Advanced Thermal Solutions, Inc.
Norwood, MA 02062
Heat Sinks cool brick DC/DC converters and power modules.
Able to reduce junction temperatures by >20%, maxiFLOW™ heat sinks enable full, half, quarter, and one-eighth brick DC/DC converters to be used at maximum operating temperature for optimum performance on PCBs. Spread fin heat sink design maximizes cooling performance in low-airflow environments by reducing pressure drop on passing air and providingÃ- increased surface area for heat...
Read More »Instrument Measures Heat and Hydraulic Performance of Cold Plates
Norwood, MA, – The iFLOW-200 system from Advanced Thermal Solutions assesses the thermal and hydraulic characteristics of cold plates in electronics cooling. It measures the coolant’s temperature at inlet and outlet, fluid flow rate and pressure drop, and surface temperature. The iFLOW-200 can be used to simulate a wide range of conditions to optimize a cold plate’s performance before it is...
Read More »Thermal Analysis System records temp, velocity, and pressure.
Used to profile heat sinks, components, and PCBs, iQ-200(TM) simultaneously measures temperatures for solid materials and surrounding air in addition to tracking air velocity and air pressure at multiple points. Laboratory instrument accommodates inputs from up to 12 J-type thermocouples, 16 air temperature/velocity sensors, and 4 DP sensors. USB interface allows PC-based data management,...
Read More »ATS' maxiGRIP(TM) Heat Sink Attachment System Passes Tough Military Shock Testing
NORWOOD, Mass, October 31, 2006 - Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today announced that maxiGRIP(TM), the company's patent-pending heat sink attachment system for mounting heat sinks to flip chips, BGAs, and other hot on the PCB components, has passed Mil-STD-810 Shock Testing and Unpackaged Drop Testing. Shock and...
Read More »Heat Sinks cool Freescale MPC8641D dual-core processors.
Featuring integral fan that blows air through linear field of flat aluminum fins, Juneau ATS-405 Active Heat Sink delivers thermal resistance of 0.51Ã-
Read More »Heat Sinks cool condensed electronic packages.
Fabricated from lightweight extruded aluminum, maxiFLOW(TM) heat sinks are utilized for cooling BGAs and hot components inside electronic systems. Featuring low profile spread fin arrays to enable convectional air cooling within restricted/low air flow conditions, they are available in lengths and widths ranging from 10 x 10 mm to 60 x 60 mm, and heights starting at 2 mm.
Read More »Candlestick Sensor measures temperature and air velocity.
Designed to characterize thermal conditions in electronic systems, Model MS 1000-CS-WC provides temperature measurements from -30 to +150Ã-
Read More »Board provides air flow and temperature measurement.
Compact ISD-232(TM) board directly and simultaneously assesses air flow from 0-50 m/sec and temperatures from -30 to +150Ã-
Read More »Clip-On System enables safe heat sink attachment.
Designed for mounting heat sinks to flip chips, BGAs, and other hot PCB components, MaxiGRIP(TM) attachment system utilizes plastic frame clip that snaps securely around component perimeter. Stainless steel spring clip runs though heat sink's fin field and fastens securely to plastic frame, mounting sink securely to component with steady, even pressure. System provides reliable attachment on...
Read More »Programmable Controller automates wind tunnel testing
Suited for laboratory wind tunnels, automatic Model WTC-100(TM) employs 2 independent sensors that simultaneously measure air velocity and temperature. Unit regulates air velocities from 60-10,000 fpm, depending on capabilities of wind tunnel's fan tray. Feedback from sensors maintains airflow in test domain to within Ã-
Read More »Heat Sinks cool brick DC/DC converters and power modules.
Able to reduce junction temperatures by >20%, maxiFLOW™ heat sinks enable full, half, quarter, and one-eighth brick DC/DC converters to be used at maximum operating temperature for optimum performance on PCBs. Spread fin heat sink design maximizes cooling performance in low-airflow environments by reducing pressure drop on passing air and providingÃ- increased surface area for heat...
