Micrometrics, Inc.

Electronic Components & Devices

PIN Diodes come in MELF package.

Housed in non-magnetic, metal electrode leadless faced package, PIN Diodes are designed for switching and attenuator applications from HF-UHF frequencies. Units feature resistance of 0.3-1.0 W at 100 MHz and 100 mA, and capacitance range of 0.5-2.0 pf at 1 MHz and 100 V. Manufactured using glassing process, which provides full-face bonding on anode and cathode, hermetically sealed devices come in...

Read More »
Electronic Components & Devices

PIN Diodes come in MELF package.

Housed in non-magnetic, metal electrode leadless faced package, PIN Diodes are designed for switching and attenuator applications from HF-UHF frequencies. Units feature resistance of 0.3-1.0 W at 100 MHz and 100 mA, and capacitance range of 0.5-2.0 pf at 1 MHz and 100 V. Manufactured using glassing process, which provides full-face bonding on anode and cathode, hermetically sealed devices come in...

Read More »
Schottky Diode is offered in ring quad packaging.
Electronic Components & Devices

Schottky Diode is offered in ring quad packaging.

Low, medium, and high barrier Schottky ring quads are available in CS-17 package measuring 0.060 x 0.060 x 0.025 in. tall with 4 bonding pads on bottom. Manufactured using epitaxial process to ensure control over carrier concentration and thickness, products have closely matched junction capacitance and forward voltage. Monolithic design and square, ceramic, SMT package with epoxy top make units...

Read More »
Schottky Diode is offered in ring quad packaging.
Electronic Components & Devices

Schottky Diode is offered in ring quad packaging.

Low, medium, and high barrier Schottky ring quads are available in CS-17 package measuring 0.060 x 0.060 x 0.025 in. tall with 4 bonding pads on bottom. Manufactured using epitaxial process to ensure control over carrier concentration and thickness, products have closely matched junction capacitance and forward voltage. Monolithic design and square, ceramic, SMT package with epoxy top make units...

Read More »
People in the News

Joseph Bukowski Joins Aeroflex/MicroMetrics

October 31 , 2007-Londonderry, NH-Aeroflex/MicroMetrics, a manufacturer of RF/Microwave Diodes and passive Semiconductor Devices for commercial and military communications, is pleased to announce that Joseph G. Bukowski has recently joined its Engineering team in its MicroMetrics Semiconductor Division, in Londonderry, NH, as a Senior Applications Engineer. Joe brings over 30 years of practical...

Read More »
People in the News

Joseph Bukowski Joins Aeroflex/MicroMetrics

October 31 , 2007-Londonderry, NH-Aeroflex/MicroMetrics, a manufacturer of RF/Microwave Diodes and passive Semiconductor Devices for commercial and military communications, is pleased to announce that Joseph G. Bukowski has recently joined its Engineering team in its MicroMetrics Semiconductor Division, in Londonderry, NH, as a Senior Applications Engineer. Joe brings over 30 years of practical...

Read More »
Electronic Components & Devices

PIN Diodes come in MELF package.

Housed in non-magnetic, metal electrode leadless faced package, PIN Diodes are designed for switching and attenuator applications from HF-UHF frequencies. Units feature resistance of 0.3-1.0 W at 100 MHz and 100 mA, and capacitance range of 0.5-2.0 pf at 1 MHz and 100 V. Manufactured using glassing process, which provides full-face bonding on anode and cathode, hermetically sealed devices come in...

Read More »
Electronic Components & Devices

PIN Diodes come in MELF package.

Housed in non-magnetic, metal electrode leadless faced package, PIN Diodes are designed for switching and attenuator applications from HF-UHF frequencies. Units feature resistance of 0.3-1.0 W at 100 MHz and 100 mA, and capacitance range of 0.5-2.0 pf at 1 MHz and 100 V. Manufactured using glassing process, which provides full-face bonding on anode and cathode, hermetically sealed devices come in...

Read More »
Schottky Diode is offered in ring quad packaging.
Electronic Components & Devices

Schottky Diode is offered in ring quad packaging.

Low, medium, and high barrier Schottky ring quads are available in CS-17 package measuring 0.060 x 0.060 x 0.025 in. tall with 4 bonding pads on bottom. Manufactured using epitaxial process to ensure control over carrier concentration and thickness, products have closely matched junction capacitance and forward voltage. Monolithic design and square, ceramic, SMT package with epoxy top make units...

Read More »
Schottky Diode is offered in ring quad packaging.
Electronic Components & Devices

Schottky Diode is offered in ring quad packaging.

Low, medium, and high barrier Schottky ring quads are available in CS-17 package measuring 0.060 x 0.060 x 0.025 in. tall with 4 bonding pads on bottom. Manufactured using epitaxial process to ensure control over carrier concentration and thickness, products have closely matched junction capacitance and forward voltage. Monolithic design and square, ceramic, SMT package with epoxy top make units...

Read More »

All Topics