae, and includes MEMS-based heating element as well as contacts for applying electrical bias. Read More

Chemical Processing & Waste Management

TEM Sample Preparation Workflow promotes high throughput.

November 6, 2013

Suitable for use in transmission electron microscopy (TEM) analysis, ExSolve™ can prepare site-specific, 20 nm thick TEM lamella on whole wafers up to 300 mm dia. Solution can sample many sites per wafer in fully automated process inside fab, and wafer TEM prep (WTP) increases speed of sample preparation. This provides semiconductor and data storage manufacturers with access to data needed to verify and monitor process performance. FOUP handling capability is standard. Read More

Optics & Photonics, Vision Systems

FIB/SEM Systems facilitate imaging of challenging materials.

July 23, 2013

DualBeam focused ion beam/scanning electron microscope (FIB/SEM) systems provide imaging and analysis of diverse samples. With electron optics suited for investigating such challenging materials as insulating or magnetic materials, Scios™ DualBeam™ is positioned for accelerated 2D and 3D characterization. Helios NanoLab™ 660 DualBeam, with its patterning engine, MultiChem™ gas delivery system, and Tomahawk™ ion optics, provides capabilities for fabricating prototypes of complex nanodevices. Read More

Optics & Photonics, Laboratory and Research Supplies & Equipment

FIB SEM System investigates materials at nanometer scale.

July 9, 2013

Combining high-resolution scanning electron microscope with focused ion beam milling, Helios NanoLab™ 660 DualBeam™ is used to investigate structure and function of materials at nanometer scale, create prototypes of micro and nano electro-mechanical systems, and prepare ultrathin samples for atomic scale imaging and analysis in TEM. NanoBuilder™ 2.0 nanoprototyping toolset automatically fabricates 3D prototypes of nano- and microscale devices from computer-generated models. Read More

Optics & Photonics, Test & Measuring Instruments

Wafer Analysis System quickly diagnoses root cause of defects.

June 13, 2013

With automated front opening universal pod, Helios NanoLab™ 1200AT DualBeam™ System can be located inside semiconductor wafer lab, where SEM imaging and focused ion beam milling are used to extract ultrathin samples of targeted structures for examination in TEM. System can create site-specific TEM samples thin enough to capture single transistor at 10 nm node, from wafers up to 300 mm in diameter. By moving 1200AT close to wafer process line, process development and ramp are accelerated. Read More

Other Company News from
FEI Co.

January 22, 2008

FEI Opens China NanoPort