Company News

Epoxies Etc.

21 Starline Way, Cranston, RI, 02921, US

  • 401-946-5564
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Latest New Product News from
Epoxies Etc.

Adhesives & Sealants

Fast Cure Adhesives suit cartridge dispensing.

February 4, 2015

Suitable for use with TriggerBond® dispensing guns, TriggerBond Epoxies offer shear strength up to 1,500 psi and notched Izod impact of 2.7 ft-lb/in. Adhesive's 2 components are packaged into cartridges, which fit in dual-barrel dispensing gun. Because cartridges contain precise quantities of hardener and resin, TriggerBond produces correct mix ratio every time user squeezes trigger. Three types are available with setting times of 5, 20, and 46 minutes, respectively. Read More

Green & Clean, Materials & Material Processing

Polyurethane Potting Compound is environmentally friendly.

October 20, 2014

Intended for electronic applications with low toxicity requirements, 20-2121 Polyurethane is made from natural oil polyol, meets FDA food contact requirements, and does not contain TDI, MbOCA, or Mercury. Plant-based potting, casting, and encapsulating compound, exhibiting minimal shrinkage or exotherm, offers elastomeric properties that limit stress on electronics. Tensile strength is 2,000 psi, tear strength is 119 PLI, mixed viscosity is 2,000 cps at 25°C, and gel time is 20 min at 60°C. Read More

Paints & Coatings, Chemical Processing & Waste Management, Green & Clean

Casting Resin is suitable for cable and harness assemblies.

March 12, 2013

Offering alternative to injection molds when encapsulating electronics, 20-2180 Polyurethane Potting and Encapsulating Resin can be poured into metal or silicone mold to create assembly with firm seal around jacketed wires. Rubber-like texture makes it suited for outdoor applications. Resistant to moisture and chemicals, stable and vibration-resistant product has 2:1 mix ratio, self-levels around components, and will not crack. Base is natural oil polyol. Read More

Materials & Material Processing

Silicone Compound helps make strong, durable molds.

December 26, 2012

Formulated without solvents or other toxic materials, 70-1300 RTV Silicone Elastomer does not shrink during cure, is resistant to chemicals, and cannot be regulated or considered hazardous for transportation. Clear color helps user increase mold production precision, while strength and chemical resistance lend to molds that allow for increased number of pours. Read More

Materials & Material Processing

Silicone Elastomer suits potting and encapsulating.

November 26, 2012

Providing protection in extreme environmental conditions, 2-component 20-1634 is suitable for potting electronic assemblies and other industrial applications requiring low weight, flexibility, heat resistance, and optimized electrical insulation properties. Product cures in deep sections, eliminating need for multiple pours. Formulated without solvents or other toxic materials, compound is safe to handle and not hazardous for transportation. Read More

Materials & Material Processing

Thermally Conductive Silicone protects electronics.

October 18, 2012

With 1:1 mix ratio, flexible 50-1952 cushions electronics from vibration and impact, and is specially formulated for quick thermal transfer away from heat generating electronic devices. Non-corrosive silicone potting and encapsulating compound is made without use of harsh solvents or other toxic materials and is not hazardous to ship. Operating from -65 to +235°C, low-exotherm product eliminates need for multiple pours. Read More

Chemical Processing & Waste Management, Materials & Material Processing

Silicone Compound is designed for potting and encapsulating.

September 28, 2012

Free of any flammable or toxic solvents, 2-part 50-1225 has -65 to +210°C service temperature, will cure in deep sections, and will not support or promote flame. Compound is designed for electronic packages that require flow around components, thermal conductivity, and ability to sustain environmental extremes. While material flexibility will cushion electronics through aging and thermal cycling, shrinkage rate during cure will not stress components. Read More

Paints & Coatings, Chemical Processing & Waste Management, Materials & Material Processing

Potting Compound is quick, convenient and easy to use.

August 22, 2012

Used for potting and encapsulating, 20-2028 lightweight (11 lb/ft³) closed cell liquid urethane foaming resin system has 1:1 mix ratio and 10 min demolding time. This potting foam does not utilize MOCA or TDI, promoting safe use, while low density facilitates repairs if mistakes are made first time around. Resistant to chemical solvents, moisture, thermal shock, and impact, product is formulated for accelerated curing and exhibits electrical insulation properties. Read More

Adhesives & Sealants

One-Component Epoxy maintains properties over temperature range.

August 14, 2012

Able to withstand stretching, impact, and heating/cooling, 50-3122 is formulated to maintain optimal peel and shear strength over -60 to +205°C range. This 100% solids system, in addition to offering electrical insulation, is resistant to vibration, stress fatigue cracking, and chemicals. Product does not require any mixing and cures in 5 min to 2 hr depending on cure temperature. Areas of use include electronic, electrical, aerospace, automotive, and industrial applications. Read More

Adhesives & Sealants

Epoxy Adhesive withstands exposure to UV rays.

March 30, 2012

Virtually invisible, type 10-3713, 2-component epoxy adhesive dries clear so excess material is barely noticeable. Formulated with agents that guard against UV rays, non-yellowing epoxy has low viscosity that allows for good coverage of all surfaces, and bonds to most substrates. It penetrates substrates to form bonds at room temperature or with mild heat. Read More

Adhesives & Sealants

Low-Viscosity Epoxy Adhesives offer fast set times.