Read More »ATS and Ismosys Sign Pan-European Sales Representative Agreement
Norwood, MA – Advanced Thermal Solutions, Inc. (ATS) the premiere innovator and solutions provider for the thermal management of electronics is now represented by the preeminent European sales resource for leading edge semiconductors and technologies. Ismosys (Integrated Sales Marketing and Operations System) will represent all ATS products across Continental Europe, including liquid cooling,...
Read More »Instrument Measures Heat and Hydraulic Performance of Cold Plates
Norwood, MA, – The iFLOW-200 system from Advanced Thermal Solutions assesses the thermal and hydraulic characteristics of cold plates in electronics cooling. It measures the coolant’s temperature at inlet and outlet, fluid flow rate and pressure drop, and surface temperature. The iFLOW-200 can be used to simulate a wide range of conditions to optimize a cold plate’s performance before it is...
Read More »Thermal Analysis System records temp, velocity, and pressure.
Used to profile heat sinks, components, and PCBs, iQ-200(TM) simultaneously measures temperatures for solid materials and surrounding air in addition to tracking air velocity and air pressure at multiple points. Laboratory instrument accommodates inputs from up to 12 J-type thermocouples, 16 air temperature/velocity sensors, and 4 DP sensors. USB interface allows PC-based data management,...
Read More »Advanced Thermal Solution's Dr. Kaveh Azar to Keynote the 8th Annual International Business & Technology Summit for Thermal Management of Electronics
Norwood, MA, July 1, 2008 - Dr. Kaveh Azar, president and CEO of Advanced Thermal Solutions Inc. (ATS) will be presenting the keynote address at the 8th Annual International Business & Technology Summit for Thermal Management of Electronics, August 20-22, 2008, at the Crowne Plaza Hotel in Natick, Massachusetts. Dr. Azar's presentation, Challenges in Thermal Management of Electronics for the Next...
Read More »New Thermal Management Webinar Series for 2008
Advanced Thermal Solutions, Inc. (ATS) is presenting a year-long series of thermal management Webinars for all engineers, designers and program managers with an interest in electronics cooling. The free, online tutorials will provide practical information on critical areas of thermal management to help optimize individual cooling solutions. Each of the approximately one-hour tutorials will...
Read More »New Catalog Features 380+ Heat Sinks Available in 24 Hours
Norwood, MA, August 27, 2007 - Over 380 heat sinks, available for overnight delivery exclusively from Digi-Key, are included in Advanced Thermal Solutions, Inc's (ATS) new Heat Sink Catalog. Each of the heat sinks within the catalog is listed with part numbers, dimensions, thermal performance data and pricing. The catalog includes a wide range of ATS maxiFLOW(TM) heat sinks which feature a low...
Read More »Digi-Key and Advanced Thermal Solutions, Inc. Sign Worldwide Distribution Agreement
Company Boosts Thermal Management Products Offering Thief River Falls, Minn. and Norwood, Mass. - July 17, 2007 - Electronic components distributor Digi-Key Corporation and Advanced Thermal Solutions, Inc. (ATS) announced today the signing of a global distribution agreement. ATS is a leading engineering and manufacturing company focused on the thermal management of electronics. Its product...
Read More »ATS' maxiGRIP(TM) Heat Sink Attachment System Passes Tough Military Shock Testing
NORWOOD, Mass, October 31, 2006 - Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and mechanical packaging solutions provider, today announced that maxiGRIP(TM), the company's patent-pending heat sink attachment system for mounting heat sinks to flip chips, BGAs, and other hot on the PCB components, has passed Mil-STD-810 Shock Testing and Unpackaged Drop Testing. Shock and...
Read More »ATS to Present Thermal Management Tutorial Series
NORWOOD, Mass, November 14, 2006 - Advanced Thermal Solutions, Inc. (ATS), a leading thermal management and packaging solutions provider, today announced the schedule for its 2007 Thermal Management Tutorial Series: eight courses developed to increase an engineer's awareness of thermal science and design issues. The tutorials will provide a working knowledge of cooling solutions available today...
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