Company News

Epoxies Etc.

21 Starline Way, Cranston, RI, 02921, US

  • 401-946-5564

General Information:
Elaine Bellenoit
USA

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Latest New Product News from
Epoxies Etc.

Materials & Material Processing, Green & Clean

Polyurethane Potting Compound is environmentally friendly.

October 20, 2014

Intended for electronic applications with low toxicity requirements, 20-2121 Polyurethane is made from natural oil polyol, meets FDA food contact requirements, and does not contain TDI, MbOCA, or Mercury. Plant-based potting, casting, and encapsulating compound, exhibiting minimal shrinkage or exotherm, offers elastomeric properties that limit stress on electronics. Tensile strength is 2,000 psi, tear strength is 119 PLI, mixed viscosity is 2,000 cps at 25°C, and gel time is 20 min at 60°C. Read More

Paints & Coatings, Chemical Processing & Waste Management, Green & Clean

Casting Resin is suitable for cable and harness assemblies.

March 12, 2013

Offering alternative to injection molds when encapsulating electronics, 20-2180 Polyurethane Potting and Encapsulating Resin can be poured into metal or silicone mold to create assembly with firm seal around jacketed wires. Rubber-like texture makes it suited for outdoor applications. Resistant to moisture and chemicals, stable and vibration-resistant product has 2:1 mix ratio, self-levels around components, and will not crack. Base is natural oil polyol. Read More

Materials & Material Processing

Silicone Compound helps make strong, durable molds.

December 26, 2012

Formulated without solvents or other toxic materials, 70-1300 RTV Silicone Elastomer does not shrink during cure, is resistant to chemicals, and cannot be regulated or considered hazardous for transportation. Clear color helps user increase mold production precision, while strength and chemical resistance lend to molds that allow for increased number of pours. Read More

Materials & Material Processing

Silicone Elastomer suits potting and encapsulating.

November 26, 2012

Providing protection in extreme environmental conditions, 2-component 20-1634 is suitable for potting electronic assemblies and other industrial applications requiring low weight, flexibility, heat resistance, and optimized electrical insulation properties. Product cures in deep sections, eliminating need for multiple pours. Formulated without solvents or other toxic materials, compound is safe to handle and not hazardous for transportation. Read More

Materials & Material Processing

Thermally Conductive Silicone protects electronics.

October 18, 2012

With 1:1 mix ratio, flexible 50-1952 cushions electronics from vibration and impact, and is specially formulated for quick thermal transfer away from heat generating electronic devices. Non-corrosive silicone potting and encapsulating compound is made without use of harsh solvents or other toxic materials and is not hazardous to ship. Operating from -65 to +235°C, low-exotherm product eliminates need for multiple pours. Read More

Materials & Material Processing, Chemical Processing & Waste Management

Silicone Compound is designed for potting and encapsulating.

September 28, 2012

Free of any flammable or toxic solvents, 2-part 50-1225 has -65 to +210°C service temperature, will cure in deep sections, and will not support or promote flame. Compound is designed for electronic packages that require flow around components, thermal conductivity, and ability to sustain environmental extremes. While material flexibility will cushion electronics through aging and thermal cycling, shrinkage rate during cure will not stress components. Read More

Chemical Processing & Waste Management, Paints & Coatings, Materials & Material Processing

Potting Compound is quick, convenient and easy to use.

August 22, 2012

Used for potting and encapsulating, 20-2028 lightweight (11 lb/ft³) closed cell liquid urethane foaming resin system has 1:1 mix ratio and 10 min demolding time. This potting foam does not utilize MOCA or TDI, promoting safe use, while low density facilitates repairs if mistakes are made first time around. Resistant to chemical solvents, moisture, thermal shock, and impact, product is formulated for accelerated curing and exhibits electrical insulation properties. Read More

Adhesives & Sealants

One-Component Epoxy maintains properties over temperature range.

August 14, 2012

Able to withstand stretching, impact, and heating/cooling, 50-3122 is formulated to maintain optimal peel and shear strength over -60 to +205°C range. This 100% solids system, in addition to offering electrical insulation, is resistant to vibration, stress fatigue cracking, and chemicals. Product does not require any mixing and cures in 5 min to 2 hr depending on cure temperature. Areas of use include electronic, electrical, aerospace, automotive, and industrial applications. Read More

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