March 1, 2012

Setting in 5, 20, and 46 min, respectively, Quick-Set Trio (10-3005, 10-3020, and 10-3046) cure at room temperature. Clear and solvent-free products are suited for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, rubbers, plastics, and more. Offered in TriggerBond dual barrel cartridge system or bulk packaging, products meet UL94 HB requirements; resist effects of water, chemicals, impact, and thermal shock; and have 1:1 mix ratio. Read More

Materials & Material Processing

Flame Retardant Potting Compound stays flexible in cold temps.

January 2, 2012

Designed to meet UL 94 V-0 flammability standard, 20-2362 FR remains soft in very low temperatures down to -72°C. Polyurethane potting and encapsulating compound is suited for cushioning and protecting sensitive electronic components since it provides vibration resistance and does not stress components. Compliant with REACH and RoHS, product is also moisture-resistant and will not damage components during cure. Read More

Adhesives & Sealants

Polyurethane Adhesives bond plastic and metal substrates.

August 1, 2011

Featuring flexible formulation that allows bonding to substrates with different coefficients of thermal expansion, High Viscosity 10-2055 and 10-2055 HV Polyurethane Adhesives produce semi-flexible bond with resulting durometer of 55 Shore D, while 10-2080 and 10-2080 HV produce semi-rigid bond with durometer of 80 Shore D. Iso and Poloyol components are low in viscosity for handling and only increase in viscosity for flow control after they are mixed together. Read More

Materials & Material Processing

Epoxy Potting Compound meets NASA's outgassing requirements.

May 31, 2011

Suited for casting, potting, and encapsulating, 20-3652 adheres to metals, ceramics, and plastics. Dielectric grade epoxy features Shore D hardness of 88, tensile strength of 9,000 psi, flexural strength of 15,000 psi, and operating temperature range of -65 to +160°C. When cured with Catalyst No. 190 and Catalyst No. 105, resin system meets NASA's outgassing requirements. Read More

Paints & Coatings, Chemical Processing & Waste Management, Green & Clean, Materials & Material Processing

Polyurethane Potting Compound allows user to adjust hardness.

December 1, 2010

Designed to cure at room temperature, 2-component 20-2125 Potting, Encapsulating, and Casting Resin cushions and protects sensitive electronic components while imparting very little stress on components during cure or thermal cycling. Hardness can be modified by changing mix ratio of Polyol and Isocyanate. Moisture-resistant with low toxicity, product can be used in wet environments and minimizes employee exposure to dangerous chemicals. Read More

Adhesives & Sealants, Green & Clean, Materials & Material Processing

Potting and Encapsulating Compound is FDA compliant.

November 19, 2010

Formulated to cushion and protect sensitive electronic circuits, components, and devices, Green Potting and Encapsulating Compound is moisture-resistant and imparts very little stress on components during cure or thermal cycling. Raw materials are listed under different FDA CFR 21 Sections, allowing use in applications where there is direct food contact. Base Natural Oil Polyol is obtained directly from plant source without chemical modifications. Read More

Adhesives & Sealants, Paints & Coatings, Chemical Processing & Waste Management, Materials & Material Processing

Polyurethane Potting Compound protects electronic components.

October 20, 2010

Potting, encapsulating, and casting resin 20-2121 consists of 2-component, room temperature curing system that will cushion sensitive electronic components. With toxicity level that reduces employee exposure to dangerous chemicals, moisture-resistant compound imparts minimal stress on components during cure or thermal cycling. Characteristics include 2,000 psi tensile strength, 80 Shore A Hardness, and respective viscosities of 14,000 and 800 cps @ 25°C for Polyol and Isocyanate. Read More

Chemical Processing & Waste Management

Urethane Casting Resin is suitable for prototyping applications.

March 22, 2010

Providing ABS-like feel and appearance, Mercury-free Type 70-2170 urethane casting resin does not contain TDI or MbOCA, and cures rapidly at room temperature. Low shrinkage and low viscosity properties allow for production of dimensionally stable precision parts. Resin is designed for product development and low volume manufacturing. Read More

Adhesives & Sealants, Materials & Material Processing

Potting and Encapsulating Compound has water clear formulation.

February 1, 2010

Type 20-2621 Polyurethane is crystal clear electronic grade potting and encapsulating compound that will not yellow in outdoor applications. Formulated for applications that require electrical insulation, optimum clarity, environmental resistance, and flexibility, this polyurethane system is semi-flexible (shore A85) and will not place excess stress on electronic components during thermal cycling. Read More

Adhesives & Sealants, Materials & Material Processing

Epoxy Potting Compound has low viscosity formulation.

June 10, 2009

Formulated for electronic potting and encapsulating applications, Type 20-3060 Epoxy flows quickly in and around electronic components, self levels, releases air bubbles, and provides smooth, glasslike finish. It offers electrical insulation, chemical resistance, and protection from environment. Potting compound is available in quarts, gallons, and 5 gal pails. Read More

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Epoxies Etc.